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TRI’s Smart Factory Solution Features at NEPCON China 2017

Visit NEPCON China booth 1H38 for a personal tour of TRI’s acclaimed solution lineup.

Taipei, Taiwan - Test Research, Inc. (TRI) will exhibit a comprehensive Smart Factory inspection solution, combining 3D SPI, 3D AOI, 3D AXI and multi-core ICT at NEPCON China 2017 exhibition, booth 1H38 in Hall 1 of Shanghai World Expo & Convention Center from April 25 ~ 27, 2017.
 

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Lenthor Engineering Invests in Testing with CyberOptics Solder Paste Inspection System.

MILPITAS, CA - Lenthor Engineering, a California based designer, manufacturer and assembler of Rigid-Flex and Flex printed circuit boards, announces the recent installation of a new CyberOptics SE500 solder paste inspection system.

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SMT Hybrid Packaging 2017: New Hall Occupation and Additional Joint Stand

International Exhibition and Conference for System Integration in Micro Electronics Nuremberg, Germany, 16 – 18 May 2017

NUREMBERG, GERMANY - At the SMT Hybrid Packaging visitors experience the diversity of assembly and interconnection technologies in a new setting at the well-established exhibition site in Nuremberg this year: The International Exhibition and Conference for System Integration in Micro Electronics will take place 16 – 18 May 2017 in the halls 4, 4A and 5.
 

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Scienscope’s New Success Story in India

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced that their distributor in India – Kyoritsu Electric India Pvt. Ltd. – has successfully installed a Scienscope X-Scope 1800 X-Ray inspection system.
 

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Indium Corporation Expert to Present at PCIM and SMT Hybrid Packaging 2017

CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16 in Nuremberg, Germany.

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Wurth Electronics Smart Transformer Selector Now Interacts with STMicroelectronics’ eDesignSuite

WATERTOWN, SD - Wurth Elektronik is proud to announce the interaction of their Smart Transformer Selector (STS) with STMicroelectronics’ eDesignSuite.
 

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CUI, Inc.: 30 W and 40 W Desktop Power Adapters Comply with DoE Level VI and CoC Tier 2 Standards

TUALATIN, OR - CUI’s Power Group today announced the addition of 30 W and 40 W desktop ac-dc power adapters to its portfolio of DoE Level VI and CoC Tier 2 compliant external power supplies.
 

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Experton Group names Benchmark Leader: iTAC.IoT.Platform receives award

MONTABAUR, GERMANY - iTAC Software AG has won the Experton Group’s Industry 4.0/IoT-Vendor Benchmark 2017 Award. Dieter Meuser, CTO of iTAC, accepted the award for the iTAC.IoT.Platform at a gala evening in Schlosshotel Kronberg on February 8.
 

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HARTING: Circular Connector Meets the Growing Demands in the Railway Sector

Offering space-saving solutions / Rising data volumes

ESPELKAMP, GERMANY -  The railway sector and rail transport markets continue to grow steadily, whether long-distance trains or urban area rail. Trains are also being equipped with ever more modern information technology. HARTING is offering space-saving solutions.


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European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016: Rolf Aschenbrenner, deputy director of the Fraunhofer IZM; Eric Beyne, fellow and program director of 3D System Integration at imec; and Gilles Poupon,
 

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
 

 


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