Tuesday, September 27, 2016
VOLUME -26 NUMBER 2
Publication Date: 02/1/2011
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Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726
Publication Date: 9/22/2016

Fremont, CA -Saki Corporation, an innovator in the field of automated optical inspection (AOI) equipment, will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International,September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes. 
New Panasonic Products for Total Solutions Beyond SMT at SMTAI 2016
Publication Date: 9/22/2016

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America debuts new products for “Total Solutions beyond SMT” in booth #225 at SMTA International on September 27-28 in Rosemont, Illinois. Panasonic is also proud to participate in Global SMT & Packaging’s live panel discussion on The Future of Electronics Factory Automation on September 27th at 2:45 in booth #1023, as well as support the industry as the show’s exclusive Premium Platinum Sponsor.

Dymax Receives Another US Patent
Publication Date: 9/22/2016

Torrington, CT – Dymax Corporation has recently announced it has been awarded a new patent by the United States Patent and Trademark Office (USPTO). US Patent No. 9,394,436 entitled “Form-In-Place Gasket With Tack Free Surface” was received for a method for preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components. 

JTAG Technologies Returns to SMTA 2016
Publication Date: 9/22/2016

Eindhoven, the Netherlands -  As one of the World’s leading suppliers of JTAG-powered testers and device programming tools, JTAG Technologies will display much of its current hardware range and will also offer live software demonstrations.  Experienced JTAG test engineers will be on-hand to discuss practical test issues and advise on solutions - just bring your questions and/or your target board to Booth 136 for an honest appraisal. 

KYZEN Offers IPA Alternatives for Stencil Cleaning at productronica India
Publication Date: 9/22/2016

NASHVILLE, TN KYZEN today announced plans to exhibit with its distributor, Kreative Technologies, in Booth #3429 at productronica India, September 21-23, 2016 in Bangalore. The KYZEN team will highlight IPA replacements and its AQUANOX® A4625 versatile aqueous cleaning chemistry.

Riverwood Solutions Continues Expansion in the MEMS and Sensor Ecosystem:
Publication Date: 9/21/2016

PLANO, TX - Following continued growth, Riverwood Solutions is taking steps to broaden its presence in the emerging technology ecosystems. As one of several broader initiatives, Riverwood Solutions has joined the MEMS & Sensors Industry Group where it will continue providing services that focus on taking critical aspects of emerging technology and helping companies create and manufacture leading edge hardware products.
Saline Lectronics Procures Its Third Juki Fortress for High-Volume Assemblies
Publication Date: 9/21/2016

SALINE, MI Saline Lectronics, Inc., a leading electronics contract manufacturer, recently purchased and installed its third StorageSolutions Fortress (ISM2000XL) from Juki. The Fortress is designed for optimal management of larger dimension reels. Now, Lectronics’ three Fortresses will store all of the necessary material to run high-volume assemblies that the company manufactures regularly.

Henkel to Show Broad Portfolio of Enabling Technologies at SMTA International 2016
Publication Date: 9/21/2016

IRVINE, CA – From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
 
Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing
Publication Date: 9/21/2016

Concord, CA - Nordson MARCH, a global leader in plasma cleaning technology, introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Mentor Graphics join new thought-leadership program ‘ScoopTalk’ at SMTA International
Publication Date: 9/21/2016

ROSEMONT, IL - SMTAI 2016 will see the launch of ScoopTalk, an innovative program of roundtable discussions which brings together the biggest players and brightest minds in the industry to debate the industry's hottest subjects. Today, Mentor Graphics confirmed their participation as an ‘Influencer’ sponsor with Michael Ford and Jay Gorajia joining in as panellists. 

New ASM manufacturers’ representative: Performance Technologies Group (PTG)
Publication Date: 9/21/2016

MUNICH, GERMANY - ASM Assembly Systems announces that it has partnered with Performance Technologies Group as its manufacturers’ representative for its DEK and SIPLACE brands in New England, New York, New Jersey, Maryland, Delaware, West Virginia and eastern Pennsylvania. “We are very excited to be partnering with Performance Technologies Group in the northeastern United States,” stated Brian Smith, ASM’s Director of USA Sales.
U.S. Tech Heads to SMTA International
Publication Date: 9/20/2016

Next week, September 27-28, U.S.Tech heads to SMTA International in Rosemont, Illinois. Our publisher and editorial staff will be covering the show and exhibiting in Booth #545. Along with many copies of our packed September issue, we will be distributing our 2017 Media Kit, which includes all the information you need to promote your company in U.S.Tech.
Indium Corporation Products Live@SMTAI
Publication Date: 9/20/2016

CLINTON, NY - Indium Corporation will be running its low-voiding solder products Live@SMTAI in partner booths throughout SMTAI on September 27-28 in Rosemont, Ill.      

Live@SMTAI places Indium Corporation products into live equipment demonstrations on the SMTAI show floor. The program, a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. 
Koh Young Technology Exhibiting 3D AOI, SPI Solutions at SMTA Guadalajara Expo & Tech Forum
Publication Date: 9/20/2016

SEOUL, KOREA - Koh Young Technology will exhibit its world-leading 3D AOI and SPI solutions at the SMTA Guadalajara Expo & Tech Forum, Wednesday October 5 and Thursday October 6, 2016, at Hotel Riu Guadalajara, Mexico. On display will be the KY8030-3 3D Solder Past Inspection (SPI) with dual projection, and the Zenith 3D Automated Optical Inspection (AOI) with its groundbreaking 8-way projection system.
Panasonic Launches PanaCIM® Enterprise Edition 10 Manufacturing Execution System
Publication Date: 9/19/2016

Rolling Meadows, ILPanasonic Factory Solutions Company of America has launched PanaCIM Enterprise Edition 10, a new, architecturally-innovative version that effectively delivers a feature-rich, manufacturing software suite through a scalable, small-footprint appliance that can grow with the manufacturer, while providing unprecedented integration of Panasonic and best-in-class complementary technology partner equipment.

Ventec VT-901 Reliability Validated by HATS Testing at Key Israeli Customers
Publication Date: 9/19/2016

SUZHOU, CHINA - Ventec International is proud to announce that the reliability of its VT-901 polyimide laminates, prepregs and low-flow prepregs has been conclusively demonstrated by Highly Accelerated Thermal Stress (HATS) testing by two leading PCB manufacturers in Israel.

PCB Technologies tested VT-901 materials in complex high layer count rigid multilayer constructions, Eltek’s testing also included high layer count flex-rigid multilayers and VT-901 easily satisfied the test criteria in all examples.
Parker Unveils New Wireless Sensor Products at Sensors Midwest
Publication Date: 9/19/2016

Golden Valley, MNAs the Internet of Things (IoT) leaps forward, Parker Hannifin Corporation, the global leader in motion and control technology, continues to introduce new products rooted in diagnostics and condition monitoring. Parker is introducing an expanded SensoNODE™ product line at this year’s Sensors Midwest conference in Rosemont, Ill.

The latest additions to the SensoNODE product line include:

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness
Publication Date: 9/19/2016

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

KYZEN to Present Innovations to Address the Challenges of Cleaning Highly Dense Electronic Hardware at IEMT-EMAP 2016
Publication Date: 9/19/2016

NASHVILLE, TN - KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

Herrmann Ultrasonics, Inc. expands on the West Coast
Publication Date: 9/19/2016

BARTLETT, IL - Herrmann Ultrasonics has invested in increasing their presence in California with a new expanded Tech-Center. The Irvine, California facility has tripled the local lab size and will offer increased technical support capabilities.

In honor of the new technology center’s grand opening Herrmann Ultrasonics is proud to be offering an inaugural Technology Day event on September 29th, 2016.
 
 
 
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