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Avnet Receives Semiconductor Distributor of the Year Award from Vishay

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, recently received the Distributor of the Year for Semiconductor Products in the Americas from Vishay Intertechnology, Inc. The award was based on sales records for the fiscal year ending March 31. This is the second time in five years that Avnet’s superior sales performance has earned it Distributor of the Year honors from Vishay.

Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities

IRVINE, CA - Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of award-winning GAP PAD thermal interface materials (TIMs). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components.

Juki Offers 3600 7" Reel Storage Capacity

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce that its ISM UltraFlex 3600 Intelligent Storage System provides automatic kitting for the next run on placement machines.
 

Temperature & Humidity Logging Is Now Available on Seika’s McDry Cabinets

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that Dickson Data’s TM325 Display Temperature & Humidity Logger is now available for all McDry cabinets.

SHENMAO Exhibits at SEMICON WEST: Introduces BGA and Micro BGA Solder Spheres

July 12-14, 2016 Booth # 6467

SAN JOSE, CA - SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.

Sono-Tek Corporation to Introduce Game-Changing Photoresist Ultrasonic Coating System at SEMICON West

MILTON, NY - Sono-Tek Corporation (OTC BB: SOTK) today announced plans to unveil a new photoresist ultrasonic coating system in Booth #2146 at SEMICON West, scheduled to take place July 12-14th at the Moscone Center in San Francisco, CA. The new photoresist coating system, SPT200, has been designed specifically to meet the unique challenges of coating high aspect ratios and deep well topographies such as MEMS wafers with photoresist.



 
 
IPC Releases PCB Industry Results for May 2016
BANNOCKBURN, IL - IPC — Association Connecting Electronics Industries® announced today the May 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders in May continued ahead of last year’s levels, but at slower rates than in recent month. The book-to-bill ratio also declined slightly but remains positive at 1.01.

 


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