Sunday, August 28, 2016
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Libra Industries: Factors to Consider for a Successful DfA
Publication Date: 8/19/2016

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, today announced that Scott Fillebrown, CTO, will present during the PCB West Conference, scheduled to take place September 13-16, 2016 at the Santa Clara Convention Center in CA. Fillebrown will present “Manufacturability through Design” on Tuesday, September 13 during the morning session.
LPKF Makes Up A Lot of Ground in the Second Quarter
Publication Date: 8/18/2016

TUALATIN, OR - Business growth at LPKF Laser & Electronics AG accelerated considerably in the second quarter 2016. Sales grew by almost 20% compared to the same quarter of the previous year, EBIT results were positive at EUR 0.7 million. However, due to a very weak first quarter, sales and EBIT results after six months stayed below the previous year’s figures. Sales in the first half year reached almost EUR 40 million, EBIT stayed negative at EUR -3.7 million.
Würth Elektronik eiSos acquires AMBER wireless GmbH
Publication Date: 8/17/2016

WALDENBURG, GERMANY - AMBER wireless GmbH, manufacturer of wireless connectivity solutions, is part of Würth Elektronik eiSos GmbH & Co. KG now. With the merger the owner-run wireless specialist founded in 1998 lays the foundation for its further growth and the globalization of its activities. Through the acquisition, Würth Elektronik eiSos considerably expands its range in growth fields, such as Internet of Things, Industry 4.0 and Smart Metering.
Tech-Etch: Photo Etching Flat Parts From Polyimide Film
Publication Date: 8/17/2016

PLYMOUTH, MA - Tech-Etch photo etches polyimide film into flat parts including non-conductive washers, screens, gaskets, insulation layers and liners, as well as haptics for intraocular lenses used in cataract surgery. Polyimide has material characteristics that make it attractive for this medical procedure, in addition to providing the advantages of a 3-piece IOL.
Fiber Optic Center, Inc. announces the Hernon® Tuffbond® 302 epoxy adhesive packaged by ÅngströmBond
Publication Date: 8/17/2016

NEW BEDFORD, MA - Fiber Optic Center, Inc., (FOC), an international leading distributor specializing in helping their customers make the best cable assemblies in the world, announces the addition of Hernon® Tuffbond® 302 epoxy adhesive, packaged by ÅngströmBond, to their extensive epoxy line.

Tuffbond® 302 consistently performs under temperature cycling from -54C to 85C. It is a high viscosity material that flows well and cures fast.
Laser Design Demonstrates Unique CyberGage360 3D Scanning Inspection System at 2016 International Manufacturing Technology Show
Publication Date: 8/17/2016

MINNEAPOLIS, MN - Laser Design, Inc., a fully-owned subsidiary of CyberOptics (NASDAQ: CYBE), and premier provider of ultra-precise 3D scanning systems and services, today announced it will showcase its CyberGage360™, a metrology-grade, ultra fast, one-button automated 3D scanning and inspection system at the 2016 International Manufacturing Technology Show (IMTS), America’s largest manufacturing show, September 12-17, at McCormick Place, Chicago.
Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2016
Publication Date: 8/17/2016

TERRELL, TX - Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at SMTA International 2016 Conference and Exhibition, exhibiting September 27-28, 2016 in booth #818 at the Donald Stephens Convention Center in Rosemont, Illinois.
Mouser Electronics Names Graham Maggs Vice President Marketing EMEA
Publication Date: 8/17/2016

MANSFIELD, TX - Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, today announced the appointment of Graham Maggs to Vice President of Marketing–EMEA for Mouser.

Maggs, an industry veteran with over 28 years of experience in European and global roles, joined the Mouser team in April 2010 and has been instrumental in building Mouser’s EMEA marketing team that spans supplier marketing, web marketing, advertising, public relations, media and events.
Acculogic: Innovative Test Equipment at IEEE AUTOTESTCON
Publication Date: 8/16/2016

MARKHAM, ON - Acculogic Inc., a global leader in electronic production test solutions, announces that it will exhibit in Booth #1110 at IEEE AUTOTESTCON, scheduled to take place Sept. 12-15, 2016 in Anaheim, Ca. Company representatives will highlight Acculogic’s powerful suite of PC-based hardware and software tools specially designed for testing of electronic devices, boards and systems using the IEEE1149.1 and IEEE1149.6 standards.
Cogiscan Will Exhibit at SMTAI and Discuss Track, Trace & Control: The Enabling Technology for Industry 4.0
Publication Date: 8/16/2016

BROMONT, CANADA - Cogiscan Inc., the leading track, trace and control solutions provider for the electronics manufacturing industry, today announced plans to exhibit in Booth #230 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The Cogiscan team will discuss the TTC platform, the enabling technology for Industry 4.0.
SMTA International Harsh Environments Symposium Keynote Speaker Announced
Publication Date: 8/16/2016

MINNEAPOLIS, MN - SMTA announced the keynote speaker for the 2016 Harsh Environments Symposium, part of the SMTA International technical conference September 25 - 29, 2016 in Rosemont, Illinois.

Harsh Environment Symposium Keynote Lunch
During the Harsh Environment Symposium Keynote Lunch, Dwight Howard at Delphi, will present “Advances in Autonomous Driving and V2X Technologies.”
DDM Novastar Delivers Custom Pick-and-Place Machine
Publication Date: 8/16/2016

KING OF PRUSSIA, PA - DDM Novastar, a U.S. manufacturer of SMT and PCB assembly equipment, shipped a custom pick-and-place machine to a large multi-national laser cutting tool manufacturer. The customer was looking for a custom machine to assemble a set of micro lasers into a final head assembly.
CyberOptics Showcases Large Particle Sensing Functionality in Next-Generation Airborne Particle Sensors at SEMICON Taiwan
Publication Date: 8/16/2016

MINNEAPOLIS, MN - CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will showcase its next-generation Airborne Particle Sensor technology (APS2), that incorporates large particle sensing capability. Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) can measure both small and large particles.
Alpha Launches Web Search Tool for GHS Safety Data Sheets
Publication Date: 8/15/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce it has recently launched a new search tool on its website that allows users to search for GHS Safety Data Sheets (SDS) on all ALPHA® Products that are commercially available world-wide.
Nordson ASYMTEK Presents “Advanced Dispense Solutions for Hand-held Devices” at CMMF China
Publication Date: 8/15/2016

CARLSBAD, CA - Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) on August 25, 2016. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies in booth #1H20 at NEPCON South China, August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
New Economy Vapor Phase Soldering Machine from IBL Technologies
Publication Date: 8/12/2016

BURNSVILLE, MN - IBL Technologies, LLC today announced the launch of its new SV540 Economy Vapor Phase Soldering Machine for individual and series production. The low-cost system features a maximum board size of 540 x 360 x 80 mm, fits through doorways for small production areas, and has built-in profiling capabilities.
U.S.Tech Publisher's Choice August 2016
Publication Date: 8/12/2016

This month, our publisher's choice article is a piece by Lior Yosef of Mechanical Devices, Ltd., on the subject of IC temperature testing and the pros and cons of using thermal stream systems vs. direct thermal head systems. Unlike temperature test chambers, these systems test a single device at a time and are not meant to operate continuously for long periods of days or weeks.
SEICA: Preview for Nepcon South China - Shenzhen, Booth 1A52 - August 30- September 01, 2016
Publication Date: 8/12/2016

STRAMBINO, ITALY - The theme for Seica at Nepcon South China this year will be the Pilot line and the traditional Compact line of bed of nails and functional testers integrated with Industry 4.0 concept. The Compact and Pilot lines have all of the capabilities needed for implementation in any Factory 4.0 scenario, providing the possibility to plug in any proprietary or third party information system to achieve the desired goals.
Würth Elektronik eiSos is the host of the Wireless Power Consortium
Publication Date: 8/11/2016

WALDENBURG, GERMANY - The Wireless Power Consortium is the leading standardisation body for wireless energy transfer. Würth Elektronik eiSos is organising the European Meeting of the WPC from 22 to 25 August at the Hotel Hilton Munich City, and will play a key role in the "Wireless Power Trade Show and Seminar" on August 25.
JTAG Technologies: Press Preview for SMTA
Publication Date: 8/11/2016

EINDHOVEN, THE NETHERLANDS - JTAG Technologies return to SMTA in 2016 to premiere several new hardware products for PCB testing and In-System [Device] Programming.

As one of the World’s leading supplier of JTAG-powered testers and device programming tools JTAG Technologies will be displaying much of its current hardware range and will also offer live software demonstrations.
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