Wednesday, May 25, 2016
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Broadcom Selects Avnet as Exclusive Broadline Distributor in the Americas and EMEA
Publication Date: 5/23/2016

PHOENIX, AZ - Avnet, Inc. (NYSE:AVT), a leading global technology distributor, today announced an expanded, exclusive distribution agreement with Broadcom Limited (Nasdaq:AVGO). Under the new agreement, Avnet will serve as the exclusive broadline distributor for Broadcom in the Americas and EMEA regions. Avnet will also continue its franchise in Asia.
Ersa Offers Solutions for Challenging Rework Applications
Publication Date: 5/23/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 30, 2016 at the Marriott Minneapolis Southwest.
LPKF: New Laser Solutions for Innovative Interconnects at ECTC in Las Vegas
Publication Date: 5/23/2016

TUALATIN, OR - LPKF Laser & Electronics has announced it will exhibit at the 2016 Electronic Components and Technology Congerence (ECTC) which will be held June 1-2, 2016 at The Cosmopolitan in Las Vegas, NV.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505
Publication Date: 5/23/2016

SAN JOSE, CA - SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
DYCONEX Celebrates Its 25th Anniversary
Publication Date: 5/20/2016

BASSERSDORF, SWITZERLAND - DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016. Even so, the company can look back upon more than 50 years of experience in the fabrication of printed circuit boards. Back in 1964, a new division within Oerlikon-Contraves devoted to the manufacturing of circuit boards was established.
Indium Corporation Expert Presents at SMTA Silicon Valley PCB Cleaning Technology Roundtable
Publication Date: 5/19/2016

CLINTON, NY - Indium Corporation’s Sehar Samiappan, Regional Manager for Northern California, presented Pb-Free Flux Technology and Influence on Cleaning at the SMTA Silicon Valley Chapter’s PCB Cleaning Technology Workshop and Roundtable Discussion on May 19 in San Jose, Calif.

This presentation detailed the challenges of Pb-free soldering, including temperature settings, wetting, miniaturization, air reflow, and halogen-free.
Jason Fullerton of Alpha Assembly Solutions to Present on Divergence in Test Results at Upcoming SMTA Philadelphia Expo & Tech Forum
Publication Date: 5/19/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Philadelphia Expo & Tech Forum on June 9th in King of Prussia, PA as both an exhibitor and technical presenter.
Motion & Control Industry 2016 Awards Manufacturer of the Year Is PI (Physik Instrumente) UK
Publication Date: 5/19/2016

AUBURN, MA - Motion control and nanopositioning application solutions expert PI (Physik Instrumente) UK was named Manufacturer of the year at the 2016 Motion and Control Industry (MCI) Awards at the National Conference Centre, near Birmingham, UK. The ceremony, held in April, recognized both individuals and companies as the best of the best in the motion control industry.
Link Electronics Announces New Management
Publication Date: 5/19/2016

JACKSON, MO - Link Electronics announces the retirement of founder Bob Henson, and new ownership by industry veteran Dave Kendall. With 30 plus years in the technology and electronics industry, along with electrical engineering experience as an officer in the US Navy, Kendall brings a wealth of insight and perspective to his new role. He started in sales and marketing and worked his way into executive roles, bringing extensive knowledge, passion, leadership and drive for innovation.
SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505
Publication Date: 5/19/2016

SAN JOSE, CA - SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance.
VTT delivers world's first industrial internet solution for a printed electronics plant
Publication Date: 5/18/2016

ESPOO, FINLAND - VTT's printed electronics pilot plant in Finland has moved into a new era – an industrial internet-based solution, the first for the printed electronics production in the world, has been installed for the control of the plant. Environmental conditions affecting sensitive roll-to-roll production can be monitored, and temperature, humidity and pressure measurements can be performed.
Techcon Systems Partners with Repstronics in Mexico
Publication Date: 5/18/2016

GARDEN GROVE, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce its new manufacturers’ representative in Mexico – Repstronics. Founded in 2003, Repstronics has more than 12 years of experience in the market, focusing on selling capital equipment, products and consumables to the Mexican market, with offices in the main industrial cities of Mexico.
Marvin Test Solutions Expands GENASYS Platform Offerings
Publication Date: 5/18/2016

IRVINE, CA - Marvin Test Solutions, Inc., a trusted provider of globally-deployed innovative test solutions for military, aerospace, and manufacturing organizations, announces two new products for the GENASYS functional test platform.

Ironwood Electronics: Stamped Spring Pin Universal BGA Socket for Memory Devices
Publication Date: 5/18/2016

EAGAN, MN - Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for memory devices - CBT-BGA-6048. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and contact resistance is <30mOhms.
Cornell Dubilier Presents 2015 Sales Growth Award to Digi-Key
Publication Date: 5/17/2016

Liberty, SC - Cornell Dubilier Electronics, Inc. was pleased to present the 2015 Sales Growth Award, for outstanding channel partner sales growth, to Digi-Key Electronics at EDS 2016.

“In a year that could be described as challenging, Digi-Key exceeded expectations and led our sales channel with significant growth. The support at all levels has been exceptional.
Euresys, Framos' Partner for Frame Grabbers, Announces the Compatibility of its Coaxlink Frame Grabbers with AMD's DirectGMA Technology
Publication Date: 5/17/2016

MUNICH, GERMANY - In recent years, powerful smartphones and tablets have become increasingly widespread. Most people have become used to impressive interfaces with animations and graphic effects, playing full HD videos with no slowdowns and recording high-resolution videos that can be compressed with very little loss of detail.
Metcal Offers Free Soldering System with the Purchase of a Fume Extraction System
Publication Date: 5/17/2016

GARDEN GROVE, CA - Metcal is pleased to announce its Spring Promo, where customers can get a FREE MFR-1100 soldering system with the purchase of the two-operator BVX-201-KIT1 Fume Extraction System. The promotion is effective immediately and ends June 30, 2016.
Rehm wins the “EM ASIA Innovation Award”
Publication Date: 5/17/2016

SEISSEN, GERMANY - With VisionXP+ Vac, Rehm Thermal Systems has developed an innovative system for reflow convection soldering with vacuum, for which it has won the “EM ASIA Innovation Award 2016”. This system allows the German engineering company to achieve void-free soldering results in electronics production.
Vi TECHNOLOGY Extends its Distribution Agreement with American Tec in China
Publication Date: 5/16/2016

 Jean-Marc Peallat – Vice President, Global Sales of Vi TECHNOLOGY, Ong Kay Huat – CEO of American Tec, and Jacky Zhou, Regional Sales Manager, China for Vi TECHNOLOGY
SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to announce the appointment of American Tec as its distributor. Under the agreement, American Tec will distribute Vi TECHNOLOGY’s complete inspection solutions throughout all of China.

Ong Kay Huat (KH), CEO of American Tec, commented: “The strongest partnership must be able to withstand the test of time and we are truly excited to renew our cooperation with Vi TECHNOLOGY since the relationship first started in year 2008.
CREFORM Breaks Ground on New Production and Technical Support Center
Publication Date: 5/16/2016

 Dignitaries provide the ground breaking start to Creform Corporation’s new 35,000 sq.ft. facility in Georgetown, Kentucky.
GREER, SC - Creform Corporation, manufacturer of adaptive material handling systems such as workstations, flow racks, carts and AGVs has broken ground on a new production and administration facility in order to meet the demands of an ever-expanding customer base.

The location in Georgetown, KY puts Creform in close proximity to its many large customers in the region and provides a pivotal location between its Greer, SC headquarters and Novi, MI Tech Center.
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