Friday, September 30, 2016
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Alpha to Feature New Product Innovations at SMTA Austin Expo
Publication Date: 9/27/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Austin Expo to be held October 11th at the Norris Conference Center in Austin, Texas.
TE Connectivity: New High Speed Cables Offer Signal Integrity in IEEE 1394 Applications
Publication Date: 9/27/2016

HARRISBURG, PA - TE Connectivity Ltd. (TE) (NYSE: TEL), a world leader in connectivity and sensors, announced today that its new Raychem high-speed data transmission cables for IEEE 1394 applications. Designed for use with military ground, military and commercial aerospace and marine systems, the ruggedized cable helps block out excess noise in harsh environments to enable dependable signal integrity in extreme conditions.
Now Available from HEIDENHAIN: Absolute Linear Encoders with Panasonic Interface
Publication Date: 9/27/2016

SCHAUMBURG, IL - HEIDENHAIN CORPORATION is pleased to announce the start of series production of the new generation of LC encoders. The LC xx5 Absolute Sealed Linear Encoders have long been available for use with Siemens, Fanuc, Mitsubishi, and HEIDENHAIN controls – and can now be ordered with Panasonic interface (Pana01).

Avnet to Launch Directory at N.Y. World Maker Faire
Publication Date: 9/27/2016

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today announced that it will launch its new MakerSource.ioTM online resource directory at the N.Y. World Maker Faire in the New York Hall of Science, Corona, N.Y., Oct. 1-2, 2016.
Hover-Davis Announces Its New SA Series Automation Feeders at the SMTAi Exhibition
Publication Date: 9/27/2016

ROSEMONT, IL - Known as The Feeder Company, Hover-Davis announces the introduction of its new SA Series automation feeders in Booth #807 at the SMTA International 2016 Exhibition in Rosemont, IL, on September 27–28.

New SA Series automation feeders utilize the company’s proven SSF feeder technology and architecture to enable a wider range of interface and control capabilities, including an advanced ASCII communication protocol, lower profile form-factor and a host of interface modules for simple drop-in integration.
Vi TECHNOLOGY premieres complete 3D solutions at MATELEC with PI, the most innovative SPI system
Publication Date: 9/26/2016

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with Fenwick Iberica in Booth 5D12 at MATELEC, schedule to take place October 25-28, 2016 in Madrid, Spain. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI.
Metcal: New Solder Wire Feeder Adds a New Level of Control – Find Out More at SMTA Guadalajara
Publication Date: 9/26/2016

CYPRESS, CA - Metcal today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scorpion Rework System and MX-5200 Soldering System.
YXLON CT goes VGStudio MAX 3.0
Publication Date: 9/26/2016

 CT metrology analyses of an aluminum pump housing using VGStudio MAX 3.0
HAMBURG, GERMANY - Effective immediately, all computed tomography systems from YXLON International will be delivered including the VGStudio MAX 3.0 visualization and analysis software family. According to the manufacturer, Volume Graphics, the software has been redeveloped from scratch. By directly implementing VGStudio MAX 3.0 and the add-on modules for special areas of application, YXLON customers profit right away from the numerous improvements and enhancements.
Digi-Key: Linear Technology LTC7149
Publication Date: 9/26/2016

PI: White Paper Explains Design and Preparation of NanoPositioners for High Vacuum
Publication Date: 9/26/2016

AUBURN, MA - For decades, PI has provided stages and systems for vacuum levels from 10-3 mbar to 10-9 mbar that deliver reliable motion control for positioning and alignment.

Aegis Joins New Thought-Leadership Program ‘ScoopTalk’ at SMTA International
Publication Date: 9/23/2016

ROSEMONT, IL - The continuous drive for innovation within the electronics industry has accelerated the need to remain competitive and Aegis Software pride themselves on their original solutions to harness and deliver speed, control and visibility for manufacturing operations. Joining ScoopTalk as a key sponsor will allow Aegis the opportunity to join the debate which will focus on the influential trends that dominate the industry.

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI from Akrometrix
Publication Date: 9/23/2016

ATLANTA, GAAkrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

NEO Tech Offers Microelectronics Miniaturization for Medical Implantable Device OEMs
Publication Date: 9/23/2016

CHATSWORTH, CANEO Tech, a provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry. 

SEHO’s PowerWave N2 Tunnel Design Ensures High Energy Efficiency
Publication Date: 9/23/2016

Kreuzwertheim, Germany - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will exhibit in Booth 5B05-5B03 with its representative for Spain and Portugal, Propelec S.A., at MATELEC, scheduled to take place Oct 25-28, 2016 in Madrid, Spain. The PowerWave N2, equipped with a closed tunnel system, will be on display at the show.

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI
Publication Date: 9/23/2016

SAN JOSE, CA - SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader of superior solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.
Stratus Technologies Is Now an Official KYZEN Distributor
Publication Date: 9/23/2016

NASHVILLE, TNKYZEN has announced an new partnership with Stratus Technologies, a leader in surface preparation and a distributor of KYZEN specialty industrial cleaning products. 

As an active KYZEN partner, Stratus Technologies will promote, sell and support KYZEN’s full range of high-performance cleaning products throughout the United States – including Aqueous and Solvents chemistries and Corrosion Inhibitors. Additionally, Stratus Technologies will now draw on KYZEN’s technical resources in support.

Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726
Publication Date: 9/22/2016

Fremont, CA -Saki Corporation, an innovator in the field of automated optical inspection (AOI) equipment, will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International,September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes. 
New Panasonic Products for Total Solutions Beyond SMT at SMTAI 2016
Publication Date: 9/22/2016

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America debuts new products for “Total Solutions beyond SMT” in booth #225 at SMTA International on September 27-28 in Rosemont, Illinois. Panasonic is also proud to participate in Global SMT & Packaging’s live panel discussion on The Future of Electronics Factory Automation on September 27th at 2:45 in booth #1023, as well as support the industry as the show’s exclusive Premium Platinum Sponsor.

Dymax Receives Another US Patent
Publication Date: 9/22/2016

Torrington, CT – Dymax Corporation has recently announced it has been awarded a new patent by the United States Patent and Trademark Office (USPTO). US Patent No. 9,394,436 entitled “Form-In-Place Gasket With Tack Free Surface” was received for a method for preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components. 

JTAG Technologies Returns to SMTA 2016
Publication Date: 9/22/2016

Eindhoven, the Netherlands -  As one of the World’s leading suppliers of JTAG-powered testers and device programming tools, JTAG Technologies will display much of its current hardware range and will also offer live software demonstrations.  Experienced JTAG test engineers will be on-hand to discuss practical test issues and advise on solutions - just bring your questions and/or your target board to Booth 136 for an honest appraisal. 

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