Friday, August 26, 2016
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Alpha to Feature No-Clean, Lead-Free Touch-Up Kit at Upcoming SMTA International
Publication Date: 8/24/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is going to feature its no-clean, lead-free material set combination for touch-up operations at the SMTA International exhibition, taking place September 27th-28th in Rosemont, Illinois.

Dymax: Easily Removable Electronic Mask Cures in Seconds to Maximize Production Speed
Publication Date: 8/24/2016

TORRINGTON, CT - Dymax Corporation recently launched maskant SpeedMask® 9-20479-B-Rev-A- a blue, light-curable peelable maskant for PWB connectors and board level protection. This SpeedMask resin is designed for protection of electronic components and assemblies, provides protection from reflow or wave soldering operations, and shields keep-out areas during conformal coating applications.
ASTEELFLASH in the Top 20 Manufacturers of the Bay Area by San Francisco Business Times
Publication Date: 8/24/2016

FREMONT, CA - Asteelflash has been ranked among the top 20 Manufacturers of the Silicon Valley / Bay Area by the San Francisco Business Times.
CyberOptics: Maximize Yields with MRS-Enabled SQ3000 3D AOI Featured at SMTAI
Publication Date: 8/24/2016

MINNEAPOLIS, MN - CyberOptics® Corporation (NASDAQ: CYBE) today announced plans to exhibit in Booth #1021 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The SQ3000™ 3D Automated Optical Inspection (AOI) system, deemed best-in-class, will be on display for live demonstrations.
Sensoray: USB 3.0 Video Capture in SDI or DVI
Publication Date: 8/23/2016

TIGARD, OR - Sensoray introduces its new Model’s 3364 a USB 3.0 device available in SDI or DVI versions. It captures uncompressed SD/HD video in resolutions up to 1080p60 and uses H.264 video compression for inputs up to 1080p30, both with very low latency. A USB 3.0 device, it is capable of capturing uncompressed video at full frame rates and simultaneously sending uncompressed (preview) and compressed streams to the host.
Keystone Electronics: Color Coded, Auto Blade Fuse Holders
Publication Date: 8/23/2016

ASTORIA, NY - Identifying Automotive Blade Fuses on PCBs is now “quick and simple” with the colored insulator bodies now available as the latest addition to Keystone Electronics highly-regarded series of low insertion force, compact Auto Blade Fuse Holders.

Rated for 20 AMPs, 500VAC continuous usage, these new holders are available in Surface Mount (SMT) and Thru-Hole (THM) types.
Panasonic Launches New PanaCIM Maintenance for Asset Management
Publication Date: 8/23/2016

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America has launched a new PanaCIM® Maintenance solution to control the full life cycle of any manufacturing asset. PanaCIM Maintenance brings innovative, value-added elements to help manufacturers streamline processes, reduce costs, increase uptime, and improve efficiencies.
Indium Corporation Technology Expert to Present at IMAPS ATW on Advances in Semiconductor Packaging
Publication Date: 8/23/2016

CLINTON, NY - Indium Corporation's Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.

NEO Tech Ranks on the Inc. 5000, Inc. Magazine’s 35th Annual List of America’s Fastest-Growing Private Companies
Publication Date: 8/23/2016

CHATSWORTH, CA - NEO Tech, a leading provider of microelectronics, engineering and manufacturing services, and supply chain solutions for brand name OEMs in the industrial, medical and military/aerospace markets, announces that it placed on Inc. magazine’s 35th annual Inc. 5000, the most prestigious ranking of the nation’s fastest-growing private companies.
SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste
Publication Date: 8/23/2016

SAN JOSE, CA - SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Vi Technology: 3D SPI with Unambiguous Z Referencing and Warpage Compensation
Publication Date: 8/23/2016

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with AXIS AUTOMATION in Hall 3 – Booth 3141 at ELECTRONICA India, scheduled to take place September 21-23, 2016 at the BIEC- Bangalore International Exhibition Center. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI.
SCS: The Leader in Parylene Conformal Coatings Will Exhibit at the New Sensors Midwest Expo
Publication Date: 8/22/2016

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) is pleased to announce that it will exhibit in Booth #709 at the Sensors Midwest Expo, taking place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. SCS will discuss its Parylene coating services for the electronics, defense, medical device and automotive industries.
New RSM for the Southwest at Metcal
Publication Date: 8/22/2016

CYPRESS, CA - Metcal today announced that it has hired a new Regional Sales Manager for the Southwest. Gabriel Ortiz will manage Arizona, New Mexico, Texas, Oklahoma, Louisiana, and Mexico and South America.

Ortiz brings more than 20 years of experience servicing the electronics manufacturing industry, with a unique touch in that he has successfully lead teams in both the manufacturing and distribution environments to develop his business.
‘ScoopTalk’ brings together thought-leaders, brands, manufacturers and suppliers at SMTAI to debate the electronics industry’s hottest topics
Publication Date: 8/22/2016

At SMTA International 2016 (SMTAI), scheduled to take place in Rosemount, Illinois, September 27th – 28th 2016, Scoop will launch a new thought-leadership program and platform entitled ScoopTalk that will bring together the biggest players and brightest minds in the industry, to debate the industry's hottest topics – filmed onsite in the ScoopTalk Studio on booth #545.
NEO Tech to Showcase Leading Medical Design & Manufacturing Solutions at MD&M Minneapolis 2016 Exhibition
Publication Date: 8/19/2016

CHATSWORTH, CA - NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it will highlight its medical design service solutions, as well as medical device repair and refurbishment, and miniaturization services for implantable medical electronics in booth 2445 at the 2016 MD&M Minneapolis Exhibition, scheduled to take place September 21-22 at the Minneapolis Convention Center.
Alpha’s Ravi Bhatkal Elected to iNEMI Global Board of Directors for a Second Term
Publication Date: 8/19/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, announces the election of their Vice President of Energy Technologies, Ravi M. Bhatkal, Ph.D., to the iNEMI Global Board of Directors for a second term.

The iNEMI organization roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects.

PI: New Compact Micro-Translation Stage for Single and Multi-Axis Precision Positioning is Fast and Precise
Publication Date: 8/19/2016

AUBURN,MA - PI (Physik Instrumente), a top provider of precision motion control and positioning solutions for more than 4 decades, has released a low-profile motorized positioning stage – the M-122 – with a very small footprint of 60x86mm and a travel range of 25mm, best suiting it for research and industrial applications including fiber alignment, metrology, quality assurance testing, photonics packaging, test equipment, and micromachining.
Libra Industries: Factors to Consider for a Successful DfA
Publication Date: 8/19/2016

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, today announced that Scott Fillebrown, CTO, will present during the PCB West Conference, scheduled to take place September 13-16, 2016 at the Santa Clara Convention Center in CA. Fillebrown will present “Manufacturability through Design” on Tuesday, September 13 during the morning session.
LPKF Makes Up A Lot of Ground in the Second Quarter
Publication Date: 8/18/2016

TUALATIN, OR - Business growth at LPKF Laser & Electronics AG accelerated considerably in the second quarter 2016. Sales grew by almost 20% compared to the same quarter of the previous year, EBIT results were positive at EUR 0.7 million. However, due to a very weak first quarter, sales and EBIT results after six months stayed below the previous year’s figures. Sales in the first half year reached almost EUR 40 million, EBIT stayed negative at EUR -3.7 million.
Würth Elektronik eiSos acquires AMBER wireless GmbH
Publication Date: 8/17/2016

WALDENBURG, GERMANY - AMBER wireless GmbH, manufacturer of wireless connectivity solutions, is part of Würth Elektronik eiSos GmbH & Co. KG now. With the merger the owner-run wireless specialist founded in 1998 lays the foundation for its further growth and the globalization of its activities. Through the acquisition, Würth Elektronik eiSos considerably expands its range in growth fields, such as Internet of Things, Industry 4.0 and Smart Metering.
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