Friday, December 9, 2016


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Oliver Opitz from Würth Elektronik eiSos at electronica 2016

Munich, Germany - Kim Sauer (@kimsauer-media) meets Oliver Opitz (Division Manager Strategic Product Development, Würth Elektronik eiSos) at electronica 2016 to discuss future technolgies such as 'Wireless Charging', 'Wireless Connectivity', 'Wireless Sensor Networks', 'Energy Harvesting' etc.

Filmed on location at Electronica 2016 in Munich, Germany thanks to the sponsorship of ASM, KIC, Mentor Graphics and Ventec. #wearescoop.

U.S. Tech Wraps Up electronica 2016

In Munich, Germany, from November 8-11, the staff of U.S. Tech, along with representatives from almost 3,000 companies from 80 separate countries, descended on the Messe Munchen for electronica 2016. The four-day show was a huge success, and according to managing director of Messe Munchen, Falk Senger, "This year's electronica did an impressive job of demonstrating how the various aspects of our everyday lives will network with one another in the future to redefine them.”

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LPKF: High-Efficiency Beam Sources for Highly Productive Electronics Production

HANOVER, GERMANY - The role of laser technology in the manufacturing of electronic components and products continues to grow. For instance, more than 20 different laser processes are used in the production of smartphones, such as for structuring thin layers, for producing three-dimensional conductor structures on plastic bodies, and for cutting glass and printed circuit boards.

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TRUMPF opens technology and laser center in Silicon Valley

New technology and laser center in Santa Clara – focus on coating technology and laser processing – close proximity to key customers and partners in consumer electronics and e-mobility sectors

DITZINGEN, GERMANY - Laser system manufacturer TRUMPF has opened a new technology and laser center in Santa Clara, California. Its location in Silicon Valley puts the laboratory close to key customers and partners from a wide range of industries, in particular companies from the consumer electronics and e-mobility sectors.

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Scott Jordan Named Head of Photonics by PI

Jordan was key contributor to PI’s award-winning photonics systems, the Fast Multi-Channel Photonics Alignment (FMPA) system.

AUBURN, MA - PI (Physik Instrumente), a leading provider of photonics alignment, nanopositioning, and precision motion control systems has appoint Scott Jordan as Head of the Photonics Market Segment.

Jordan, a PI Fellow, holds a Bachelor of Science degree and Master of Science degree, both in Physics, from University of California, Irvine and an MBA in Finance and New Venture Management from University of Southern California.

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Mill-Max Expands its Triple Row Offering to Include Spring-Pin Connectors and Mating Target Connectors

OYSTER BAY, NY - Mill-Max has expanded its triple row connector series’ to include long stroke, through-hole mount spring-loaded pins and mating target connectors. These connectors are on .100” (2,54 mm) grid and available in 9 – 96 position configurations. Triple row connectors provide the designer the flexibility of a single connector solution in place of using separate single and double row connectors; this can be useful when the available space allows for additional rows but not a longer connector.

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Brewer Science Presents “Temporary Wafer Bonding Technology for Advanced Packaging” at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP)

SAN FRANCISCO, CA - Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology at the 13th Annual 3D ASIP. This event, which will be held, December 13 through 15 in San Francisco, CA, is recognized as the principal conference for 2.5 / 3DIC technology and has earned the reputation for showcasing presentations on leading-edge technology from scientists, technologists and business leaders.

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ClassOne Reports Record Sales, Crediting WLP and More than Moore

KALISPELL, MT - ClassOne Technology (, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. "We've been seeing a steady increase in market interest and sales," said ClassOne Technology President, Kevin Witt. "Most of these users are now focusing on capabilities they couldn't get before, like wafer-level packaging and More than Moore technologies."

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Libra Industries Dallas Renews Its Defense and Medical Certifications
MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that its Dallas facility has passed the recertification audits for its ISO 9001:2008 and ISO 13485:2012 certifications. With the recertification, Libra Industries – Dallas is equipped to serve the aviation, space and defense as well as medical device industries with a proven quality management system.

Miguel Arroyo Joins Vi TECHNOLOGY as Sales - Applications Engineer
Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to announce the appointment of Miguel Arroyo as its newest Sales – Applications Engineer. Based in the U.S., Arroyo is a professional engineer with diversified experience in advance electronic manufacturing, with extensive background in electronics manufacturing processes.

Arroyo started out in the industry at Intel in 1994. He joins the Vi TECHNOLOGY team with a great deal of experience from respected companies including Honeywell International and Sparton Electronics.

Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (, manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.


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