Thursday, October 20, 2016
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SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials
Publication Date: 10/18/2016

San Jose, CA - SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon. 

Alpha Launches New tensoRED™ Master Tensioning Frame
Publication Date: 10/18/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce the launch of its new tensoRED™ Master Tensioning Frame, the latest development in Alpha’s range of state-of-the-art printing stencils.
Ironwood Electronics: Socket your PoP BGA500 using Extreme Temperature Socket with Superior Electrical Performance
Publication Date: 10/18/2016

EAGAN, MN - Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-BGA-6538. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions.
PDR Americas Launches the First Intra-Ocular-Adjustable Thermal Sensor for High-End Rework
Publication Date: 10/18/2016

SHINGLE SPRINGS, CA - PDR Americas, a leader in IR rework, test and inspection, today introduced the EMS industry’s first intra-ocular-adjustable ‘read zone’ thermal sensor for high-end rework. The rework-specific temperature sensor has been specifically engineered for rework environments, providing the accuracy and confidence needed for high-yield rework program success.
Ersa’s HR 550 Hybrid Rework System Addresses Users with the Highest Requirements – Learn More at SMTA New England
Publication Date: 10/18/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit at the SMTA New England Expo & Tech Forum, scheduled to take place Thursday, Nov. 3, 2016 at the DCU Center in Worcester, MA. Ersa’s team will highlight the HR 550 hybrid rework system and Smartflow 2020.

EOS Power Releases New Record-Breaking Low Profile Product Series & extends warranty options at Electronica 2016
Publication Date: 10/18/2016

Mumbai/Munich— EOS Power, designer, manufacturer and seller of high efficiency and small size Power Supplies, will present its new Ultra Low Profile (ULP) series of Medical and Commercial, High Efficiency, High Power Density AC/DC power supplies at Electronica 2016 in Munich. The new (M)ULP 180 & 250 Watt Series have power densities which reach 30 watts per cubic Inch with maximum height profiles of 0.75 Inches (19.05mm).
ScoopTalk at SMTAi 2016 Roundtable - Future Technologies for Electronic Manufacturing
Publication Date: 10/17/2016

Philip Stoten is joined by Libra Industries CEO Rod Howell, Mentor Graphics' Jay Gorajia and ASM's Jeff Timms to discuss the technology demands from the industry and the solutions on offer from the industry. The panel discusses the need for open systems, collaboration and the ability to see the big picture rather than focus on the minutia.

Filmed on location at SMTAi in Chicago on the ScoopTalk studio, hosted by EMSNow, Mexico EMS and US Tech and sponsored by Aegis Software, ASM Assembly Systems, Fuji America, KIC and Mentor Graphics.
KIC: MB Allen to Present Recent Research at the SMTA Space Coast Expo
Publication Date: 10/17/2016

SAN DIEGO, CA - KIC today announced plans to exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 17, 2016 at the Melbourne Auditorium in FL. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11 a.m.
Amphenol NTC Thermistors | Digi-Key Daily
Publication Date: 10/17/2016

Cirtronics Installs Powerful 3D AOI Solution for Accurate Inspection Results
Publication Date: 10/14/2016

DULUTH, GA - Viscom is pleased to announce that it has been selected by Cirtronics for its 3D AOI. Based in Milford, NH, Cirtronics has added an S3088 ultra blue AOI system to each of their production lines in its 175,000 sq. ft. manufacturing space.

The Cirtronics team conducted extensive evaluations on the S3088 ultra blue and competitive systems and found the Viscom units to be superior.
Dymax Improves Multi-Cure® 9451 Black Conformal Coating with New UL Certification
Publication Date: 10/14/2016

TORRINGTON, CT - Dymax 9451 Conformal Coating has received a UL V0 flammability certification for materials used in printed wiring boards. Formulated for UV cure and secondary heat cure, this security enhancing material is ideal for environmental protection of PCBs, wire harnesses, electronic components, and other surfaces needing a protective coating. Its opaque black color is intended to cover markings, labeling, other identification as well as sensitive information on the circuit board, and is targeted for tamper evident applications.

KIC: Optimize Your Reflow Profile at the SMTA New England Expo Booth 604
Publication Date: 10/14/2016

SAN DIEGO, CA - KIC today announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference’s Session 4 to Focus on Customer Cleaning Challenges/Needs
Publication Date: 10/14/2016

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
SEMI: 200mm Fabs on the Rise
Publication Date: 10/13/2016

SAN JOSE, CA - One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has issued an October 2016 update, with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity have changed worldwide. SEMI’s analysts updated information on almost 200 facilities, including new facilities and closures of existing facilities.
Shop Online at Virtual Industries’ New Website –
Publication Date: 10/13/2016

COLORADO SPRINGS, COVirtual Industries Inc., a leading supplier of manual vacuum handling solutions, today announced that it has updated it website. Located at, the new website is now mobile compatible.

3D Glass Solutions Announces Breakthrough Development of High Performance and High Frequency Circuits for RF Filters Using Glass-Based System-in-Package (SiP) Solutions
Publication Date: 10/13/2016

Albuquerque, NM – 3D Glass Solutions, Inc. (3DGS), the world’s leading expert in the fabrication of electronic devices and packaging using photo-definable glass ceramics, announced today the development of high performance and high frequency circuits for radio frequency (RF) filters using 3DGS’ patented APEX® Glass-based system-in-package (SiP) solutions. The RF circuit combines glass-based High-Q wide band inductors and capacitors into a single integrated architecture capable of producing a wide variety of RF filters for frequencies up to 30GHz. This breakthrough of innovation ushers in a new era of inexpensive, high efficiency, with reduced footprint glass-based SiP solutions for existing 2.4GHz and emerging 28GHz 5G wireless communication and monolithic microwave integrated circuits (MMICs) markets.
Avnet Releases Zynq Transceiver Evaluation Kit Globally
Publication Date: 10/13/2016

PHOENIX, AZ — Avnet, Inc., a leading global technology distributor, today released the Avnet Zynq Transceiver Evaluation Kit, a low-cost reference design that streamlines evaluation of Xilinx® Zynq®-7000 All Programmable SoC systems based on the PicoZed™ family of System-on-Modules (SOMs) for solutions that require transmission of large amounts of data at high communication rates or over long distances. The Kit, which targets applications in markets including medical, security, embedded computing and industrial automation, is priced at $649 and is available to customers in the Americas, EMEA, Asia and Japan. No startup fees are required for evaluation and development.
Yamaha Announces Improved Mounter Software Features, Functions
Publication Date: 10/13/2016

Kennesaw, GA Yamaha Motor Corporation, USA announces new developments in software features and functions for its Modular Mounters (SMT placement systems) that improve productivity and simplify maintenance. These include improvements in Nozzle Health Care, Maintenance Monitor, e-Vision, and a New Grouping optimization.

Cogiscan Partners with Siemens PLM Software to Provide a Complete Industry 4.0 Solution for Electronics Manufacturing
Publication Date: 10/11/2016

BROMONT, CANADA Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, is partnering with Siemens PLM Software to provide a complete manufacturing software solution to enable Industry 4.0 for Electronic Manufacturers. 

Mycronic receives multiple order for the MY600 Jet Printer
Publication Date: 10/11/2016

Täby, Sweden – Mycronic AB has received an order for several MY600 Jet Printer systems from an Asian high-volume customer with 24-hour production in several locations in Asia. The order is the third in a short time for the same type of equipment from the same customer.
Delivery will take place during the fourth quarter 2016.
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