Friday, February 24, 2017
 
Advertisement

s

Home/Current Issue > 

Vi TECHNOLOGY Will Discuss Innovative Process Improvement Software for Smart Factories at ENOVA STRASBOURG

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth D22 at ENOVA STRASBOURG, scheduled to take place March 15-16, 2017 at the Parc des Exposition in France.
 

Read More

EPLAN Virtual Engineering Fair returns March 21

SCHAUMBURG, IL - EPLAN’s digital engineering fair is back bigger and better, providing the global engineering community with a 12-hour window on Tuesday, March 21 to watch live presentations and consult with specialists about EPLAN software solutions.
 

Read More

PSMA to Offer APEC Industry Session on Isolation Barrier Technologies

Safety & Compliance Committee will host session featuring six industry experts comparing and contrasting new and existing technologies

MENDHAM, N.J. - At APEC 2017, the Power Sources Manufacturers Association (PSMA) Safety & Compliance Technical Committee will hold the Industry Session: “Isolation Barrier Technologies.” Offering speaker presentations by six industry experts, Session IS14, will take place on Thurs., March 30th, from 8:30 a.m. to 11:30 a.m. at the Tampa Convention Center.

Read More

Viscom Awards Horizon Sales for Outstanding Sales Performance

 From left to right: Carsten Salewski, Dave Trail and Ed Mol
DULUTH, GA - Viscom today announced that it awarded Horizon Sales ‘2016 Representative of the Year’. Carsten Salewski, President and CEO of Viscom Inc., and Ed Moll, Viscom Inc.’s VP of Sales – Americas’, presented the award to Dave Trail, President of Horizon Sales, during the recent IPC APEX EXPO in San Diego.
 

Read More

Seika Recognizes Top Performing McDry Reps during APEX

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its top McDry representatives for 2016.
 

Read More

Industry 4.0 in real – FlexLink shows state of the art solutions at Interpack

GOTHENBURG, SWEDEN - The potential of Industry 4.0 lies in utilizing digitalization as a means to increase the effectiveness of manufacturing operations to new levels. At Interpack 2017, FlexLink exhibits new innovative solutions for leveraging production efficiency.
 

Read More

Torenko and Associates Celebrates 40 Years in Business

SUNNYVALE, TX - Torenko and Associates is pleased to announce its 40th year as a leading manufacturers’ representative organization. Since 1977, Ron Torenko and his team have specialized in the sales and marketing of premier electronic assembly equipment, production tools, test, repair, inspection and consumable products.

Read More

Beta LAYOUT Is Offering the World's First FREE 3D-MID Design Software

AARBERGEN, GERMANY - The company, renowned for their PCB-POOL® prototype manufacturing service is offering this comprehensive design software for FREE.
 

Read More

Schleuniger, Inc. to Debut New Wire Processing Equipment at Electrical Wire Processing Technology Expo

MANCHESTER, NH - Schleuniger, Inc., a leading international manufacturer of high-precision wire processing machines, will be among the over 160 world-class suppliers and service companies to exhibit at the 2017 Electrical Wire Processing Technology Expo. This annual event for the wire and cable processing industry will be held May 10 – 11, 2017 at The Wisconsin Center in Milwaukee, WI.
 

Read More

CAMI Research to Host Continuity & HiPot Testing Seminar & Training Sessions at WPT Expo, Milwaukee

ACTON, MA - CAMI Research Inc. will again host seminar & professional development training sessions at the Wire Processing Technology Expo in Milwaukee, and offer opportunities to win $500 in CableEye® accessories. These sessions will be held on the Tuesday – the EXPO set-up day.
 

Read More


 
 
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.

Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
 

3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

Internet of Things: a promising future for sensors| Yole Développement & Fraunhofer EMFT seminar - Munich, July 3&4
LYON, FRANCE - The MEMS & sensor offering has never been so diverse. Inertial, pressure, temperature, (bio-)chemical and gas sensors as well as microphones, fingerprint and iris recognition. All devices are part of the IoT revolution.

 


search login