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Tuesday, May 22, 2018
 
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Rogers Corporation's Power Electronics Solutions Group to Introduce ROLINX® Caplink Solutions at PCIM 2018

Rogers Corporation’s (NYSE:ROG) Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and introducing ROLINX® CapLink Solutions.

PCIM Europe (Power Conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place at the Nuremberg Messe in Nuremberg, Germany from June 05 – 07, 2018. Rogers PES will be exhibiting in Hall 9 at Booth 406.        
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Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

CYPRESS, CA - Metcal today announced plans to exhibit at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 14, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN.   
 

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Ersa Holds National Sales Meeting with Hands on Training

PLYMOUTH, WI - Kurtz Ersa Inc., a leading supplier of electronics production equipment, today announced that it held a successful sales meeting with hands on training for its North American sales representatives. The training was held May 16-17, 2018 at the company’s Plymouth facility and kicked off with a welcome speech from Albrecht Beck, President and CFO of Kurtz Ersa Inc.        
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KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

Hall 4A, Stand 230

SAN DIEGO, CA - KIC announced today that they will co-exhibit in the SmartRep booth, Hall 4A, Stand 230, at the upcoming SMT/Hybrid/Packaging show, scheduled to take place June 5-7 at the Messe in Nuremberg, Germany.       
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Naprotek, Inc. Installs Flexible New MXI System from Nordson DAGE

SAN JOSE, CA - Naprotek, Inc., a provider of electronic manufacturing services, today announced that it has purchased and successfully installed the Quadra™ 5 flexible X-ray inspection solution from Nordson DAGE, a division of Nordson Corporation. With the new Nordson DAGE Quadra™ 5, Naprotek will benefit from industry-leading core technology, high performance, and ease of use for 2D and 3D X-ray applications.       
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Specialized Coating Services Hosts Successful Open House for New Billerica Facility

BILLERICA, MA - Specialized Coating Services, the industry leader in contract services of conformal coating, today announced the success of the ribbon cutting and open house of their new Billerica, MA office. In attendance was the industry press, many customers (including PVA, Chase/Humiseal from New York, and Krayden all the way from California), and even local Billerica government officials.        
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Ironwood Electronics Introduces Lever Actuated Spring Pin Socket for NXP's MCU

Socket your 501 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

EAGAN, MN - Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Unit - CBT-BGA-6075. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions.        
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New Lightweight Cartridge Applicators from Techcon

CYPRESS, CA - Techcon, a leader in precision fluid dispensing technologies, is pleased to introduce the TS2560 Series Applicator Guns. The applicator guns come in both palm and pistol grip versions to make processing Techcon and standard sealant cartridges more convenient.          
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Ryder Industries: Remaining in Pole Position by being First Past the Post in their Strategic Sales and Marketing Functions by Appointing Industry Expert Kingslea Chan as VP of Sales & Marketing

HONG KONG - Ryder Industries, leading Electronics Manufacturing Service (EMS) provider, headquartered in Hong Kong, with manufacturing facilities in Shenzhen and Xin Feng, China, announce the appointment of Kingslea Chan as the company’s Vice President of Sales and Marketing.        

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Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 


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