-> Home/Current Issue
 
Wednesday, May 23, 2018
 
Advertisement

s

Home/Current Issue > 

Gowanda Expands Magnetics Offerings with Acquisition of HiSonic

Booth #1735 (IMS2018)

GOWANDA, NY - Gowanda Components Group is pleased to announce that its offerings of RF and microwave passive magnetic components are expanding in connection with the acquisition of HiSonic in Olathe, Kansas.     
Read More

Jabil Expands in Israel with the Opening of Optics Technology Innovation Center

HAIFA, ISRAEL – Green Point, a division of Jabil Inc., announced today the opening of its new 2,000 square meter Optics Technology Innovation Center in Haifa, Israel. This development and manufacturing center will provide the Israel tech community – already recognized for driving worldwide innovations – with additional opportunities in computational cameras, projection systems and combined solutions.      
Read More

Rainer Krohmann New Sales Director DACH of IPTE Germany

HEROLDSBERG, GERMANY - Rainer Krohmann (55) is the new Sales Director for the DACH region (Germany, Austria and Switzerland) of IPTE Germany GmbH (Ltd.), a subsidiary of IPTE, one of the world’s leading suppliers of automated production equipment for the electronics and mechanics industry.          
 

Read More

ViscoTec: Additive manufacturing of silicone parts

Innovative 3D-printing of silicones with print heads from ViscoTec

BAVARIA, GERMANY - Many everyday products - consciously, but often unconsciously - contain silicone. These include smartphones, automotive components, household appliances, textiles, toiletries and medical products - to name just a few.         
Read More

DfR Solutions to Present at Siemens PLM Connection

Address rapid reliability analysis with Nastran-Sherlock integration

BELTSVILLE, MD - DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona.        
Read More

Rogers Corporation's Power Electronics Solutions Group to Introduce ROLINX® Caplink Solutions at PCIM 2018

Rogers Corporation’s (NYSE:ROG) Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and introducing ROLINX® CapLink Solutions.

PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place at the Nuremberg Messe in Nuremberg, Germany from June 05 – 07, 2018. Rogers PES will be exhibiting in Hall 9 at Booth 406.        
Read More

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

CYPRESS, CA - Metcal today announced plans to exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 14, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN.   
 

Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 


search login