Tuesday, December 6, 2016
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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CDM Electronics, Inc. Receives Nadcap Accreditation for Electronics
Publication Date: 12/2/2016

TURNERSVILLE, NJ - CDM Electronics, a premier authorized distributor of electronic connectors and cables, today announced the Company has received Nadcap (National Aerospace and Defense Contractors Accreditation) accreditation from the Performance Review Institute (PRI) for electronics.
Metcal Announces Global Launch of Solder Wire Feeder System
Publication Date: 12/2/2016

CYPRESS, CA - Metcal today announced the global launch of the Solder Wire Feeder System. The feeder system speeds up the soldering process and increases efficiency by adding control and convenience to the line.

The Solder Wire Feeder pairs with Metcal’s SmartHeat® MX-5200 or MX-500 Soldering and Rework Systems.
 
Ribbon Cutting Ceremony and Grand Opening of Kurtz Ersa Technology Center in Guadalajara
Publication Date: 12/2/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce the ribbon cutting ceremony and official grand opening of the new demo & technology center in Guadalajara. The ceremony dedicated the new demonstration and technology center in Mexico’s second largest city.
 
WKK Distribution Ltd. Acquires Product Lines from Top Precision Tool Company
Publication Date: 12/2/2016

Hong Kong WKK Distribution Ltd., the leading supplier of industrial machinery and materials in Asia, announces the acquisition of the global know-how, manufacturing, distribution and intellectual property rights of the post-etch punch and fixed tooling products previously owned by Multiline Technology.

Count On Tools, Inc. Breaks Ground on 5,000 ft.2 Expansion to Round Off its 25th Year
Publication Date: 12/2/2016

GAINESVILLE, GA Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is pleased to announce that the company’s 25th year in business has been one of tremendous growth and expansion. Earlier this year, COT purchased the suite next door. The company has knocked down the walls and broken ground on the 5,000 ft.2 expansion. 

In conjunction with the expanded footprint, COT plans to add five to six new machines to increase its manufacturing capacity. Furthermore, the company has added a second shift crew to keep up with demand. 

New Yorker Electronics Releases New CDE Rugged Critical Systems Capacitor Delivering 5,000-Hour Life at 125°C
Publication Date: 12/2/2016

NORTHVALE, NEW JERSEY New Yorker Electronics has introduced MLSG, the latest in a series of ruggedized aluminum electrolytic capacitors with welded seals from Cornell Dubilier Electronics (CDE). Available in both Flatpack and Slimpack, this series targets compact power supply applications in military and aerospace, as well as

Conecsus Launches New Web Site; a ‘Green’ Knowledge Resource for Metals Recycling
Publication Date: 12/2/2016

Terrell, Texas, USA - Conecsus, LLC, an innovative environmental technology and recycling company, has launched its new web site at www.conecsusllc.com. This is a comprehensive resource for SMT electronics manufacturers and a wide range of other manufacturing industries that produce tin and other metals wastes.

Alpha Wire Introduces New Cordset and Distribution Box Finders
Publication Date: 12/1/2016

ELIZABETH, NJ - Alpha Wire is pleased to announce the launch of its Cordset and Distribution Box Finders. Similar to the Cable Finder that went live on the Alpha website in 2015, the latest finder guides help you find the right Alpha Connect solution for your application.
Compact Linear Piezo Stages offer Nanometer Resolution and Extended Travel Ranges, from PI
Publication Date: 12/1/2016

AUBURN, MA - Engineers and scientists working in the fields of nano- biotechnology, metrology, and photonics run applications that require nanometer precision and ultra-fine adjustment, often in confined spaces.
 
Microscan Hosts 3-Day Advanced Machine Vision Training Course
Publication Date: 12/1/2016

RENTON, WA - Microscan, a global technology leader in barcode, machine vision, and lighting solutions, announces a three-day training course on advanced machine vision tools taught through handson exercises using Microscan’s advanced Visionscape® Machine Vision Software platform. The course will be held in Microscan’s Northeast Technology Center in Nashua, New Hampshire, from December 6-8, 2016 at 8:30 AM to 4:30 PM daily.
 
Saki Incorporates its 3D AOI and SPI Systems into Fuji America's Smart Factory Line
Publication Date: 12/1/2016

FREMONT, CA - Saki Corporation, an innovator in the field of automated optical inspection equipment, has partnered with Fuji America to incorporate its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems into Fuji's Smart Factory SMT line at its Vernon Hills, IL facility.
 
Avnet Announces Distribution Agreement with Central Semiconductor in the Americas
Publication Date: 11/30/2016

PHOENIX & HAUPPAUGE, N.Y. - Avnet, Inc., a leading global technology distributor, today announced a distribution agreement with Central Semiconductor Corp., a leading manufacturer of innovative discrete semiconductors. Effective immediately, Central Semiconductor’s entire line of discrete semiconductors will be available for purchase by customers in the Americas through Avnet’s broadline components Electronics Marketing group and Avnet USI, Avnet’s defense/aerospace specialty distribution business unit.
SEMI Adds Industry Veteran to Americas Leadership
Publication Date: 11/30/2016

SAN JOSE, CA - SEMI, the global industry association representing more than 2,000 companies in the electronics manufacturing supply chain, today announced the hire of David Anderson as president of the SEMI Americas region. Reporting to SEMI’s president and CEO, the president of SEMI Americas has P&L responsibility as well as ownership of all Americas region programs and events, including SEMICON West.
IDT Extends 1.8 V RF Timing Family with Dual-Channel Buffer Devices that Deliver High Performance, Low Power
Publication Date: 11/30/2016

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) today introduced four high-performance, low-power, LVDS dual-channel fanout buffers, delivering high performance and power savings for system and board designers.
Kurtz Ersa Holds Selective/Wave Solder Process Seminar in Guadalajara, MX
Publication Date: 11/30/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, recently held its first process seminar at its new facility in Guadalajara. The local seminar allowed surrounding customers to attend and advance their knowledge and understanding about why selecting a proper flux for the specific process they are using is so important.
 
Tech-Etch: Configurable PDF Sales Drawings Offered For Download To Assist In Board Level Shielding Design Process
Publication Date: 11/29/2016

PLYMOUTH, MA - Tech-Etch offers downloadable interactive PDF sales drawings that let the user design standard 1-piece, 2-piece, or low-profile board level shields. The user simply fills in required dimensions and then chooses available options to complete the drawing, such as surface or through hole mounting, materials, and finish.
Cooperation between Würth Elektronik eiSos and Modelithics: Simulation models for high-frequency inductances
Publication Date: 11/29/2016

WALDENBURG, GERMANY - Würth Elektronik eiSos and Modelithics proudly present the results of their cooperation project: with immediate effect, Microwave Global Models™ products are now available for three product families of SMT high-frequency inductors. HF developers now have the opportunity to test the 0402 and 0603 designs of the WE-MK, WE-KI, and WE-TCI coil families in simulations.
 
Rehm Is Developing a New Curtain Nozzle for Highly Selective Conformal Coating
Publication Date: 11/29/2016

BLAUBEUREN, GERMANY - Circuit board coating is not just about complete reliability. Precise application procedures are required to cope with the constant miniaturisation in the electronics industry and the associated narrower tolerances between the areas to be lacquered and the areas which must remain free of lacquer. Electronics manufacturers are increasingly confronted with an ever-growing range of product and material mixes.
 
Dymax Multi-Cure® 9-20557 Conformal Coating Offers Protection Against Thermal Shock
Publication Date: 11/28/2016

TORRINGTON, CT - Dymax Multi-Cure® 9-20557 is designed for rapid conformal coating of printed circuit boards and other electronic assemblies. This MIL-I-46058C listed product is especially formulated to remain on the edges of difficult-to-wet components and sharp leads, while its low modulus allows it to excel in coating applications where thermal shock performance is critical.

Multi-Cure® 9-20557, which is UL approved and meets the IPC –CC-830 standard, has been optimized for coating thicknesses between 51 mic [0.002 in] and 510 mic [0.020 in].
 
FREE Digital Download of Failures Analysis Booklet from ACI Technologies
Publication Date: 11/28/2016

PHILADELPHIA, PA - ACI Technologies, a manufacturing and scientific research corporation dedicated to the advancement of electronics processes and materials, invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx.

 
 
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