Saturday, October 22, 2016
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Good news for the climate: Highly efficient catalysts from Heraeus reduce dangerous nitrous oxide greenhouse gas emissions by 95%
Publication Date: 10/20/2016

 Small spheres encased in precious metals destroys nitrous oxide produced in reactors for manufacturing nitric acid.
HANAU, GERMANY - Europe, the US and China were among those ratifying the historic Paris agreement, which will go into effect at the beginning of November. The agreement aims to help keep the earth’s temperature from rising more than 2°C. The Nitric Acid Climate Action Group, formed in December 2015 at the global climate summit, will also work hard to meet climate targets. As part of its efforts, the Group will focus on reducing climate-altering nitrous oxide emissions from fertilizer production and in the chemical industry by 2020. Now, highly efficient catalysts from Heraeus can reduce nitrous oxide emissions by up to 95%.
WACKER Presents Product and Technology Innovations for Key Industries
Publication Date: 10/19/2016

 WACKER presents innovative technology for additive
manufacturing of silicones. 3D technology allows printing
complex geometries such as internal lattices. (Photo: Wacker Chemie AG)
MUNICH, GERMANY - At K 2016, the Munich-based chemical company WACKER is presenting itself as an innovation driver for the plastics and rubber processing industry. In Hall 6, Booth A10, the company is showcasing more than a dozen new products and two technology innovations for key industries in the automotive, electronics, lighting and healthcare sectors. Highlights include textile sensors made from thin silicone films, highmodulus silicone rubber grades, crystal clear silicone encapsulants for LEDs and optical lenses as well as additives for manufacturing woodplastic composites.
Techcon Systems Introduces New Positive Displacement PC Pump
Publication Date: 10/19/2016

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce the introduction of the new TS8100 Series Positive Displacement PC Pump. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.

Techcon’s PC Pump uses a special stator and rotor design to provide accurate and consistent dispensing output.

Mill-Max Offers USB 3.1 Type C Vertical SMT Receptacle
Publication Date: 10/19/2016

OYSTER BAY, NY - Mill-Max has added the Vertical SMT SuperSpeed Universal Serial Bus 3.1, Type C to its line of USB IO Sockets. This receptacle is 2X faster than USB 3.0 with more efficient data transfer, higher through-put and improved I/O power efficiency. Mill-Max already carries the USB 3.1 Top Mount and Mid-Mount style receptacles.

DEN-ON INSTRUMENTS Honors Its Longest Employee
Publication Date: 10/19/2016

TOKYO, JAPAN - DEN-ON INSTRUMENTS, CO., LTD. is pleased to announce that its Factory Manager – Mr. Masaaki Uchiyama, is the company’s longest term employee. Mr. Uchiyama started with DEN-ON right after high school at 16 years old and, 28 years later, he is the longest term employee in DEN-ON’s 53-year history.

Mr. Uchiyama developed his skills through hard work and self-motivation, and eventually was promoted to Factory Manager.
Rehm Expands Presence in Mexico
Publication Date: 10/19/2016

 The Rehm team at the inauguration of the new Technology Centre in Guadalajara
JALISCO, MEXICO - Rehm Thermal Systems has been present in sales and service partners in North America and Latin America for several years. Large automotive suppliers and global electronics manufacturers are increasingly located in Mexico. Rehm has taken account of this development and established its own branch office in Guadalajara in 2014 for distribution, spare parts supply and service.
SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials
Publication Date: 10/18/2016

San Jose, CA - SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon. 

Alpha Launches New tensoRED™ Master Tensioning Frame
Publication Date: 10/18/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce the launch of its new tensoRED™ Master Tensioning Frame, the latest development in Alpha’s range of state-of-the-art printing stencils.
Ironwood Electronics: Socket your PoP BGA500 using Extreme Temperature Socket with Superior Electrical Performance
Publication Date: 10/18/2016

EAGAN, MN - Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-BGA-6538. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions.
PDR Americas Launches the First Intra-Ocular-Adjustable Thermal Sensor for High-End Rework
Publication Date: 10/18/2016

SHINGLE SPRINGS, CA - PDR Americas, a leader in IR rework, test and inspection, today introduced the EMS industry’s first intra-ocular-adjustable ‘read zone’ thermal sensor for high-end rework. The rework-specific temperature sensor has been specifically engineered for rework environments, providing the accuracy and confidence needed for high-yield rework program success.
Ersa’s HR 550 Hybrid Rework System Addresses Users with the Highest Requirements – Learn More at SMTA New England
Publication Date: 10/18/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit at the SMTA New England Expo & Tech Forum, scheduled to take place Thursday, Nov. 3, 2016 at the DCU Center in Worcester, MA. Ersa’s team will highlight the HR 550 hybrid rework system and Smartflow 2020.

EOS Power Releases New Record-Breaking Low Profile Product Series & extends warranty options at Electronica 2016
Publication Date: 10/18/2016

Mumbai/Munich— EOS Power, designer, manufacturer and seller of high efficiency and small size Power Supplies, will present its new Ultra Low Profile (ULP) series of Medical and Commercial, High Efficiency, High Power Density AC/DC power supplies at Electronica 2016 in Munich. The new (M)ULP 180 & 250 Watt Series have power densities which reach 30 watts per cubic Inch with maximum height profiles of 0.75 Inches (19.05mm).
ScoopTalk at SMTAi 2016 Roundtable - Future Technologies for Electronic Manufacturing
Publication Date: 10/17/2016

Philip Stoten is joined by Libra Industries CEO Rod Howell, Mentor Graphics' Jay Gorajia and ASM's Jeff Timms to discuss the technology demands from the industry and the solutions on offer from the industry. The panel discusses the need for open systems, collaboration and the ability to see the big picture rather than focus on the minutia.

Filmed on location at SMTAi in Chicago on the ScoopTalk studio, hosted by EMSNow, Mexico EMS and US Tech and sponsored by Aegis Software, ASM Assembly Systems, Fuji America, KIC and Mentor Graphics.
KIC: MB Allen to Present Recent Research at the SMTA Space Coast Expo
Publication Date: 10/17/2016

SAN DIEGO, CA - KIC today announced plans to exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 17, 2016 at the Melbourne Auditorium in FL. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11 a.m.
Amphenol NTC Thermistors | Digi-Key Daily
Publication Date: 10/17/2016

Cirtronics Installs Powerful 3D AOI Solution for Accurate Inspection Results
Publication Date: 10/14/2016

DULUTH, GA - Viscom is pleased to announce that it has been selected by Cirtronics for its 3D AOI. Based in Milford, NH, Cirtronics has added an S3088 ultra blue AOI system to each of their production lines in its 175,000 sq. ft. manufacturing space.

The Cirtronics team conducted extensive evaluations on the S3088 ultra blue and competitive systems and found the Viscom units to be superior.
Dymax Improves Multi-Cure® 9451 Black Conformal Coating with New UL Certification
Publication Date: 10/14/2016

TORRINGTON, CT - Dymax 9451 Conformal Coating has received a UL V0 flammability certification for materials used in printed wiring boards. Formulated for UV cure and secondary heat cure, this security enhancing material is ideal for environmental protection of PCBs, wire harnesses, electronic components, and other surfaces needing a protective coating. Its opaque black color is intended to cover markings, labeling, other identification as well as sensitive information on the circuit board, and is targeted for tamper evident applications.

KIC: Optimize Your Reflow Profile at the SMTA New England Expo Booth 604
Publication Date: 10/14/2016

SAN DIEGO, CA - KIC today announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference’s Session 4 to Focus on Customer Cleaning Challenges/Needs
Publication Date: 10/14/2016

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
SEMI: 200mm Fabs on the Rise
Publication Date: 10/13/2016

SAN JOSE, CA - One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has issued an October 2016 update, with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity have changed worldwide. SEMI’s analysts updated information on almost 200 facilities, including new facilities and closures of existing facilities.
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