Wednesday, May 23, 2018
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BTU to Show PYRAMAX and Profile Guardian at SMT/Hybrid/Packaging

Hall 4, Stand 551

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit in their distributor’s booth (EPP Electronic Production Partners GmbH, Hall 4, Stand 551), at the upcoming SMT/Hybrid/Packaging show, scheduled to take place June 5-7 at the Messe in Nuremberg, Germany.      
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MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2018

Hall 4A, Stand 140

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their 3D AOI systems, MV-6 OMNI and MV-3 OMNI, as well as their total quality management system software, INTELLISYS, in distributor pb tec’s booth in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place June 05-07, 2018, at the Messe in Nuremberg, Germany.       
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CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor Scanners at the European Mask and Lithography Conference

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.       
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Nanosystec Introduces NanoPlace with Selective Laser Soldering to Address This Challenge

Selective laser soldering for small wires and pads

FREEMONT, CA - Selective Laser Soldering is the superior method for soldering wires with diameter of less than 250µm (> 30 AWG) or pads with similar dimensions (< 10 mil). The laser beam heats only the small processing area, while all surrounding components and circuits are not affected.      
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"Ready for the Next Step“ – Rehm Shows Innovations at SMT in Nuremberg

Hall 4A, Booth 100

Every year, SMT hybrid packaging addresses current topics related to electronics manufacturing and puts these in the focus of the event. What’s more, 2018 is all about the ever-growing field of digitalisation, the fourth industrial revolution and smart factory.       
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Indium Corporation to Feature Indium8.9HF Solder Paste at SMT Hybrid Packaging

Booth #4-301

CLINTON, NY - Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at SMT Hybrid Packaging, June 5-7, in Nuremberg, Germany.

Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry.       
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Electrica Ltd. Purchases Mirtec’s MV-3 OMNI to Further Improve Quality Standards

MIRTEC, “The Global Leader in Inspection Technology,” today announced that Electrica Ltd. purchased an MV-3 OMNI 3D AOI system to help increase quality and productivity throughout all phases of their manufacturing process as the company engages with more customers in the high-reliability markets.      
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For Industrial Use: PI Offers New High Performance High Load Linear Stages Family, Ballscrew/Linear Options

Compared to the competition, these PI-engineered stages offer higher load capacity, allowing for higher dynamics, often required by industrial applications.

AUBURN, MA - The new reference-class linear stages family, L-417 and V-417, from precision nanopositioning global leader PI (Physik Instrumente), are available in ballscrew and linear motor configurations, both cost effective designs, offering high resolution with improved tracking performance, smaller tracking error, and improved settling time.        
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Sonobond Offers Effective Solution for Auto Component Manufacturers

Ultrasonic Dual Head Welder Achieves High-Strength Welding of High Voltage Terminals without Causing Fracturing

WEST CHESTER, PA - Automotive component manufacturers now have a reliable, environmentally friendly and cost-effective solution for assembling high voltage terminals used for storage in electric and hybrid vehicles.        

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Spectrum launches ultra-high precision, self-contained digitizer range

Flexible data gathering with go anywhere, standalone design

GROSSHANSDORF, GERMANY - For complete flexibility of application, Spectrum Instrumentation has announced stand-alone versions of its recently launched, ultra-high precision, PCIe digitizer card.    
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HARTING honors leading distributors at annual EDS 2018 Open

LAS VEGAS, NV - With HARTING enjoying an extended run of double-digit year-over-year sales increases in the Americas, the company took time at the EDS 2018 Summit to announce its annual honors for its leading distributors in recognition of their exceptional support. Each of the awards honors a distinct achievement.        
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Koh Young America Participating at the eSMART Factory Conference

CHANDLER, AZ - Koh Young is synonymous with innovative, pioneering technologies and its efforts to advance Industry 4.0 solutions further demonstrate its dedication. Recently, it has revealed smarter, faster technologies integrated with its AI-powered KSMART platform to help enable a smart factory.     
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Thermaltronics Debuts TMT-ST10 Versatile 3-in-1 Soldering Tip Tester

NEW YORK - Thermaltronics, a manufacturer of soldering systems, incorporating the unique Curie Point Technology for temperature control, has introduced a multifunction soldering tip tester that has the following measurement functions:

• Tip temperature (centigrade to Fahrenheit switchable)
• Tip to ground resistance (ohm)
• Tip to ground voltage leakage (mv)     
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ACL Introduces PL40 Premium Penetrating Lubricant

CHICAGO, IL - ACL introduces a universal lubricant-degreaser to its benchtop aerosol line for applications that require the loosing of frozen moving parts such as hinges, joints, and solenoids.

The PL40 Premium Penetrating Lubricant displaces moisture and inhibits corrosion on electronic and electrical components.      

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SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

SAN JOSE, CA - SHENMAO America, Inc. today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste.     
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Würth Elektronik eiSos presents REDFIT IDC SKEDD connectors: Solderless and direct plug-in connectors

WALDENBURG, GERMANY - Würth Elektronik eiSos introduces its new “REDFIT IDC SKEDD WR-WST connectors” product family: solderless, space-saving and multi-pluggable connectors for signal transmission. The electronics and electromechanical components manufacturer is using the patented SKEDD technology from its sister company Würth Elektronik ICS for this innovative product.      
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Sulzer Announces MIXPAC™ MixCoat™ Flex Protective Coating Dispensing System

Ideal for spraying into tight areas and manhole applications

Sulzer Mixpac USA, Inc., the leading innovator of 2-component adhesive dispensing systems, announces the availability of MIXPAC™ MixCoat™ Flex, a member of the innovative MIXPAC™ MixCoat™ cartridge-based 2-component dispensing system family.        
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SCL PCB Solutions Group: PCB Manufacturer BATM Systems SRL, Romania re-certified to ISO 9001:2015

WATERLOOVILLE, UK - SCL PCB Solutions Group, a leading European manufacturer of PCB requirements, announced that its Central European facility located in Craiova, Romania has been successfully re-certified with zero non-conformities to ISO 9001:2015, the international standard for a quality management system.        
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APEM: TS Series now available with LED backlighting style actuator.

New illumination option provides visibility in dimly lit conditions.

VISTA, CA - APEM, Inc. will expand its TS series Thumbstick range to include an LED backlighting option. The TS series is a miniature joystick featuring contactless Hall effect technology to provide long life proportional control.      
 

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RAMPF presents holistic solution for optical bonding of displays at SID Display Week 2018

Fully automated joining process / First-class optically clear silicone adhesives

WIXOM, MI - With a fully automated, partially patented joining method and premium liquid optically clear adhesives, RAMPF Group, Inc. is presenting a holistic solution for using optical bonding technology in displays at SID Display Week 2018, May 22 - 24, LA, CA – Booth 732.       
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