Cypress, CA — Techcon, a leader in precision fluid dispensing technologies, today announced that it has hired a new Territory Sales Manager. David Reyes will manage the Midwest and Mexico. 

Reyes brings more than 15 years of experience in the industry, with a unique touch in that he has successfully lead teams in manufacturing, sales and customer service environments to develop his business. He is a seasoned professional with a proven track record

These new PXI Fault Insertion Switches (model 40-202), available with 22 or 11 fault insertion channels, were primarily designed to simulate fault conditions in automotive and avionics test applications involving the reliability testing of safety-critical controllers.

Shingle Springs, CA — PDR, an industry recognized leader in IR rework since 1986, is pleased to announce that it has partnered with USM Reps its manufacturers’ representative. Eduardo Ortiz will represent PDR’s IR rework systems throughout Mexico (excluding Baja), the Central America region and El  Paso, TX.

Saint-Egrève, France — Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that it will exhibit with its representative at the S.E.E. Scandinavian Electronic Event, scheduled to take place April 24-26, 2018 at the Kista Expo Center in Sweden. Wretom will showcase the PI Series 3D SPI in Booth C02:30.

Chandler, AZ –  Not long ago, 2D inspection was the industry norm, but 3D inspection quickly proved itself as a more reliable technique. Today, true 3D measurement has become even more effective, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?

MILPITAS, CA — SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  

Beltsville, MD – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Initiatives for Addressing ISO-26262 Hardware Risk Assessments, at the 2018 Annual Automotive Electronics Council (AEC) Reliability Workshop on April 24 – 26 in Novi, Michigan. James McLeish and Ashok Alagappan, of the DfR Solutions Senior Technical Staff, will present with Senior Reliability/Test Engineer Keith M. Hodgson of Ford Motor Co. on Wednesday, April 25 from 4:00 PM to 5:30 PM.