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Cisco, Cooper Power Systems, Tropos Networks, Grid Net, and U-SNAP Alliance Join Smart Grid Coalition
Publication Date: 7/29/2010

WASHINGTON, DC, PRNewswire-USNewswire
The Demand Response and Smart Grid Coalition (DRSG) today announced that five new members have joined its effort to educate and provide information to policymakers, utilities, consumers, and other stakeholders. The new members are Cisco, Cooper Power Systems, Tropos Networks, Grid Net, and U-SNAP Alliance.
IPC CONFERENCE ON THE MILITARY MARKET OFFERS SOLUTIONS AND OPPORTUNITIES FOR THE NORTH AMERICAN EMS INDUSTRY
Publication Date: 7/28/2010

BANNOCKBURN, IL —  
What does the U.S. military need from electronics manufacturing services (EMS) providers both now and in the future? Which certifications are critical to becoming a supplier to the military? What are the best practices for managing ...
Precision Adapters Designed for Low Insertion Loss/VSWR up to 18GHz
Publication Date: 7/28/2010

SAN DIEGO, CA -   
Test grade adapters need to be rugged and versatile for use in lab or field applications. To meet this increasing need, RF Precision Products has released a complete line of the most popular test adapters covering SMA and N-types. Precision machined passivated stainless steel construction for long life, repeated use and corrosion resistance. All adapters feature epoxy captivated... 
Digi-Key Announces Stock on DIGITUS® Professional Fiber Optic Patch Cords from ASSMANN Electronics
Publication Date: 7/28/2010

THIEF RIVER FALLS, MN — 
Electronic components distributor Digi-Key Corporation has announced it has stock on DIGITUS® Professional fiber optic patch cords from ASSMANN Electronics, Inc.
These products are now available for purchase on Digi-Key's global...
Xtreme Power raises cash for renewable-energy storage
Publication Date: 7/27/2010

A whole lotta storage: an Xtreme Power battery designed for utility storage. (Credit: Xtreme Power)
By Martin LaMonica, cnet Green Tech
Xtreme Power, which is commercializing battery technology originally developed for electric vehicles, is expected to announce on Tuesday that it has raised nearly $30 million to expand into utility energy storage.
The Austin, Texas-based company brought in venture-capital firm Bessemer Venture Partners as an investor, as well as potential partners and customers including...
Osram's New Chip Platform Increases LED Efficiency By 30%
Publication Date: 7/26/2010

Nanowerk News
Developers at OSRAM Opto Semiconductors have succeeded in increasing the efficiency of red thin-film LEDs by 30% – a new record. The latest generation of thin-film chips benefit from an optimized chip platform which has potential for further improvements. This boost in efficiency is opening up new LED applications in general illumination, in projection and in the industrial sector...
IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
Publication Date: 7/26/2010

BANNOCKBURN, IL —
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board...
Graphene Organic Photovoltaics: Flexible Material Only a Few Atoms Thick May Offer Cheap Solar Power
Publication Date: 7/23/2010

A flow of methane and hydrogen gas mixture deposits carbon atoms as graphene on a nickel plate. The graphene later is then transferred to a plastic sheet, which is then incorporated into an organic photo voltaic (OPV) cell. (Credit: USC Viterbi School of Engineering)
ScienceDaily
  —   
A University of Southern California team has produced flexible transparent carbon atom films that the researchers say have great potential for a new breed of solar cells.
"Organic photovoltaic (OPV) cells have been proposed as a means to achieve low cost energy due to their ease of manufacture, light weight, and compatibility with flexible...
Digi-Key recognizes AVX with 2010 Exceptional Sales Performance Award
Publication Date: 7/23/2010

MYRTLE BEACH S.C. — 
AVX Corporation, a manufacturer of advanced passive components and interconnect solutions, recently received the 2010 Exceptional Sales Performance Award from Digi-Key, the first award of its kind. The award was presented to Pete Venuto, vice president of sales at AVX, by Chris Beeson, Digi-Key vice president of the volume business division, on Wednesday May 12, 2010 at the EDS show in Las Vegas. AVX was acknowledged by Digi-Key because of its increased sales and exemplary business interactions...
Mouser Stocking TI’s DC/DC LED Lighting Developer’s Kit
Publication Date: 7/22/2010

MANSFIELD, TX –
Mouser Electronics, Inc., has announced it is stocking the Texas Instruments TMDSDCDCLEDKIT TMS320C2000™ DC/DC LED Lighting Developer’s Kit.        
The Texas Instruments TMDSDCDCLEDKIT TMS320C2000™ DC/DC LED Lighting Developer's Kit includes all of the hardware and software to start experimenting with and developing a digitally controlled LED DC/DC system. The TI TMDSDCDCLEDKIT...
Digi-Key Corporation and Panasonic Electric Works Corporation of America Expand Distribution Agreement to Include Asia-Pacific Territories
Publication Date: 7/22/2010

THIEF RIVER FALLS, MN — 
Electronic components distributor Digi-Key Corporation has announced it has signed an expanded distribution agreement with Panasonic Electric Works Corporation of America, a market leader in electromechanical and solid-state relays. The expanded agreement will allow Digi-Key to distribute Panasonic...
ONLINE REGISTRATION NOW OPEN FOR ELECTRONICS MIDWEST: IPC and Canon Establish Midwest’s Largest Electronics Manufacturing Show
Publication Date: 7/21/2010

BANNOCKBURN, IL —
Collaborating to offer an unmatched regional event for companies and their employees, IPC — Association Connecting Electronics Industries® and Canon Communications are bringing the best of the global electronics manufacturing industry together at Electronics Midwest, September 28–30, 2010. Taking place at the Donald E. Stephens Convention Center in Rosemont, this premier event will feature...
Heilind Electronics Presented with JAE's 2009 Distributor of the Year Award
Publication Date: 7/21/2010

WILMINGTON, MA - 
JAE has named Heilind Electronics, Inc., the largest interconnect distributor in North America, its 2009 Distributor of the Year. The annual award recognizes the JAE distributor that has most increased sales in North America.  This is the third time that Heilind has received...
ZESTRON Expands its Technical Support Team in North Asia
Publication Date: 7/21/2010

Manassas, VA –
As part of the company’s “Global Link” initiative which was announced in the beginning of 2010, ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, has recently expanded...
White Paper: Development of Highly Reliable Multilayer Piezo Actuators
Publication Date: 7/20/2010

AUBURN, MA ––
EnlargePiezo technology specialist PI Ceramic has released a new white paper on the development and test of highly reliable multilayer piezo actuators.   
 
Piezoelectric multilayer actuators are the driving force behind the most challenging motion control applications when it comes to speed and precision. They have found use in fields as different as injection valves for combustion engines (speed) and atomic force microscopy (precision). These types of actuators have been in use for about two decades and have reached maturity several years ago. Continuous improvements are based on...
Small wires make big connections for microelectronics
Publication Date: 7/20/2010

Illinois researchers can make tiny wire bonds to connect integrated chips using a direct-write technique.
Printed Electronics World
-
University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.  
 
Integrated chips are made by wiring multiple transistors and electronic components together to perform complex functions. The connections between chips and circuit boards traditionally are made from pre-fabricated metal wires that connect to a designated bonding pad on a chip...
Nokia Siemens To Buy Motorola Unit For $1.2B
Publication Date: 7/19/2010

By W. David Gardner,  InformationWeek
After several months of failing to break itself up, Motorola finally succeeded Monday as it sold off most of its mobile network infrastructure unit for $1.2 billion to Nokia Siemens Networks (NSN).
The deal gives Nokia -- the world's leading supplier of mobile handsets -- an invigorated entrance to the U.S. market where it has lagged far behind other handset suppliers...
New recruit extends DEK’s commitment to lean; customers can expect even more
Publication Date: 7/19/2010

WEYMOUTH, UK -   
DEK has appointed Lean Six-Sigma Black Belt,  Liang Zong, as its new Business Improvement Engineer. Joining DEK’s progressive Quality Department, the new recruit will be responsible for boosting company-wide efficiency through lean business improvement initiatives, in addition to developing its Quality Management Systems in the UK and China to help customers in these regions Expect More...      
FlexLink Half-year report 2010
Publication Date: 7/19/2010

GOTEBORG, SWEDEN -
Order intake shows a continuing significant increase, resulting in a solid order book, and higher sales. The profitability in the second quarter showed a healthy increase.
Key Component Shortages Limiting Growth of LED Backlight Units for LCD TVs
Publication Date: 7/19/2010

SANTA CLARA, CA — 
EnlargeThe LED backlight unit has emerged as a key factor in the TFT LCD industry, and is expected to maintain its growth momentum for the next several years. According to the latest DisplaySearch Quarterly LED Backlight Report, LED backlight shipments will pass those of CCFL backlights in all large-area TFT LCD panels and achieve 80% penetration in Q4’12...

 

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