Wednesday, October 26, 2016


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ScoopTalk Brings Hottest Industry Topics to the Front & Centre of Conversations at electronica 2016

After its successful launch in Chicago in September, Scoop will take their ‘ScoopTalk’ programme on the road to electronica in Munich, Germany from 8th to 11th November 2016.

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Beta Layout: New 3D technologies- 3D MID layout software and 3D MID prototype production

electronica 2016: Hall B4, Stand 351

AARBERGEN, GERMANY – Beta LAYOUT, a leading manufacturer and service provider for all aspects of prototype printed circuit boards, is again exhibiting interesting innovations at this year's edition of electronica on 8–11 November in Munich.

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Cogiscan and Panasonic Partner to Enable the Connected Factory

BROMONT, CANADA - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, together with Panasonic Factory Solutions Company of America, today announced a new strategic initiative in their long-term partnership. The new program combines both companies’ leading products to enable the connected factory, the cornerstone of Industry 4.0.

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Emerson Spotlights Branson GVX-2H/HR Vibration Welder at Assembly 2016

Compact, Clean Solution for High-Quality, Fast-Cycle Production

Danbury, CT Emerson showcases the Branson GVX-2 H/HR vibration welder, for the first time in the Americas, at the Assembly Show 2016.  The GVX-2H/HR sets a new standard for vibration welding quality, and throughput reconfirming Branson’s position as a global technology leader. GVX–2H/2HR combine a compact footprint and large lift table with precise servo motor drives, closed-loop controls and other powerful features to enable fast-cycle vibration welding of plastic components for automotive, appliance, medical, electronic and other demanding applications.   

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Indium Corporation’s Lasky Outlines History, Applications, and Future of Indium

CLINTON, NY - Indium Corporation's Dr. Ron Lasky, Senior Technologist, delivers an informative overview of the history of, and insight into the future use of, indium metal in a video available at

As part of the Electronics Assembly with Phil Zarrow series, this video features Lasky and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing historical and unique indium and indium alloy applications.

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ELECTRO-MECH’s SW45023 Exit Door Lamp Switch Approved By Airbus

SOUTH EL MONTE, CA - Electro-Mech’s new SW45023 exit lamp door switch has been designed, tested, and approved by Airbus Industries for installation in Airbus A350 aircraft.

The DPST illuminated switch includes several design requirements as specified in the Airbus drawing specification:

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INERTEC Selects the Scienscope X-Spection 6000 for Its Demo Lab

From left to right: Representatives from Preh (a valued INERTEC customer) with Manuel Kübert – Technical Support Engineer, and Andreas Hohnerlein –Managing Director at INERTEC 
CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced that INERTEC has installed the X-SPECTION 6000 at its demo lab in Kreuzwertheim, Germany.

The X-SPECTION 6000 X-ray Inspection System is Scienscope’s most technologically advanced cabinet style X-ray inspection system. As with all X-SCOPE platforms, it includes every advanced software tool required for a wide variety of applications. With more tilt and a rotating work table, the X-SPECTION 6000 offers the ultimate in flexibility.

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Microscan Demonstrates Barcode Verification and Print Quality Inspection at PACK/PHARMA EXPO 2016

RENTON, WA - Microscan, a global technology leader in barcode, machine vision, verification, and lighting solutions, announces that it will demonstrate systems for print quality inspection and barcode verification and a number of machine vision innovations at PACK EXPO International & Pharma EXPO 2016. Members of the Microscan Packaging team will showcase these technology platform and other Microscan solutions for automated packaging from the co-located Pharma Expo (W-509), taking place at McCormick Convention Center in Chicago, Illinois, from November 6-9.

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PDR Americas Is the Industry’s First Rework Manufacturer to Offer a Free 24-Month Warranty

SHINGLE SPRINGS, CA - PDR Americas, a leader in IR rework, test and inspection, is pleased to announce its new warranty program. PDR is the industry’s first rework equipment manufacturer to offer a 24-month warranty free-of-charge.

PDR now offers pre-packaged maintenance, training and support programs that reflect the level of service that customers deserve with 24/7 options and/or 48-hour on-site availability.
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Pulse Electronics’ FluidWRITER Printers Print Directly on 3D Surfaces

Conductive inks produce high-performance antennas, sensors, and electrical circuits

San Diego, CA Pulse Electronics Corporation introduces a new generation of FluidWRITER™ printers that create printed electronics directly on 3D surfaces. 

FluidWRITERS incorporate innovative FluidANT™ print technology which enables the use of conductive ink to produce high-performance antennas, sensors, and electrical circuits on 3D surfaces. FluidANT uses affordable micron particle inks to print on standard plastic substrates that have robust mechanical properties, enables new integration possibilities,

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SHENMAO America, Inc. Exhibits November 14, 2016 at MEPTEC Semiconductor Packaging Roadmap Symposium, Introduces Semiconductor Packaging Materials

At the Holiday Inn Silicon Valley San Jose, CA USA - Booth # 17

SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

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SPEA 8-axes Flying Probe Tester at Electronica 2016

VOLPIANO, ITALY - At the next-coming Electronica, SPEA will reveal to European and worldwide market its new 8-Axes Dual-Side Flying Probe Tester, in the year of its 40th corporate anniversary.

4080 sets new benchmarks for flying probe board testing in terms of productivity and contacting accuracy.

Innovative granite chassis, combined with state-of-art linear motion technologies, offers low vibration and thermal stability, ensuring unprecedented probing precision at ultra-fast test speed.

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Techcon Systems to Display New Positive Displacement PC Pump at The ASSEMBLY Show in Rosemont

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth #345 at The ASSEMBLY Show, this week from Oct. 25-27, 2016 in Rosemont, IL. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.

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SEMICON Europa Opens Tomorrow in Grenoble, France
GRENOBLE, FRANCE - SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing. Co-located with the IoT Planet exhibition at the Alpexpo in Grenoble, France, SEMICON Europa features more than 400 international exhibitors representing all segments and sectors of the semiconductor supply chain. SEMICON Europa 2016 will run from 25-27 October.

World PCB Production in 2015 Estimated at $58.6 Billion
BANNOCKBURN, IL - The world market for printed circuit boards (PCBs) reached an estimated $58.6 billion in value in 2015 according to IPC’s  World PCB Production Report for the Year 2015. This represents a nominal decrease of 2.7 percent from 2014, but factoring out the effects of exchange rate fluctuations, the growth of PCB output was actually up 2.0 percent in real terms.

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings
ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.


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