Monday, April 24, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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Ersa to Exhibit the VERSAFLEX-Ultra Selective Solder Module at SMT Nuremberg

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit the new VERSAFLEX-Ultra selective solder module. The system will be displayed in Booths 4-111 and 5-434 at the upcoming SMT/Hybrid/Packaging show, to be held May 16-18 at the Messe in Nuremberg, Germany.

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ECD Logs Record-Breaking Year, Attributes Impressive Results to Customer Loyalty, Product Innovation and Outstanding Service

MILWAUKIE, OR - ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

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Josef Ernst Named Vice President CRM at ASM Assembly Systems

MUNICH, GERMANY - As the new Vice President CRM, Josef Ernst will be responsible for the global customer relationship management of ASM SMT Solutions, which is part of ASM Pacific Technology, the world’s largest equipment manufacturer for the electronics industry.
 

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Avnet Appoints Phillip Gallagher, Global President of Core Distribution Business

PHOENIX, AZ - Avnet, a leading global technology distributor, today announced the appointment of Phillip Gallagher to the role of president, of Avnet’s Core Distribution Business reporting to CEO William Amelio.

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America II Adds Two Lines to Its Global Channel Partnership

Global Distributor Continues to Grow its Vast Supply Chain

ST. PETERSBURG, FL - America II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has signed franchise distribution agreements with two manufacturers.
 

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MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
 

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Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

MUNICH, GERMANY - Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

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Ironwood Electronics: Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The CG25-QFN-2003 socket is designed for a 5mmx5mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss (GSSG configuration).
 

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BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging.
 

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KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

NASHVILLE, TN - Today KYZEN announced plans to introduce the new KYZEN ANALYST in Europe this spring at SMT Hybrid Packaging 2017. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST, at the show in Hall 4A, Stand 536.
 

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epoxySet: EO-98HT, Very High Temperature, Electrically Conductive Adhesive

LINCOLN, RI - epoxySet presents the EO-98HT, electrically conductive epoxy for electrical circuits, LED attachment, die attach and grounding applications. With a volume resistivity of approximately 10-4 ohm-cm, the EO-98HT is an excellent choice for solder replacement or circuit/wire bonding where high conductivity and reliability are required.
 

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Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at SMT

AYLESBURY, UK - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

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Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Hall 4A, Stand 240 at SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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InnovationsFORUM Hungary Reflects Changes In Manufacturing Landscape

Budapest, Hungary - From the keynote through each and every presentation, the 2017 InnovationsFORUM Hungary, held on May 25th at The Hungarian Academy of Science in Budapest, reflects the changes that are occurring in Eastern European manufacturing and the desire to utilize innovation at every point in the product lifecycle.
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SEHO Focuses on 100% Process Control

ERLANGER, KY - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will focus on automatic process control in Hall 4, Stand 129 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000® 3D Automated Optical Inspection (AOI) system in Hall 4, Stand 101 at the upcoming SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.

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SMT Xtra Celebrates 10-Year Milestone at SMT Hybrid Packaging 2017

MARYVILLE, TN - SMT Xtra, a leading provider of productivity enhancing solutions for the global surface mount electronic assembly sector, today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

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Digi-Key: TDK Corporation NTCG Series Thermistors


Scienscope to Showcase Automated Component Counters at NEPCON China

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced plans to exhibit in Stand 1H22 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center.
 

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Indium Corporation Expert to Present at RaMP2017 Workshop

CLINTON, NY - Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27, in Paris, France.

Karthik will present Enhanced Thermal Management with Compressible Solder Thermal Interface Materials (TIMs) and Engineered Low-Voiding Solder Preforms.

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