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SystemPlus Consulting: NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

The first ultra-small multi-die low power module with boot memory and power management integrated in a package-on-package compatible device for the Internet of Things

NXP packages in a tiny SiP an application processor, a power management IC and a boot flash memory enabling about 50% of PCB saving compared to a discrete implementation.

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Digi-Key: Linear Technology LT6658 Dual-Output Reference


Lenthor Engineering Boosts Speed with Fuzion Platform from Universal

MILPITAS, CA - Lenthor Engineering, a California based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards, has recently invested in a new Fuzion Platform from Universal. The dual beam Fuzion 2-37 is a high performance multi-function solution that when added to Lenthor’s existing line will greatly boost production speed.
 

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CyberOptics to Participate in the 9th Annual CEO Summit 2017

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2017 in San Francisco

MINNEAPOLIS, MN -CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, announced that Dr. Subodh Kulkarni, President and CEO, CyberOptics will participate in the 9th Annual CEO investor Summit, taking place Wednesday July 12th, 2017 in San Francisco, California.

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At CCL - Your Waste is our Want

Soaring international demand for electric and electronic products fuels global rise in e-waste, set to reach 65.4 million tons annually by 2017.

DEVON, UNITED KINGDOM - Electronics, they are in our home, in our car, on our person and generally surround our lives. Whilst electronics manufacturers typically, as either buyer or consumer, busy ourselves with the sourcing aspect, we tend to neglect the end stages of the production lifecycle; repair, refurbishment, and recycling.

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Ersa to Hold Versaflow 3 Level II Maintenance Training Course

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that it will hold a two-day ERSA Versaflow 3 Selective Soldering Level II Maintenance Training Course from Monday, July 10, 2017 at 1 p.m. to Wednesday, July 12, 2017 at 12 p.m. at its Plymouth facility.
 

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LSI Computer Systems: Dimmable High Voltage Direct AC LED Driver

MELVILLE, NY - LSI/CSI (lsicsi.com/new) announces the availability of a powerful, all inclusive new system level, High Voltage LED Dimmable Driver IC.
 

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RIGOL Announces new Custom Chipset and Oscilloscope Architecture

BEAVERTON, OR - Today RIGOL Technologies continues its 19 year history of Test and Measurement innovation with the announcement of its new Phoenix Oscilloscope chipset and the Ultravision II oscilloscope architecture.

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SV TCL Recognized as a VLSIresearch THE BEST Subsystems Supplier

Newly Released White Paper Includes Further Results from Customer Satisfaction Survey

TEMPE, AZ - SV Probe Pte. Ltd. (“SV TCL”), a leading global supplier of high-performance probe cards and semiconductor test solutions, today announced that VLSIresearch has released a detailed white paper with additional SV TCL results from their 2017 Customer Satisfaction Survey (“CSS”).

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Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, announces plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 13, 2017 at the Embassy Suites Cleveland Rockside in Independence (Cleveland), OH.
 

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Aven Mighty Cam HDMI Color Camera: Measurement Ease with Built-In Software

ANN ARBOR, MI - Aven’s sophisticated Mighty Cam HDMI Color Camera has integrated measurement software and an SD card, allowing precise quality control inspection without a computer.
 

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SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

SAN JOSE, CA - SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.


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Zygo Corporation introduces Verifire™ HDX laser interferometer with ultrahighresolution and imaging for precise 3D metrology of optical components and systems

MIDDLEFIELD, CT – Zygo Corporation is pleased to introduce the Verifire™ HDX laser interferometer system with ultra-high spatial resolution and advanced imaging for measuring surface form and transmitted wavefront of high-performance optical components and systems.

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Inovaxe Partners with Repstronics in Mexico

DEERFIELD BEACH, FL - Inovaxe is pleased to announce its continued growth as the company expands into the Mexican market with its new manufacturers’ representative – Repstronics. Founded in 2003, Repstronics has more than 12 years of experience in the market, focusing on selling capital equipment, products and consumables to the Mexican market, with offices in the main industrial cities of Mexico.

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Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

AUSTIN, TX - Optimal Electronics Corporation, a global provider of smart factory software solutions for the electronics assembly industry, is pleased to announce that the company provides process control and traceability solutions for clean rooms and MEMS sensor assembly.
 

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Schleuniger, Inc. Receives 2017 Best of Manchester Award

MANCHESTER, NH - Schleuniger, Inc. has been selected for the 2017 Best of Manchester Award in the Machining Manufacturer category by the Manchester Award Program.

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Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers

Through Silicon Via's enable smaller and more cost-effective sensor solutions

EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

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APEM Develops New Options for K Series Rocker Switches

VISTA, CA - APEM’s KR and KL rocker switches feature an up-to-date design with a large selection of colors and markings, extreme robustness and high ratings. KR and KL series new options are:

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NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company

NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

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Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

LOGAN, UTAH - Inovar, Inc., a full-service EMS provider, announces that it has secured a spot on Utah State University’s Innovation Campus. Company officials broke ground on a 100,000 sq. ft. facility at the university’s research park on Monday, June 12.

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