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The Largest Design & Manufacturing Event in Minneapolis Partners with Leading Industry Associations

SANTA MONICA, CA - The Midwest's largest design and manufacturing event today announced its partnership with leading manufacturing, medtech, and packaging associations including Medical Alley Association, MedTech Association, Institute of Packaging Professionals (IoPP) and Minnesota Precision Manufacturing Association. The event takes place November 8-9, 2017 at the Minneapolis Convention Center. To learn more and register, please visit: mdmminn.mddionline.com

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SHENMAO Exhibits at IWLPC October 24 & 25, 2017 Booth # 12

Introduces New Flux and Solder Paste Products

San Jose, CA - SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
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Pillarhouse International includes improved functionality to their Handex and Synchrodex ranges: No Price Increases

Chelmsford, Essex, UK – Pillarhouse International Ltd today announced: The motorised solder feeder option will now be included, as standard, on their range of Handex and Synchrodex selective soldering systems. This option improves on the already successful pneumatic system that has been fitted for many years.
 

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Insight Equity Acquires VirTex Enterprises

SOUTHLAKE, Texas and AUSTIN, Texas - An affiliate of Insight Equity Holdings LLC ("Insight Equity"), the Southlake, Texas headquartered private equity firm, is pleased to announce the acquisition of VirTex Enterprises ("VirTex"), a leading vertically integrated electronic manufacturing services provider. The Company features over 165,000 square feet of manufacturing space with the ability to produce both complex electronic components and complete systems for customer platforms with volumes ranging from prototyping to full-scale production.

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Ironwood Electronics Intros 293 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

EAGAN, MN - Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Units - CBT-BGA-6071. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and contact resistance is <30mOhms.

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Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

 

From left to right: Carlos Eijansantos – Juki’s Sales Manager – Americas, Bill Butt – Principal, Quantum Systems, and Bill Astle – President, JAS, Inc.

 

MORRISVILLE, NC Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, recently presented Quantum Systems with the award for ‘Representative of the Year – Best Performance.’ Bill Astle, President of JAS, Inc., presented the award to Bill Butt of Quantum Systems at the recent awards banquet held during the Juki Americas National Sales meeting that took place at Juki’s facility in Fremont, CA.


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Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging defluxing applications

Inventec presents its new products at productronica 2017, hall A1, booth 417

Vincennes, France - For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.
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New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


Avnet Opens Registration for Global MiniZed SpeedWay Design Workshop Series: Training gives engineers head start in mastering design flows using Xilinx’s Vivado Design Suite
PHOENIX, AZ - Avnet, a leading global technology distributor, today announced that registration is now open for a series of interactive SpeedWay Design Workshops™ to help engineers jump start the development of single-core Xilinx® Zynq®-7000 All Programmable SoC devices using the Avnet MiniZed™ Zynq SoC development kit, a cost-optimized prototyping platform for embedded vision and Industrial IoT systems.
Coto Technology Awarded "Best of Show" (Silver) at Sensors Midwest 2017
ROSEMONT, IL - Coto Technology has been awarded Sensors Midwest's Best of Show "Silver" award for its newly-released RedRock TMR RR121 Magnetic Sensor. Seeking to replace aging magnetic sensor technology, the RR121 represents a huge breakthrough for design engineers seeking the lowest possible power consumption and highest sensitivity in an ultra-miniature package.
 


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