Friday, May 27, 2016
VOLUME -25 NUMBER 8
Publication Date: 08/1/2010
Advertisements
HOME / CURRENT ISSUE >  Daily News Archive > 
North American Semiconductor Equipment Industry Posts April 2016 Book-to-Bill Ratio of 1.10
Publication Date: 5/25/2016

 
Alpha Assembly Solutions to Showcase High Relialbity LED Soldering Materials at GILE 2016 in Guangzhou
Publication Date: 5/24/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, plan to showcase their vast LED materials portfolio and will present a technical paper at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.
Advanced Technology Workshop & Tabletop Exhibits on Additive Manufacturing & Printed Electronics
Publication Date: 5/24/2016

LOWELL, MA - The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop on ADDITIVE MANUFACTURING and PRINTED ELECTRONICS on June 28-29, 2016. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable.
 
 
GCT delivers 10 million dual USB connectors for Raspberry Pi application
Publication Date: 5/24/2016

LAWRENCE, MA - Global Connector Technology (GCT) has shipped its ten millionth Dual USB connector USB1035 for the Raspberry Pi. Two dual USB connectors are used on each Raspberry Pi device to enable the attachment of peripherals such as keyboards, mice and webcams which provide the Pi with additional functionality.
 
 
EIS: Durable, Versatile SEOOW Portable Power Cord Offers Powerful Flexibility
Publication Date: 5/24/2016

SOUTH HADLEY, MA - EIS Wire & Cable Co. has added an SEOOW Portable Power Cord to its diverse line of cables, providing a versatile, durable option for non-permanent commercial and industrial applications requiring multi-conductor, higher-voltage power distribution.
Indium Corporation VP of Technology to Chair Workshop on Pb-Free Soldering Reliability at ECTC
Publication Date: 5/24/2016

CLINTON, NY - Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at the Electronic Components and Technology Conference (ECTC), on May 31-June 3 in Las Vegas, Nev.

The professional development course will explore the detailed material considerations required for achieving high reliability in lead-free solder joints.
Digicom Electronics Presents Diamond Track EMS Services at the Design-2-Part Show, Santa Clara, CA
Publication Date: 5/24/2016

OAKLAND, CA - Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, presents its Diamond Track electronics manufacturing services at the Design-2-Part Show in Santa Clara, CA on June 8 and 9th, in booth 331. The program incorporates Digicom's Diamond Track Cleaning services to ensure printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries.
SEMI: First Strategic Materials Conference in Korea - a Success
Publication Date: 5/23/2016

SEOUL, KOREA - SEMI announced today that the first SEMI Strategic Materials Conference (SMC) was held in Korea COEX in Seoul on May 18. This deep technical conference program attracted 258 attendees from 81 companies. Advanced materials critical to scaling technology in semiconductor manufacturing industry bring challenges including innovation speed, cost effectiveness, performance, quality management and environmental issues.
Broadcom Selects Avnet as Exclusive Broadline Distributor in the Americas and EMEA
Publication Date: 5/23/2016

PHOENIX, AZ - Avnet, Inc. (NYSE:AVT), a leading global technology distributor, today announced an expanded, exclusive distribution agreement with Broadcom Limited (Nasdaq:AVGO). Under the new agreement, Avnet will serve as the exclusive broadline distributor for Broadcom in the Americas and EMEA regions. Avnet will also continue its franchise in Asia.
 
Ersa Offers Solutions for Challenging Rework Applications
Publication Date: 5/23/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 30, 2016 at the Marriott Minneapolis Southwest.
LPKF: New Laser Solutions for Innovative Interconnects at ECTC in Las Vegas
Publication Date: 5/23/2016

TUALATIN, OR - LPKF Laser & Electronics has announced it will exhibit at the 2016 Electronic Components and Technology Congerence (ECTC) which will be held June 1-2, 2016 at The Cosmopolitan in Las Vegas, NV.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505
Publication Date: 5/23/2016

SAN JOSE, CA - SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
DYCONEX Celebrates Its 25th Anniversary
Publication Date: 5/20/2016

BASSERSDORF, SWITZERLAND - DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016. Even so, the company can look back upon more than 50 years of experience in the fabrication of printed circuit boards. Back in 1964, a new division within Oerlikon-Contraves devoted to the manufacturing of circuit boards was established.
 
Indium Corporation Expert Presents at SMTA Silicon Valley PCB Cleaning Technology Roundtable
Publication Date: 5/19/2016

CLINTON, NY - Indium Corporation’s Sehar Samiappan, Regional Manager for Northern California, presented Pb-Free Flux Technology and Influence on Cleaning at the SMTA Silicon Valley Chapter’s PCB Cleaning Technology Workshop and Roundtable Discussion on May 19 in San Jose, Calif.

This presentation detailed the challenges of Pb-free soldering, including temperature settings, wetting, miniaturization, air reflow, and halogen-free.
 
Jason Fullerton of Alpha Assembly Solutions to Present on Divergence in Test Results at Upcoming SMTA Philadelphia Expo & Tech Forum
Publication Date: 5/19/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Philadelphia Expo & Tech Forum on June 9th in King of Prussia, PA as both an exhibitor and technical presenter.
 
Motion & Control Industry 2016 Awards Manufacturer of the Year Is PI (Physik Instrumente) UK
Publication Date: 5/19/2016

AUBURN, MA - Motion control and nanopositioning application solutions expert PI (Physik Instrumente) UK was named Manufacturer of the year at the 2016 Motion and Control Industry (MCI) Awards at the National Conference Centre, near Birmingham, UK. The ceremony, held in April, recognized both individuals and companies as the best of the best in the motion control industry.
Link Electronics Announces New Management
Publication Date: 5/19/2016

JACKSON, MO - Link Electronics announces the retirement of founder Bob Henson, and new ownership by industry veteran Dave Kendall. With 30 plus years in the technology and electronics industry, along with electrical engineering experience as an officer in the US Navy, Kendall brings a wealth of insight and perspective to his new role. He started in sales and marketing and worked his way into executive roles, bringing extensive knowledge, passion, leadership and drive for innovation.
SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505
Publication Date: 5/19/2016

SAN JOSE, CA - SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance.
VTT delivers world's first industrial internet solution for a printed electronics plant
Publication Date: 5/18/2016

ESPOO, FINLAND - VTT's printed electronics pilot plant in Finland has moved into a new era – an industrial internet-based solution, the first for the printed electronics production in the world, has been installed for the control of the plant. Environmental conditions affecting sensitive roll-to-roll production can be monitored, and temperature, humidity and pressure measurements can be performed.
Techcon Systems Partners with Repstronics in Mexico
Publication Date: 5/18/2016

GARDEN GROVE, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce its new manufacturers’ representative in Mexico – Repstronics. Founded in 2003, Repstronics has more than 12 years of experience in the market, focusing on selling capital equipment, products and consumables to the Mexican market, with offices in the main industrial cities of Mexico.
 
 
search login