Sunday, September 25, 2016
Publication Date: 02/1/2012
Home/Current Issue >  Daily News Archive > 
KYZEN Offers IPA Alternatives for Stencil Cleaning at productronica India
Publication Date: 9/22/2016

NASHVILLE, TN KYZEN today announced plans to exhibit with its distributor, Kreative Technologies, in Booth #3429 at productronica India, September 21-23, 2016 in Bangalore. The KYZEN team will highlight IPA replacements and its AQUANOX® A4625 versatile aqueous cleaning chemistry.

Saline Lectronics Procures Its Third Juki Fortress for High-Volume Assemblies
Publication Date: 9/21/2016

SALINE, MI Saline Lectronics, Inc., a leading electronics contract manufacturer, recently purchased and installed its third StorageSolutions Fortress (ISM2000XL) from Juki. The Fortress is designed for optimal management of larger dimension reels. Now, Lectronics’ three Fortresses will store all of the necessary material to run high-volume assemblies that the company manufactures regularly.

Henkel to Show Broad Portfolio of Enabling Technologies at SMTA International 2016
Publication Date: 9/21/2016

IRVINE, CA – From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing
Publication Date: 9/21/2016

Concord, CA - Nordson MARCH, a global leader in plasma cleaning technology, introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Mentor Graphics join new thought-leadership program ‘ScoopTalk’ at SMTA International
Publication Date: 9/21/2016

ROSEMONT, IL - SMTAI 2016 will see the launch of ScoopTalk, an innovative program of roundtable discussions which brings together the biggest players and brightest minds in the industry to debate the industry's hottest subjects. Today, Mentor Graphics confirmed their participation as an ‘Influencer’ sponsor with Michael Ford and Jay Gorajia joining in as panellists. 

New ASM manufacturers’ representative: Performance Technologies Group (PTG)
Publication Date: 9/21/2016

MUNICH, GERMANY - ASM Assembly Systems announces that it has partnered with Performance Technologies Group as its manufacturers’ representative for its DEK and SIPLACE brands in New England, New York, New Jersey, Maryland, Delaware, West Virginia and eastern Pennsylvania. “We are very excited to be partnering with Performance Technologies Group in the northeastern United States,” stated Brian Smith, ASM’s Director of USA Sales.
Indium Corporation Products Live@SMTAI
Publication Date: 9/20/2016

CLINTON, NY - Indium Corporation will be running its low-voiding solder products Live@SMTAI in partner booths throughout SMTAI on September 27-28 in Rosemont, Ill.      

Live@SMTAI places Indium Corporation products into live equipment demonstrations on the SMTAI show floor. The program, a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. 
Koh Young Technology Exhibiting 3D AOI, SPI Solutions at SMTA Guadalajara Expo & Tech Forum
Publication Date: 9/20/2016

SEOUL, KOREA - Koh Young Technology will exhibit its world-leading 3D AOI and SPI solutions at the SMTA Guadalajara Expo & Tech Forum, Wednesday October 5 and Thursday October 6, 2016, at Hotel Riu Guadalajara, Mexico. On display will be the KY8030-3 3D Solder Past Inspection (SPI) with dual projection, and the Zenith 3D Automated Optical Inspection (AOI) with its groundbreaking 8-way projection system.
Panasonic Launches PanaCIM® Enterprise Edition 10 Manufacturing Execution System
Publication Date: 9/19/2016

Rolling Meadows, ILPanasonic Factory Solutions Company of America has launched PanaCIM Enterprise Edition 10, a new, architecturally-innovative version that effectively delivers a feature-rich, manufacturing software suite through a scalable, small-footprint appliance that can grow with the manufacturer, while providing unprecedented integration of Panasonic and best-in-class complementary technology partner equipment.

Ventec VT-901 Reliability Validated by HATS Testing at Key Israeli Customers
Publication Date: 9/19/2016

SUZHOU, CHINA - Ventec International is proud to announce that the reliability of its VT-901 polyimide laminates, prepregs and low-flow prepregs has been conclusively demonstrated by Highly Accelerated Thermal Stress (HATS) testing by two leading PCB manufacturers in Israel.

PCB Technologies tested VT-901 materials in complex high layer count rigid multilayer constructions, Eltek’s testing also included high layer count flex-rigid multilayers and VT-901 easily satisfied the test criteria in all examples.
Parker Unveils New Wireless Sensor Products at Sensors Midwest
Publication Date: 9/19/2016

Golden Valley, MNAs the Internet of Things (IoT) leaps forward, Parker Hannifin Corporation, the global leader in motion and control technology, continues to introduce new products rooted in diagnostics and condition monitoring. Parker is introducing an expanded SensoNODE™ product line at this year’s Sensors Midwest conference in Rosemont, Ill.

The latest additions to the SensoNODE product line include:

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness
Publication Date: 9/19/2016

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

KYZEN to Present Innovations to Address the Challenges of Cleaning Highly Dense Electronic Hardware at IEMT-EMAP 2016
Publication Date: 9/19/2016

NASHVILLE, TN - KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

Herrmann Ultrasonics, Inc. expands on the West Coast
Publication Date: 9/19/2016

BARTLETT, IL - Herrmann Ultrasonics has invested in increasing their presence in California with a new expanded Tech-Center. The Irvine, California facility has tripled the local lab size and will offer increased technical support capabilities.

In honor of the new technology center’s grand opening Herrmann Ultrasonics is proud to be offering an inaugural Technology Day event on September 29th, 2016.
Publication Date: 9/16/2016

HUNTINGDON VALLEY, PA - Manncorp has just introduced the new 4040 Vapor Phase Soldering System — a new generation of vapor phase that allows SMT assemblers to easily and affordably capitalize on this trusted technology’s numerous advantages.  Superior soldering quality, instant product changeovers, and 0% risk of overheating are just a few reasons vapor phase systems like the 4040 are, for many, a much better option than inline convection ovens. 
Zollner Partners with Plug and Play to Pair Innovation with World-class Manufacturing in Health & Fitness, Smart Home and Mobility Markets
Publication Date: 9/16/2016

SUNNYVALE, CA - Zollner, the world’s largest privately owned EMS company with facilities in Silicon Valley, Costa Rica and throughout the world, has partnered with Plug and Play, a global startup ecosystem and venture fund specializing in the development of early-to-growth stage technology startups.
New Accessories For OKW CARRYTEC Portable Instrument Enclosures
Publication Date: 9/16/2016

 Now even more portable – OKW has added a shoulder strap and brackets to the CARRYTEC range
BRIDGEVILLE, PA - OKW has added a new shoulder strap and brackets to its accessories for CARRYTEC portable instrument enclosures.

Versatile CARRYTEC can be carried, clipped to a round tube bedrail for medical applications or mounted on a desk, wall or suspension arm.

The new black adjustable strap is wedge-shaped to ensure optimum load distribution and to prevent it from slipping off the shoulder.
ASM brings the Smart #1 SMT Factory to SMTA International
Publication Date: 9/16/2016

 ASM presents multiple innovative solutions and components that help electronics manufacturers achieve the Smart SMT Factory.

SUWANEE, GA - After a very successful APEX 2016 and various regional events across the Americas, ASM will continue to showcase its Smart # 1 SMT Factory concept at SMTA International in Rosemont IL on September 27th and 28th. Visitors will be able to see the newest machines, from ASM’s range of DEK Screen Printers and SIPLACE Pick and Place platforms, as well as ASM line and factory software tools and Process Support Products that can help improve yield and throughput in your SMT process.

SnapEDA launches InstaPart: On-demand symbols and footprints delivered in 24 hours
Publication Date: 9/15/2016

SAN FRANCISCO, CA - Today, SnapEDA, the Internet’s market-leading electronics design library, launched InstaPart, an on-demand service that delivers symbols and footprints to designers’ inboxes in less than 24 hours for only $29 per component, keeping designers focused on innovation, and product development on track.

Glenbrook Technologies Introduces Two New Models of Popular Jewel Box X-ray Inspection Systems
Publication Date: 9/15/2016

RANDOLPH, NJ - The Jewel Box Ultra Compact is a full featured microfocus x-ray system that can easily fit on a desk or in a small lab. It offers up to 500x geometric and 2,000x electronic magnification. The system includes a 5 axis positioner with 360 degree rotation and 45 degree tilt. Any of our line of GTI image processing software packages can be added including the GTI-5000 with auto-BGA analysis and void measurement.

search login