Tuesday, June 28, 2016
VOLUME -22 NUMBER 12
Publication Date: 12/1/2007
Advertisements
HOME / CURRENT ISSUE >  Daily News Archive > 
Ventec International Group complete acquisition of TMT Trading
Publication Date: 6/24/2016

SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced that effective 1st July 2016, TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- & rigid-flex circuit board materials, will be integrated into Ventec International Group.
Introducing the ELM-800 Laser Marker by Eunil
Publication Date: 6/24/2016

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, introduces the ELM-800 Laser Marker.

The Eunil in-line ELM-800 Laser Marker is an automation machine used to add a barcode, QR, 1D, or 2D on PCBs.
 
Brilliant Response to FRAMOS’ Image Sensor Tech Days
Publication Date: 6/23/2016

MUNICH, GERMANY - FRAMOS’ Sensor Tech Days, the successor event of FRAMOS’ famous CCD Forums in the 1990s, got very positive feedback from both attendees and the presenting technology partners. The two-day seminar focussed on technical image sensor details and development outlooks by SONY (day one) and ON Semiconductor (day two) and was complemented by a custom-sensor deep dive by Pyxalis and lab testing results from FRAMOS’ application engineering team.
Virtual Industries, Inc: Advanced Vacuum Handling Systems for Critical Components at SEMICON West
Publication Date: 6/23/2016

COLORADO SPRINGS, CO - Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, today announced that it will exhibit in Booth #834 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. Company representatives will demonstrate the TWEEZER-VAC® Elite and ADJUST-A-VAC® Elite.
Würth Elektronik eiSos presents two new Compact SMD power inductors
Publication Date: 6/23/2016

Waldenburg,Germany – Würth Elektronik eiSos supplements its portfolio of compact SMD power inductors with two new series: WE-PMMI and WE-PMCI. The two new power inductors are used, for example, in highly efficient DC/DC switching controllers with a low space requirement.

Horizon Sales Hires Joshua Casper to Cover Areas of Michigan & Ohio
Publication Date: 6/22/2016

HOWELL, MI - Horizon Sales, a leading manufacturers’ representative corporation, specializing in the sales and marketing of premier electronics assembly equipment, today announced that effective immediately, Joshua Casper has joined the sales team, covering Eastern Michigan and Northern Ohio.

STI Acquires New AOI System from Nordson YESTECH
Publication Date: 6/22/2016

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce that it has acquired a new Nordson YESTECH FX-940 ULTRA 3D Automated Optical Inspection (AOI) system.
Marco Reyes Joins Dymax as Senior Regional Sales Manager- West
Publication Date: 6/22/2016

TORRINGTON, CT - Dymax Corporation is pleased to announce the appointment of Marco Reyes as the Senior Regional Sales Manager- West. While reporting to Mike Acker, Americas Sales Director, Marco will have the responsibility of providing key service in helping manufacturers in the western region solve their most complex application problems and reduce manufacturing costs.
 
Engineering Giant ABB is Investing Heavily in the United States, a Beacon for Entrepreneurship and Technological Innovation
Publication Date: 6/22/2016

WASHINGTON, DC- As the US presidential election enters its final stages, there is much talk on both sides about the state of the US economy and how to position it in the future.

From my perspective, the United States still is a leading nation in the world when it comes to entrepreneurship and technological innovation.
 
KYZEN to Show Cleaners for Wafer Bumping, Wire Bonding and Cu Pillar Flip Chip Applications at SEMICON West
Publication Date: 6/22/2016

NASHVILLE, TN - KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
WACKER Expands Production Capacity For Silicone Sealants and Specialty Silicones
Publication Date: 6/22/2016

 
 Encapsulating LED chips in silicone gels is becoming increasingly common –
These kinds of gels
will be manufactured at the new production site
in Jincheon, South Korea. (Photo: Wacker Chemie AG)
MUNICH, GERMANY - Wacker Chemie AG is expanding its silicone elastomer production capacity in Jincheon, South Korea. The new facilities will include production plants for silicone sealants, specialty silicones and liquid silicone rubber. At the same time, existing production units in Jincheon will be transferred to the new site. Investments for the expansion will total around €16 million. Construction work will officially start end of July, production is expected to begin in the first quarter of 2018. The new expansion project is WACKER’s response to growing regional demand for silicone elastomers in the construction, electronics and automotive industries.
 
IDT Collaborates with Cavium to Support Hyperscale Data Centers
Publication Date: 6/21/2016

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced its collaboration with Cavium, Inc., on a reference design that supports the burgeoning workloads of the hyperscale data center. The IDT® DDR4 memory interface solutions are incorporated into the reference design, which is built on Cavium’s ThunderX family of workload-optimized 64-bit ARMv8-based processors.
Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities
Publication Date: 6/21/2016

 
 New in SEMulator3D 6.0, the Electrical Analysis module adds powerful resistance and capacitance extraction to deepen the understanding of process and design sensitivities.
CARY, NC - Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.0 - the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features, usability enhancements and a new add-on capability for electrical analysis.
MOHR Test and Measurement, LLC (MOHR): Meet the Industry's First TDR Cable Analyzer with Frequency Domain S-Parameter Measurements
Publication Date: 6/21/2016

RICHLAND, WA - Although Time-Domain Reflectometer (TDR) cable testers are prized for their ability to detect and localize cable faults and measure cable length, they have not been able to characterize the frequency domain microwave/RF performance of cables and connectors like instruments based on Vector Network Analyzer (VNA) technology.
 
U.S.Tech: Still Time Left to Promote Your Company at SEMICON West
Publication Date: 6/21/2016

SEMICON West is right around the corner. With only a few weeks until the show, we still have space in the July issue of U.S.Tech for you to promote your company through advertising and PR. Deadline for material is June 28.

This issue is focused on test and assembly and will include 15 articles from all over the industry. These include a section showcasing various EMS companies and their developments, as well as the test and assembly feature articles.

If you are interested in any of our promotional opportunities, please contact our office at 610-783-6100 or
mail@us-tech.com. See you July 12-14 at SEMICON West!
Signals Research Group Partners with Rohde & Schwarz to Conduct Performance Study on 5G Power Amplifiers
Publication Date: 6/21/2016

COLUMBIA, MD - 5G mobile phone systems will be pushing the boundaries of modern communication systems. Power amplifiers, which are a key building block of transmitter design, will be required to do more in 5G applications. This includes better performance, cleaner signals and operating at higher frequencies in order to deliver the proposed data rates and throughputs of 5G.
Eunil Presents the Highly Accurate ECM-350 Table Coating Master
Publication Date: 6/21/2016

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, presents the ECM-350 Table Coating Master, a highly accurate offline machine for small-quantity batch production.

Printed circuit boards (PCBs) are the foundation for electronics in every day products including automotive, consumer electronics, communications, and industrial and energy applications.
Mycronic AB wins European Business Award s 2015/16 in the category Import/Export
Publication Date: 6/21/2016

TABY, SWEDEN - After a 15-month long competition period, Mycronic AB (publ) has taken first place in the Import/Export category in this year’s European Business Awards (EBA), one of Europe’s largest business competitions.

This year’s competition involved more than 32,000 companies from 33 countries. Mycronic participated in an exclusive prize ceremony on Friday, 17 June in Milano.
 
Juki Introduces the JX-350 LED Long Board Machine 1.5m
Publication Date: 6/21/2016

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to introduce the new JX-350 LED mounter. The JX-350 LED supports a wide variety of LED nozzles and can place up to six diffusing lenses over the top of the LED simultaneously for backlighting applications.
Hammond Introduces Miniature Enclosures Optimized for USB Interconnect
Publication Date: 6/20/2016

CHEEKTOWAGA, NY - When USB3.0 was introduced, offering theoretical data signaling rates of 5Gbits/s compared with the 480Mbits/s available from USB2.0, the protocol became significantly more useful across a variety of applications. The latest standard to be published, USB3.1, further increases performance to 10Gbits/s and reduces line encoding overhead. All flavors use a Type A standard plug as the interface to the host machine.
 
 
 
search login