Sunday, December 4, 2016
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Jaguar Partners with MIRTEC to Maintain Demanding Quality Standards
Publication Date: 11/21/2016

OXFORD, CT - MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that Jaguar de Mexico, has selected MIRTEC’s award-winning MV-6 OMNI 3D AOI system to maximize production efficiency and maintain demanding quality standards.
Mycronic Makes Strategic Acquisition
Publication Date: 11/21/2016

TAUBY, SWEDEN - Mycronic AB (publ), acquires 100 percent of Automation Engineering, Inc. (AEI) in the USA. The purchase price amounts to USD 35 million (approximately SEK 321 million) on a debt free basis and is financed with Mycronic’s own funds. Under certain conditions, based on parameters such as growth and earnings, an earn-out at a maximum amount of USD 27 million (approximately SEK 248 million) will be paid over two years.
Henkel Wins Best Paper Award at IPC India Conference
Publication Date: 11/18/2016

IRVINE, CA - With shrinking dimensions and increased function, the need for adaptable and effective thermal solutions to ensure electronics reliability is greater than ever before. This indisputable reality was at the fore during Henkel’s paper presentation during the recent IPC India Conference, which took place alongside Electronica/Productronica India 2016.
Simplimatic Designs De-traying Robotic System to Handle Fragile Glass Vials
Publication Date: 11/18/2016

FOREST, VA - Customers across the globe turn to Simplimatic Automation, a leader in material handling and automation equipment, for custom manufacturing solutions designed to simplify even the most challenging production needs.
FKN Systek: N200 Punch For Singulating Tab Routed Panels
Publication Date: 11/18/2016

MILLIS, MA - Available for under $4,000 from FKN Systek, The N200 is a low cost top down air operated punch for singulating tab routed PCB Panels one tab at a time. An upper and lower matching knife blade is used to pinch the tabs apart.
Panasonic Launches PanaCIM® Work-in-Process Software Solution
Publication Date: 11/18/2016

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America has launched PanaCIM Work-in-Process Solution, a deeper, more inclusive enterprise-level software innovation especially suited to tracking and controlling production, from Receiving to Shipping and every process in between.
 
Alpha Introduces New Lead-Free, No-Clean Solder Pastes
Publication Date: 11/18/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing its new lead-free, no clean solder paste technologies.

ALPHA® OM-353 is an ultra-fine feature print and air reflow-capable solder paste that is ideal for assemblies sensitive to component warpage or processes that require cleaning. It has been tested to give excellent printing performance down to 180µm pad size.
Scienscope Enters Exclusive Representative Agreement with Don Dupont Sales in Florida
Publication Date: 11/18/2016

CHINO, CA - Scienscope International, a complete inspection solutions provider, has appointed Don Dupont Sales as its exclusive manufacturers’ representative in Florida, U.S. Don Dupont Sales will represent Scienscope’s state-of-the-art X-ray cabinet systems.
Juerg Schuepbach Joins Essemtec AG as International Sales Manager
Publication Date: 11/18/2016

Glassboro, NJ - Essemtec AG, a Swiss manufacturer of production systems for electronic assembly (SMT) and packaging, appointed Juerg Schuepbach as International Sales Manager, effective November 1, 2016. He is responsible for strengthening the company’s market presence around the globe and expanding its business into both underserved geographies and complementary industrial segments.
Siemens to expand its digital industrial leadership with acquisition of Mentor Graphics
Publication Date: 11/17/2016

Siemens is further building its Vision 2020 to shape Digital Industrial Enterprise by expanding its unique portfolio for industrial software. Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for $37.25 per share in cash, which represents an enterprise value of $4.5 billion. The offer price represents a 21% premium to Mentor’s closing price on November 11, 2016, the last trading day prior to the announcement.
 
United Resin Corporation: Is Your Part Too Heavy?
Publication Date: 11/17/2016

ROYAL OAK, MI - United Resin Corporation has introduced Aero-Lite Resin and 205 Hardener, which is approximately 52% lighter than conventional potting and encapsulating epoxy systems. The material was formulated for those applications needing reduced weight as required in aerospace, automotive, and electronic applications.
ACI Technologies Conducts Hands-on Profiling and Solder Reflow Course with KIC Equipment
Publication Date: 11/17/2016

SAN DIEGO, CA - KIC today announced that ACI Technologies will host a “Profiling and Solder Reflow: Electronics Manufacturing Skills Training” from Nov. 21-22, 2016. The hands-on training will be conducted on KIC’s automated thermal process tools and systems, and will provide personnel with the knowledge and skills necessary to setup and operate a reflow process.
 
Excelsys Offers Industry’s Only Fanless Modular Power Supply With Medical Safety Approvals
Publication Date: 11/17/2016

CORK, IRELAND - The CoolX600 Series, the revolutionary new convection-cooled modular power supply from Excelsys Technologies – delivering a remarkable 600W of output power without using fan-assisted cooling – is the only fanless modular power supply on the market to meet medical safety approvals.
 
Matt Alpers joins VirTex as Business Development Manager, as the Team Continues to Grow from Strength to Strength
Publication Date: 11/17/2016

AUSTIN, TX - Mr. Alpers is a unique sales professional, who has built up a wealth of knowledge, experience and expertise, by enjoying a wide and varied career inside and outside the electronics industry. Throughout his profession, he has immersed himself in a range of roles from engineering to sales and production, for leading brands such as Yodle, Texas Instruments and Solectron.
 
Fujipoly?: Close Tolerance, Low Resistance Connector
Publication Date: 11/17/2016

CARTERET, NJ - The Zebra® Gold Series 8000C connector from Fujipoly® transfers both data and power between parallel components and circuit boards while exhibiting a remarkably low electrical resistance.
 
Technica USA builds Demo Lab for CBT/MLI Direct Imaging Equipment
Publication Date: 11/16/2016

SAN JOSE, CA - Technica USA announced today that they have completed their Direct Imaging Demo Lab for Chime Ball Technology (CBT), formerly known as Maskless Lithography (MLI). Technica is the master distributor in North America for CBT.
 
Alpha Chosen to Present During ITRI Asia Tin Summit in Shanghai
Publication Date: 11/16/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, was invited to present on consumption and new tin applications during ITRI Asia Tin Week, to be held from November 21st-24th in Shanghai, China.
NEO Tech Invests in New Capabilities and Expands Capacity at Otay Mesa Site
Publication Date: 11/16/2016

CHATSWORTH, CA – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it continues to invest in infrastructure, equipment, processes, and personnel at its Otay Mesa manufacturing site in Tijuana Mexico.
 
VJ Electronix Adds Wong’s Kong King Int’l (Holdings) LTD. (WKK Distribution Ltd.) to Its China Sales Channel
Publication Date: 11/16/2016

LITTLETON, MA - VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that it has appointed WKK as a Distribution Channel Partner in China.
IGBT Connector and Cable Assemblies from 2E SysCom
Publication Date: 11/16/2016

MILLIS, MA - The IGBT connectors and cable assemblies from 2E SysCom are designed specifically for attaching to the spade terminals on IGBT modules. These are used to connect the IGBT power modules to a printed circuit board. Suitable for 2 spade tabs 2.8x 0.5mm, the connectors are made with integrated automatic locking clips built in. Three grid spacings for tabs are available. (4.0, 4.7, and 6.0 mm).
 
 
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