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BTU Announces NextFlex in Silicon Valley as New Demo Site for the PYRAMAX Reflow Oven

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that it has installed a PYRAMAX™ 100A demo unit at Silicon Valley-based NextFlex.
 

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VJ Electronix’s New Summit 1800i as Popular as Its Predecessor

LITTLETON, MA - VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, reports success with the new Summit 1800i. Both long-term Summit customers and new, domestic and international, have placed orders for the enhanced model.

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Koh Young Europe Announces Record Growth in Q1 2017

SEOUL, KOREA- 3D inspection technology leader Koh Young Technology reports that its wholly- owned subsidiary, Koh Young Europe, recently closed a record-breaking First Quarter 2017 with a growth of 55% quarter-on-quarter.

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TopLine Exhibiting CCGA, Solder Joint Reliability Solutions at Space Tech Expo May 23-25 in Pasadena, California

Space Tech Expo Booth #8023

IRVINE, CA - TopLine Corporation will exhibit its innovative CCGA technology and solder joint reliability solutions in booth #8023 at the Space Tech Expo show May 23-25, 2017 in Pasadena, California, USA.
 

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Ironwood Electronics: 40 GHz Bandwidth Socket for BGA796 Package

Socket your BGA package using elastomer socket with superior electrical performance

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2032 socket is designed for a 12mmx12mm package size and operates at bandwidths up to 65 GHz with less than 1dB of insertion loss (GSSG configuration).
 

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Conecsus Presents SMT Metals Waste Recycling Solutions at SMTA Tijuana Technical Forum

TERRELL, TX - Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at the SMTA Tijuana Expo & Tech Forum on Thursday, June 8, 2017, at the Hotel Marriott Tijuana, Blvd. Agua Caliente 11553, Chapultepec Este., Tijuana BC 22420, Mexico.
 

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America II Signs Distribution Agreement with Lite-On Semiconductor

Global Distributor Expands Its Power Management Supply

ST. PETERSBURG, FL - America II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has signed a franchise distribution agreement with Lite-On Semiconductor Corp.
 

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Mentor Valor technologies connect advanced packaging vendors at world’s first live Industry 4.0 factory floor

WILSONVILLE, OR - Mentor, a Siemens business, today announced that its Valor® suite of software and hardware internet of things (IoT) technologies will be showcased in the Fraunhofer Institute’s advanced packaging assembly line at the SMT Hybrid Packaging event in Nuremberg, Germany, May 16-18, 2017 (Hall 5, Booth 434).
 

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SmtXtra will buy or trade your surplus SMT Feeder stock – SMT feeders are stocked and supplied from all the leading brands

MARYVILLE, TN - SmtXtra, a leading provider of SMT parts to electronics companies across the globe, will buy or trade your surplus SMT feeders.

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SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

SHANGHAI - SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

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Mycronic to exhibit new expanded product range at SMT Hybrid Packaging in Nuremberg

TAUBY, SWEDEN - Mycronic AB (publ) will demonstrate a wide array of new assembly solutions for the intelligent factory at SMT Hybrid Packaging in Nuremberg, Germany, May 16-18, 2017.

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TRI Receives 2017 EM Asia Innovation Award for TR5001 SII Series ICT

TAIPEI, TAIWAN - Test Research, Inc. (TRI), a leading test and inspection system provider for the SMT industry proudly announces that the company’s new generation ICT tester, TR5001 SII Series, received its third industry award, the 2017 EM Asia Innovation Award at a ceremony held during the 2017 NEPCON China show in Shanghai.

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Digi-Key: TDK SMD NTC Thermistors


SEMI Commends Senate Action to Fill Vacant Position of U.S. Trade Representative

WASHINGTON, D.C. – SEMI, the global industry association representing the electronics manufacturing supply chain, applauds the Senate action to fill the vacant cabinet-level position of the U.S. Trade Representative (USTR).

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New from FRAMOS: Fujinon’s Space-Saving, Wide-Angle Lens for Machine Vision

OTTAWA, CANADA - The new HF6XA-5M wide-angle lens from Fujinon is the latest addition to the HF-XA Machine Vision lens series. Applications requiring a short working distance and wide angle of view will particularly benefit from the MOD of 100 mm.
 

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STI Electronics to Showcase Specialized Contract Manufacturing Services at the 2017FLEX Conference

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, today announced plans to exhibit in Booth #3015 at the 2017FLEX Conference.

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Electronic Manufacturer Solves Complex PCB INSPECTION Challenges using Nikon X-RAY SYSTEM

LEUVEN, BELGIUM - Nikon Metrology has recently provided its high-precision, flat-panel based X-ray inspection system, XT V 160 to help Michigan company, Saline Lectronics inspect its most complex and challenging technical assemblies to the highest standard.
 

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Super Dry Totech Becomes Part of the ASYS Group

DRONTEN, NETHERLANDS - With the acquisition of majority stakes of Super Dry Totech on 04th May 2017 the ASYS Group brings in an additional manufacturer of dry storage systems.
 

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Sikama International Partners with Air Products

SANTA BARBARA, CA - Sikama International Inc. and Air Products and Chemicals Inc. have partnered to introduce the Electron Attachment Fluxless Reflow System to the electronics wafer level packaging segment.

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NEW VIDEO SERIES FROM SCOOP

Welcome to "SCOOP snacks", a series of very short videos that punch above their weight. Most of these videos are less than one minute long and offer executive insight into an important topic. If you've had time to read this, you've got time to watch the video...
 

 
 
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