Friday, July 28, 2017


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Comet Receives Applied Materials 2017 Supplier of the Year Award for Innovation and Collaboration

FLAMATT, SWITZERLAND - Comet has been recognized with a 2017 Supplier of the Year Award in Innovation and Collaboration by Applied Materials, Inc., the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

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PI's New $15MM R&D Center - Commitment to Future Precision Engineering Innovations

The doors are open of it’s new 108,000ft² technology facility at worldwide headquarters in Karlsruhe, Germany.

AUBURN, MA - Less than 1 year after breaking ground and laying the ceremonial cornerstone, precision motion and nanopositioning solutions leader PI (Physik Instrumente) announces the opening of its Technology Center, which included an inaugural ceremony attended by hundreds of guests.

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Cami Research Inc: CableEye® USB Type-C Test Fixture, CB26U

ACTON, MA - CAMI Research Inc. has released a USB Type-C test interface board for its CableEye cable and harness testing systems. A daughter board, populated with two USB-C female connectors, it allows users to continuity-check USB Type-C terminated cables using the CableEye tester while seeing the connectors-under-test rendered graphically.

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Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

MINNEAPOLIS, MN - The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.”

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Dr. Ian R. Moore, Named Vice President – Wacker Chemical Corporation Division Silicones

ADRIAN, MI - Dr. Ian R. Moore, Wacker Chemical Corporation Vice President-Division Silicones assumed responsibility for the Division’s North and Central America operations effective July 1, 2017. He succeeds Axel Schmidt who is returning to the company’s Munich headquarters office.

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Essemtec to Show All-in-One Jetting/Placement System at SMTA Capital Expo:the Perfect NPI Machine

PITMAN, NJ - Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.

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Rehm is one of the best suppliers in Continental’s Automotive Group: Prize-giving ceremony for “Supplier of the Year 2016”

BLAUBEUREN-SEISSEN, GERMANY - From among 911 strategic suppliers, the Continental Automotive Group has identified its best partners around the world on the basis of a comprehensive, systematic evaluation.

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Universities Obtain New Funding from Nano-Bio Manufacturing Consortium
MILPITAS, CA - Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI. NBMC’s mission is to further the development of human performance monitoring (HPM), thereby broadening the use of advanced electronics in this highly anticipated application space.

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced
SAN JOSE, CA - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

LUTZE Introduces Teal Ethernet Cat5e Cable
CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.


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