Tuesday, June 28, 2016
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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Ventec International Group complete acquisition of TMT Trading
Publication Date: 6/24/2016

SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced that effective 1st July 2016, TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- & rigid-flex circuit board materials, will be integrated into Ventec International Group.
Introducing the ELM-800 Laser Marker by Eunil
Publication Date: 6/24/2016

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, introduces the ELM-800 Laser Marker.

The Eunil in-line ELM-800 Laser Marker is an automation machine used to add a barcode, QR, 1D, or 2D on PCBs.
 
Brilliant Response to FRAMOS’ Image Sensor Tech Days
Publication Date: 6/23/2016

MUNICH, GERMANY - FRAMOS’ Sensor Tech Days, the successor event of FRAMOS’ famous CCD Forums in the 1990s, got very positive feedback from both attendees and the presenting technology partners. The two-day seminar focussed on technical image sensor details and development outlooks by SONY (day one) and ON Semiconductor (day two) and was complemented by a custom-sensor deep dive by Pyxalis and lab testing results from FRAMOS’ application engineering team.
Horizon Sales Hires Joshua Casper to Cover Areas of Michigan & Ohio
Publication Date: 6/22/2016

HOWELL, MI - Horizon Sales, a leading manufacturers’ representative corporation, specializing in the sales and marketing of premier electronics assembly equipment, today announced that effective immediately, Joshua Casper has joined the sales team, covering Eastern Michigan and Northern Ohio.

STI Acquires New AOI System from Nordson YESTECH
Publication Date: 6/22/2016

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce that it has acquired a new Nordson YESTECH FX-940 ULTRA 3D Automated Optical Inspection (AOI) system.
Engineering Giant ABB is Investing Heavily in the United States, a Beacon for Entrepreneurship and Technological Innovation
Publication Date: 6/22/2016

WASHINGTON, DC- As the US presidential election enters its final stages, there is much talk on both sides about the state of the US economy and how to position it in the future.

From my perspective, the United States still is a leading nation in the world when it comes to entrepreneurship and technological innovation.
 
KYZEN to Show Cleaners for Wafer Bumping, Wire Bonding and Cu Pillar Flip Chip Applications at SEMICON West
Publication Date: 6/22/2016

NASHVILLE, TN - KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
WACKER Expands Production Capacity For Silicone Sealants and Specialty Silicones
Publication Date: 6/22/2016

 
 Encapsulating LED chips in silicone gels is becoming increasingly common –
These kinds of gels
will be manufactured at the new production site
in Jincheon, South Korea. (Photo: Wacker Chemie AG)
MUNICH, GERMANY - Wacker Chemie AG is expanding its silicone elastomer production capacity in Jincheon, South Korea. The new facilities will include production plants for silicone sealants, specialty silicones and liquid silicone rubber. At the same time, existing production units in Jincheon will be transferred to the new site. Investments for the expansion will total around €16 million. Construction work will officially start end of July, production is expected to begin in the first quarter of 2018. The new expansion project is WACKER’s response to growing regional demand for silicone elastomers in the construction, electronics and automotive industries.
 
IDT Collaborates with Cavium to Support Hyperscale Data Centers
Publication Date: 6/21/2016

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced its collaboration with Cavium, Inc., on a reference design that supports the burgeoning workloads of the hyperscale data center. The IDT® DDR4 memory interface solutions are incorporated into the reference design, which is built on Cavium’s ThunderX family of workload-optimized 64-bit ARMv8-based processors.
Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities
Publication Date: 6/21/2016

 
 New in SEMulator3D 6.0, the Electrical Analysis module adds powerful resistance and capacitance extraction to deepen the understanding of process and design sensitivities.
CARY, NC - Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.0 - the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features, usability enhancements and a new add-on capability for electrical analysis.
MOHR Test and Measurement, LLC (MOHR): Meet the Industry's First TDR Cable Analyzer with Frequency Domain S-Parameter Measurements
Publication Date: 6/21/2016

RICHLAND, WA - Although Time-Domain Reflectometer (TDR) cable testers are prized for their ability to detect and localize cable faults and measure cable length, they have not been able to characterize the frequency domain microwave/RF performance of cables and connectors like instruments based on Vector Network Analyzer (VNA) technology.
 
U.S.Tech: Still Time Left to Promote Your Company at SEMICON West
Publication Date: 6/21/2016

SEMICON West is right around the corner. With only a few weeks until the show, we still have space in the July issue of U.S.Tech for you to promote your company through advertising and PR. Deadline for material is June 28.

This issue is focused on test and assembly and will include 15 articles from all over the industry. These include a section showcasing various EMS companies and their developments, as well as the test and assembly feature articles.

If you are interested in any of our promotional opportunities, please contact our office at 610-783-6100 or
mail@us-tech.com. See you July 12-14 at SEMICON West!
Eunil Presents the Highly Accurate ECM-350 Table Coating Master
Publication Date: 6/21/2016

CHULA VISTA, CA - Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, presents the ECM-350 Table Coating Master, a highly accurate offline machine for small-quantity batch production.

Printed circuit boards (PCBs) are the foundation for electronics in every day products including automotive, consumer electronics, communications, and industrial and energy applications.
Juki Introduces the JX-350 LED Long Board Machine 1.5m
Publication Date: 6/21/2016

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to introduce the new JX-350 LED mounter. The JX-350 LED supports a wide variety of LED nozzles and can place up to six diffusing lenses over the top of the LED simultaneously for backlighting applications.
Hammond Introduces Miniature Enclosures Optimized for USB Interconnect
Publication Date: 6/20/2016

CHEEKTOWAGA, NY - When USB3.0 was introduced, offering theoretical data signaling rates of 5Gbits/s compared with the 480Mbits/s available from USB2.0, the protocol became significantly more useful across a variety of applications. The latest standard to be published, USB3.1, further increases performance to 10Gbits/s and reduces line encoding overhead. All flavors use a Type A standard plug as the interface to the host machine.
 
Digi-Key: "RF Digital Corporation Rfduino | Digi-Key Daily"
Publication Date: 6/20/2016

Torenko & Associates Hires Salesman in Chihuahua, Mexico
Publication Date: 6/20/2016

SUNNYVALE, TX - Torenko and Associates, a leading manufacturers’ representative organization specializing in the sales and marketing of premier electronic assembly equipment, production tools, test, repair, inspection and consumable products, has hired Julio Richards. A seasoned veteran, Richards joins the company’s sales team in Chihuahua, Mexico.

Richards earned his degree in Mechanical Engineering from the Instituto Tecnológico de Chihuahua.

VJ Electronix Strengthens Its Sales and Technical Support in California
Publication Date: 6/20/2016

LITTLETON, MA - VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, has appointed DiversiTech Representatives, Inc. as its sales representative. DiversiTech will represent VJ Electronix throughout Southern California and Northern Baja California.

“VJ Electronix is well-known in the Southern and Baja California marketplace for its innovation and leading-edge X-ray and rework solutions, while offering the best in quality, reliability and value,” explains Ron Rau.
Ironwood Electronics: 27 GHz Bandwidth Socket for Xilinx FPGA
Publication Date: 6/17/2016

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 2104 pin BGA IC's. The SG-BGA-6444 socket is designed for IC size - 47.5x47.5mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss.
 
Easier Test of DIMM Sockets with Universal JTAG Hardware
Publication Date: 6/17/2016

EINDHOVEN, THE NETHERLANDS - JTAG Technologies – a specialist in board (PCBA) test solutions based on JTAG and IEEE 1149.x standards announce a new family of hardware adapters specifically designed for testing of a variety of DIMM & SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software.
 
 
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