Wednesday, June 1, 2016
VOLUME -25 NUMBER 5
Publication Date: 05/1/2010
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Techcon Systems Spring Promo Continues Through June: Free $1,000 Valve with the Purchase of Any Techcon Robot
Publication Date: 5/27/2016

GARDEN GROVE, CATechcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that its Spring Promo will continue through the end of June. Customers can get a FREE dispensing valve (up to $1,000) with the purchase of a Techcon Systems Bench-Top Robot System. The promotion is effective now through June 30, 2016.
Indium Corporation Expert to Present at Northern California Reliability Workshop
Publication Date: 5/26/2016

CLINTON, NY - Indium Corporation’s Sehar Samiappan, Regional Manager for Northern California, will present Voiding and Undried Flux Control with Bottom-Terminated Components at the Northern California Reliability Workshop on June 9 in Milpitas, Calif.

This presentation will detail how the use of solder preforms as venting channels for flux vaporization on bottom-terminated components can prevent wet flux conditions and significantly reduce voiding.
Micronor Will Introduce World’s First Fiber Optic Microswitch at Sensors Expo 2016
Publication Date: 5/26/2016

CAMARILLO, CA - At Sensors Expo 2016 (June 22-23, San Jose, CA USA), Micronor will unveil the MR386 ZapFREE® Microswitch, the world’s first fiber optic micro switch, purposely designed to meet the challenging requirements of MRI, medical and industrial applications.
 
Epoxies, Etc: Silicone Dielectric Gels Cushion and Protect Electronics
Publication Date: 5/26/2016

CRANSTON, RI - Electronic assemblies and delicate components increasingly need soft encapsulating materials to provide protection. A unique series of Clear Silicone Gels (20-1700 Series) were developed to seal and protect electronics from vibration, mechanical stress, and shock. They are also used to isolate circuits from moisture and contaminants while providing electrical insulation.
ASTEELFLASH USA CORP. AWARDED CONSUMER ELECTRONICS CONTRACT FOR 20 MILLION UNITS
Publication Date: 5/26/2016

FREMONT, CA - Asteelflash USA Corp. located in Raleigh - Morrisville, North Carolina has been awarded a contract to mass produce millions of units for an undisclosed consumer electronics customer starting in July 2016.  This product will be produced on a newly designed automated assembly line with a CAPEX investment exceeding one (1) million dollar investment, with first deliveries expected for Mid-June 2016. 

 
North American Semiconductor Equipment Industry Posts April 2016 Book-to-Bill Ratio of 1.10
Publication Date: 5/25/2016

 
Fuji Machine Manufacturing and CKD Corporation Partnership
Publication Date: 5/25/2016

VERNON HILLS, IL - Fuji Machine Manufacturing Co., Ltd. has announced the addition of CKD Corporation to the Fuji Smart Factory members.

Through the standardization of the communication protocol between automated optical inspection machines (AOI) and electronic component mounters developed by Fuji, CKD automated inspection machines can connect to Fuji's Smart Factory with Nexim to create a production placing system that extends beyond the boundaries of corporations.
LNA Laser Introduces New "All-In-One" DPSS Laser Marking System
Publication Date: 5/25/2016

PAWTUCKET, RI - LNA Laser Technology introduces a new laser marking system, model# MP2. The MP2, All-in-One DPSS laser marking system is ideal for applications which require high resolution and where high speed throughput isn’t required. The system includes everything you need –Diode Pumped Solid State (DPSS laser), laser beam scanning optics (galvanometer), control electronics and marking software.
Yamaha Launches Modular Z:TA-R YSM40R Surface Mounter With Fastest Placement Rates
Publication Date: 5/25/2016

KENNESAW, GA - Yamaha IM America announces the launch of the new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the fastest placement rates and area productivity, at an unmatched 200,000 CPH: the fastest in the world.

As the successor to the current high‐density modular Z:TA/ YSM40 machine, the YSM40R was developed using a revolutionary productivity concept.
 
Alpha Assembly Solutions to Showcase High Relialbity LED Soldering Materials at GILE 2016 in Guangzhou
Publication Date: 5/24/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, plan to showcase their vast LED materials portfolio and will present a technical paper at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.
Advanced Technology Workshop & Tabletop Exhibits on Additive Manufacturing & Printed Electronics
Publication Date: 5/24/2016

LOWELL, MA - The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop on ADDITIVE MANUFACTURING and PRINTED ELECTRONICS on June 28-29, 2016. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable.
 
 
GCT delivers 10 million dual USB connectors for Raspberry Pi application
Publication Date: 5/24/2016

LAWRENCE, MA - Global Connector Technology (GCT) has shipped its ten millionth Dual USB connector USB1035 for the Raspberry Pi. Two dual USB connectors are used on each Raspberry Pi device to enable the attachment of peripherals such as keyboards, mice and webcams which provide the Pi with additional functionality.
 
 
EIS: Durable, Versatile SEOOW Portable Power Cord Offers Powerful Flexibility
Publication Date: 5/24/2016

SOUTH HADLEY, MA - EIS Wire & Cable Co. has added an SEOOW Portable Power Cord to its diverse line of cables, providing a versatile, durable option for non-permanent commercial and industrial applications requiring multi-conductor, higher-voltage power distribution.
Indium Corporation VP of Technology to Chair Workshop on Pb-Free Soldering Reliability at ECTC
Publication Date: 5/24/2016

CLINTON, NY - Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas, Nev.

The professional development course will explore the detailed material considerations required for achieving high reliability in lead-free solder joints.
Digicom Electronics Presents Diamond Track EMS Services at the Design-2-Part Show, Santa Clara, CA
Publication Date: 5/24/2016

OAKLAND, CA - Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, presents its Diamond Track electronics manufacturing services at the Design-2-Part Show in Santa Clara, CA on June 8 and 9th, in booth 331. The program incorporates Digicom's Diamond Track Cleaning services to ensure printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries.
SEMI: First Strategic Materials Conference in Korea - a Success
Publication Date: 5/23/2016

SEOUL, KOREA - SEMI announced today that the first SEMI Strategic Materials Conference (SMC) was held in Korea COEX in Seoul on May 18. This deep technical conference program attracted 258 attendees from 81 companies. Advanced materials critical to scaling technology in semiconductor manufacturing industry bring challenges including innovation speed, cost effectiveness, performance, quality management and environmental issues.
Broadcom Selects Avnet as Exclusive Broadline Distributor in the Americas and EMEA
Publication Date: 5/23/2016

PHOENIX, AZ - Avnet, Inc. (NYSE:AVT), a leading global technology distributor, today announced an expanded, exclusive distribution agreement with Broadcom Limited (Nasdaq:AVGO). Under the new agreement, Avnet will serve as the exclusive broadline distributor for Broadcom in the Americas and EMEA regions. Avnet will also continue its franchise in Asia.
 
Ersa Offers Solutions for Challenging Rework Applications
Publication Date: 5/23/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 30, 2016 at the Marriott Minneapolis Southwest.
LPKF: New Laser Solutions for Innovative Interconnects at ECTC in Las Vegas
Publication Date: 5/23/2016

TUALATIN, OR - LPKF Laser & Electronics has announced it will exhibit at the 2016 Electronic Components and Technology Congerence (ECTC) which will be held June 1-2, 2016 at The Cosmopolitan in Las Vegas, NV.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505
Publication Date: 5/23/2016

SAN JOSE, CA - SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
 
 
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