Wednesday, March 29, 2017
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Publication Date: 3/28/2017

South Bend, IN – MicroScreen, LLC, a manufacturer of SMT stencils, thick film and large format screens, announces that the Company is certified by Eagle Registrations Inc. as a company that has developed, implemented and maintains a Quality Management System that conforms to the requirements of the ISO 9001:2015 international standard.  The scope of this certification includes the manufacture of Print Screens for Printed Circuit Board and Electronic Component Manufacturing, and Solder Paste Stencils for Circuit Board Assembly.

DIVSYS: Upcoming Advanced Selective Solder Classes
Publication Date: 3/27/2017

INDIANAPOLIS, IN - An advanced selective solder workshop will be held April 25-26, 2017 and also October 17-18, 2017 at DIVSYS International in Indianapolis. This in-depth 2-day workshop focuses on providing a detailed understanding of printed circuit board construction such as copper layers, barrel plating and porosity.
Libra Industries Enhances SPI Capabilities at Its Headquarters
Publication Date: 3/27/2017

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, today announced that is has completed the installation of a third Omron CDK VP5200-V Solder Paste Inspection system at its Mentor facility.
Alpha Assembly Solutions to Present at South East Asia Technical Training Conference on Electronics Assembly in Penang
Publication Date: 3/27/2017

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be presenting two technical papers “Flip-Chip LED Assembly – Processes and Challenges” and “LED Assembly on Flexible Substrates” at the South East Asia Technical Training Conference on Electronics Assembly Technologies 2017 which is hosted by SMTA from March 28-30, 2017 at Oliver Tree Hotel in Penang, Malaysia.
ASM Puts the Smart SMT Factory Within Reach
Publication Date: 3/27/2017

 Under its RSF Dome, ASM puts around-the-clock expert support within easy reach with its ASM Remote Smart Factory and associated smart tools.
MUNICH, GERMANY - At this year’s SMT Hybrid Packaging trade show (Nuremberg, May 16-18), ASM Assembly Systems is literally placing the Smart #1 SMT Factory at the center of attention at its booth. Under the RSF Dome at booth 4.309, the technology leader will demonstrate its new ASM Remote Smart Factory communication platform in combination with a highly flexible ASM SMT line.
Conecsus Presents SMT Metals Waste Recycling Solutions at SMTA Juarez
Publication Date: 3/27/2017

TERRELL, TX - Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at the SMTA Juarez Expo & Tech Forum, Thursday, April 6, 2017 from 9:00 AM to 6:00 PM MDT at the Hotel Real Inn Cd Juarez, Blvd. Teófilo Borunda # 6941, Partida Iglesia Cd Juarez 32617 Mexico.
Linear Technology LTM4636 | Digi-Key Daily
Publication Date: 3/27/2017

PI: 1000’s of Standard Piezo Transducers, Components, and Assemblies in New Piezoelectric Solutions Catalog
Publication Date: 3/27/2017

AUBURN, MA - Industry and research rely on piezoelectric solutions in high tech applications such as medical engineering, mechanical engineering, flow metering, automotive, aerospace, and semiconductor technology.
WACKER Opens International Training Center for Silicone Applications in Japan
Publication Date: 3/24/2017

 Practical training at the WACKER ACADEMY: participants at the Tsukuba training center put what they have learned into practice (photo: Wacker Chemie AG).
MUNICH and TSUKUBA - Wacker Chemie AG is strengthening its presence in Japan. Today, it has opened a new WACKER ACADEMY training center in Tsukuba, near Tokyo. The center primarily offers seminars on silicone products for the automotive, electronics, sealant and personal-care sectors.

Rehm presents new innovations at SNEC and NEPCON: Electronics and solar power manufacturers in Asia discover the latest concepts
Publication Date: 3/24/2017

BLAUBEUREN, GERMANY - This April, Rehm Thermal Systems will appear at two major international trade fairs in Asia – both in the world city of Shanghai. Visit us at SNEC from 19 to 21 April or NEPCON China from 25 to 27 April. We look forward to seeing you!
Lenthor Engineering Invests in Testing with CyberOptics Solder Paste Inspection System.
Publication Date: 3/23/2017

MILPITAS, CA - Lenthor Engineering, a California based designer, manufacturer and assembler of Rigid-Flex and Flex printed circuit boards, announces the recent installation of a new CyberOptics SE500 solder paste inspection system.
SMT Hybrid Packaging 2017: New Hall Occupation and Additional Joint Stand
Publication Date: 3/23/2017

NUREMBERG, GERMANY - At the SMT Hybrid Packaging visitors experience the diversity of assembly and interconnection technologies in a new setting at the well-established exhibition site in Nuremberg this year: The International Exhibition and Conference for System Integration in Micro Electronics will take place 16 – 18 May 2017 in the halls 4, 4A and 5.
Scienscope’s New Success Story in India
Publication Date: 3/22/2017

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced that their distributor in India – Kyoritsu Electric India Pvt. Ltd. – has successfully installed a Scienscope X-Scope 1800 X-Ray inspection system.
Indium Corporation Expert to Present at PCIM and SMT Hybrid Packaging 2017
Publication Date: 3/22/2017

CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16 in Nuremberg, Germany.
Wurth Electronics Smart Transformer Selector Now Interacts with STMicroelectronics’ eDesignSuite
Publication Date: 3/22/2017

WATERTOWN, SD - Wurth Elektronik is proud to announce the interaction of their Smart Transformer Selector (STS) with STMicroelectronics’ eDesignSuite.
TRI’s Smart Factory Solution Features at NEPCON China 2017
Publication Date: 3/22/2017

Taipei, Taiwan - Test Research, Inc. (TRI) will exhibit a comprehensive Smart Factory inspection solution, combining 3D SPI, 3D AOI, 3D AXI and multi-core ICT at NEPCON China 2017 exhibition, booth 1H38 in Hall 1 of Shanghai World Expo & Convention Center from April 25 ~ 27, 2017.
CUI, Inc.: 30 W and 40 W Desktop Power Adapters Comply with DoE Level VI and CoC Tier 2 Standards
Publication Date: 3/21/2017

TUALATIN, OR - CUI’s Power Group today announced the addition of 30 W and 40 W desktop ac-dc power adapters to its portfolio of DoE Level VI and CoC Tier 2 compliant external power supplies.
HARTING: Circular Connector Meets the Growing Demands in the Railway Sector
Publication Date: 3/21/2017

ESPELKAMP, GERMANY -  The railway sector and rail transport markets continue to grow steadily, whether long-distance trains or urban area rail. Trains are also being equipped with ever more modern information technology. HARTING is offering space-saving solutions.

Experton Group names Benchmark Leader: iTAC.IoT.Platform receives award
Publication Date: 3/21/2017

MONTABAUR, GERMANY - iTAC Software AG has won the Experton Group’s Industry 4.0/IoT-Vendor Benchmark 2017 Award. Dieter Meuser, CTO of iTAC, accepted the award for the iTAC.IoT.Platform at a gala evening in Schlosshotel Kronberg on February 8.
Microchip DSC6000 Series MEMS Oscillators | Digi-Key Daily
Publication Date: 3/20/2017

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