Tuesday, May 30, 2017


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500ºF Electric Top-Loading Oven From GRIEVE

ROUND LAKE, IL - No. 955 is a 500ºF (~260ºC) electrically-heated, top-loading oven from Grieve, currently used for testing electronic components at the customer’s facility.

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Ersa Address All Users with the Highest Precision & Safety Rework Requirements at SMTA Empire Expo

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Empire Expo & Tech Forum, Thursday, June 15, 2017 at the Holiday Inn Syracuse/Liverpool in Liverpool, NY.

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ASM Assembly Systems at the SMT Hybrid Packaging 2017:The smart SMT Factory has become reality at ASM


At SMT Hybrid Packaging 2017 ASM Assembly Systems proved that the Smart #1 SMT Factory is no longer a remote vision, but showed concrete implementation.

Munich, Germany - The topic smart factory dominated – as it did at Nepcon Shanghai and Apex in the USA – the SMT Hybrid Packaging 2017 (Nuremberg, May 16-18): exhibitors and visitors alike showed deep interest in integrated production concepts and Industry 4.0 buzzwords. Technology leader ASM Assembly Systems proved that the Smart #1 SMT Factory is no longer a remote vision, but showed concrete implementations.
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Koh Young Highlights Latest Technology at SMT Hybrid Packaging Show

Seoul, South Korea - 3D inspection technology leader Koh Young Technology showed off its latest technology developments, including the KSMART Solution, Koh Young’s own field-proven AI platform – IP (Intelligent Platform) at the recent SMT Hybrid Packaging 2017 Show in Nuremberg, Germany. The exhibit was timely in part because Koh Young has proven the excellence of KSMART in Germany, the industrial powerhouse where the “Industry 4.0” concept first emerged, according to Wolfgang Runte, Sales Manager of Koh Young Europe.

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Jabil Earns Recognition as John Deere Partner-Level Supplier and Hall of Fame Supplier

ST. PETERSBURG, FL - Jabil Circuit, Inc. announced today that it has earned recognition as a Partner-level supplier for 2016 and was inducted into the Hall of Fame in the John Deere Achieving Excellence Program.

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Advanced Interconnections Signs Electronic Salesmasters Incorporated As Manufacturer’s Representative

WEST WARWICK, RI - Advanced Interconnections Corp. (AIC) is pleased to name Electronic Salesmasters Inc. (ESI), of Beachwood, Ohio, as its new Manufacturer’s Representative for the greater Ohio territory consisting of OH, MI, IN, KY, and western PA and the Florida territory including Puerto Rico.

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Europlacer Appoints Ste.Al.Tech in Italy

MERATE, ITALY - Blakell Europlacer is pleased to announce the appointment of Ste.Al.Tech Srl as its agent in Italy. The move further strengthens the company’s infrastructure in the region, adding to resources recently put in place with a direct Europlacer office in Italy extending its support into Slovenia, Serbia and Croatia.

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StratEdge Expands CMC Base Laminate Packages to Include High-Power GaN Transistors & MMIC Devices

Packages on display at IMS 2017, Booth #1926, Honolulu, Hawaii

SAN DIEGO, CA - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces the expansion of its LL family of high-power laminate copper-moly-copper (CMC) base packages to include both gallium nitride (GaN) transistor and MMIC device packages and package assembly services.

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Fujipoly: Extremely Soft TIM Delivers 13 W/m°K Performance

CARTERET, NJ - Sarcon® PG80A from Fujipoly® is one of the industry’s softest and highest performing thermal gap filler pads.

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SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium
MINNEAPOLIS, MN - The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.

Indium Corporation Expert to Present at China Semiconductor Packaging Test Symposium (CSPT) 2017
CLINTON, NY - Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China.

SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
MILPITAS, CA - SEMI | FlexTech (www.semi.org; www.flextech.org) and the Canadian Printable Electronics Industry Association (www.cpeia-acei.ca) have signed a Memorandum of Understanding to support each other’s programs and drive the continued development and adoption of printable, flexible hybrid, and wearable electronics (PE and FHE).

Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.


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