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Indium Corporation Technology Expert to Present at IMAPS ATW on Advances in Semiconductor Packaging

CLINTON, NY - Indium Corporation's Maria Durham will present at IMAPS’ Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging Sept. 22 at SUNY Polytechnic Institute in Utica, N.Y.
 


Keystone Electronics: Color Coded, Auto Blade Fuse Holders

ASTORIA, NY - Identifying Automotive Blade Fuses on PCBs is now “quick and simple” with the colored insulator bodies now available as the latest addition to Keystone Electronics highly-regarded series of low insertion force, compact Auto Blade Fuse Holders.

Rated for 20 AMPs, 500VAC continuous usage, these new holders are available in Surface Mount (SMT) and Thru-Hole (THM) types.

New RSM for the Southwest at Metcal

CYPRESS, CA - Metcal today announced that it has hired a new Regional Sales Manager for the Southwest. Gabriel Ortiz will manage Arizona, New Mexico, Texas, Oklahoma, Louisiana, and Mexico and South America.

Ortiz brings more than 20 years of experience servicing the electronics manufacturing industry, with a unique touch in that he has successfully lead teams in both the manufacturing and distribution environments to develop his business.

NEO Tech Ranks on the Inc. 5000, Inc. Magazine’s 35th Annual List of America’s Fastest-Growing Private Companies

CHATSWORTH, CA - NEO Tech, a leading provider of microelectronics, engineering and manufacturing services, and supply chain solutions for brand name OEMs in the industrial, medical and military/aerospace markets, announces that it placed on Inc. magazine’s 35th annual Inc. 5000, the most prestigious ranking of the nation’s fastest-growing private companies.

Panasonic Launches New PanaCIM Maintenance for Asset Management

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America has launched a new PanaCIM® Maintenance solution to control the full life cycle of any manufacturing asset. PanaCIM Maintenance brings innovative, value-added elements to help manufacturers streamline processes, reduce costs, increase uptime, and improve efficiencies.

‘ScoopTalk’ brings together thought-leaders, brands, manufacturers and suppliers at SMTAI to debate the electronics industry’s hottest topics

At SMTA International 2016 (SMTAI), scheduled to take place in Rosemount, Illinois, September 27th – 28th 2016, Scoop will launch a new thought-leadership program and platform entitled ScoopTalk that will bring together the biggest players and brightest minds in the industry, to debate the industry's hottest topics – filmed onsite in the ScoopTalk Studio on booth #545.

SCS: The Leader in Parylene Conformal Coatings Will Exhibit at the New Sensors Midwest Expo

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) is pleased to announce that it will exhibit in Booth #709 at the Sensors Midwest Expo, taking place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. SCS will discuss its Parylene coating services for the electronics, defense, medical device and automotive industries.

Sensoray: USB 3.0 Video Capture in SDI or DVI

Requires no device-specific driver

TIGARD, OR - Sensoray introduces its new Model’s 3364 a USB 3.0 device available in SDI or DVI versions. It captures uncompressed SD/HD video in resolutions up to 1080p60 and uses H.264 video compression for inputs up to 1080p30, both with very low latency. A USB 3.0 device, it is capable of capturing uncompressed video at full frame rates and simultaneously sending uncompressed (preview) and compressed streams to the host.

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

SAN JOSE, CA - SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.

Vi Technology: 3D SPI with Unambiguous Z Referencing and Warpage Compensation

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit with AXIS AUTOMATION in Hall 3 – Booth 3141 at ELECTRONICA India, scheduled to take place September 21-23, 2016 at the BIEC- Bangalore International Exhibition Center. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI.


 
 
Fiber Optic Center, Inc. announces the Hernon® Tuffbond® 302 epoxy adhesive packaged by ÅngströmBond
NEW BEDFORD, MA - Fiber Optic Center, Inc., (FOC), an international leading distributor specializing in helping their customers make the best cable assemblies in the world, announces the addition of Hernon® Tuffbond® 302 epoxy adhesive, packaged by ÅngströmBond, to their extensive epoxy line.

Tuffbond® 302 consistently performs under temperature cycling from -54C to 85C. It is a high viscosity material that flows well and cures fast.
 

Horizon Sales Announces SMTA Meeting and Member Appreciation Golf Outing in Michigan
BRIGHTON, MI - Horizon Sales, a leading manufacturers’ representative corporation, specializing in the sales and marketing of premier electronics assembly equipment, is pleased to announce the MI SMTA Meeting and Member Appreciation Golf Outing. The outing is scheduled to take place Monday, September 12, 2016 at the Oak Pointe Country Club in Brighton, MI.

 


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