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Monday, December 18, 2017
 
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Versaflow 3 Application Training Course at Kurtz Ersa Guadalajara Facility

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that it will hold a two-day ERSA Versaflow 3 Selective Soldering Level II Application Training Course from Wednesday, January 17, 2018 at 1 p.m. through Friday, January 19, 2018 at 12 p.m. at the Kurtz Ersa Mexico office in Guadalajara. 
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Amerway Offers Full Range of High-Purity Custom Anodes for Electroplating

ALTOONA, PA - Amerway Inc., a leading solder manufacturer servicing the electronics industry with high-purity alloys and solder products,announces the availability of all types of standard and custom anodes for electroplating in electronics manufacturing. 
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Powerbox’s Medical Power Supply Delivers Power and Safety to Healthcare Facilities at Altitude

BEDFORD, NH - Powerbox, one of Europe’s largest power supply companies, and for more than four decades a leading force in optimizing power solutions for demanding applications, announces the launch of a new series of power supplies for medical applications requiring BF (Body Floating) class insulation and full, reliable operation up to 5,000 meters altitude to power medical healthcare facilities and equipment.
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2018 TOPLINE PRODUCTS GUIDE Available, Problem-Solving Resource

IRVINE, CA - TopLine released its new 2018 TOPLINE PRODUCTS GUIDE, with 160 pages of updated information that assists engineers and researchers in solving problems, exploring a hunch, and gaining knowledge. TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. 
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Alpha to Showcase Latest Products for Die Attach and SMT Assembly Solutions at Internepcon Japan 2018

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering materials and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the 2018 Internepcon Japan show to be held in Tokyo from January 17th – 19th, 2018.  

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Technomelt awarded at major industry event: New masking technology and automotive reliability expertise earn Henkel recognition during Productronica

During last month’s Productronica global electronics event in Munich, Germany, the electronics business of Henkel Adhesive Technologies took the top prize in its category for the Global Technology Awards contest, while Technical Service expert Richard Boyle was selected to share his know-how during a live video panel discussion about automotive reliability and testing.
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WACKER’s Americas Region Expansion Strategy Aligned with Global Growth and Demand for Silicones

ADRIAN, MI - Wacker Chemical Corporation, part of the global chemical group Wacker Chemie AG, is planning a number of concurrent expansion projects to support regional growth and demand for silicones and HDK® pyrogenic silica. 
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SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 


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