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New IDT Inductive Position Sensor Family Improves Reliability and Flexibility While Reducing System Costs

With Broad Market Applications, the Robust IDT® ZMID520x Sensors Eliminate the Issue of Magnetic Stray Fields and Deliver Application Flexibility and a Reduced Bill of Material

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) today introduced a new family of high-performance inductive position sensors offering superior reliability, flexibility and serviceability while cutting system costs. The three ZMID520x sensors are automotive qualified to the AEC-Q100 standard and support implementation in safety-related systems compliant to ISO26262 up to ASIL-B.


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Fujipoly's Form-in-Place TIM Fills Large Gap

Carteret, NJ SARCON® SPG-30B from Fujipoly® is a new form-in-place thermal gap filler that eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. SPG-30B delivers a superior thermal conductivity of 3.1 W/m°K with a thermal resistance of only 0.33°Cin2/W.  


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ASM Puts the Smart SMT Factory Within Reach

Live demonstrations at SMT Hybrid Packaging 2017

 Under its RSF Dome, ASM puts around-the-clock expert support within easy reach with its ASM Remote Smart Factory and associated smart tools.
MUNICH, GERMANY - At this year’s SMT Hybrid Packaging trade show (Nuremberg, May 16-18), ASM Assembly Systems is literally placing the Smart #1 SMT Factory at the center of attention at its booth. Under the RSF Dome at booth 4.309, the technology leader will demonstrate its new ASM Remote Smart Factory communication platform in combination with a highly flexible ASM SMT line.
 

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Wurth Electronic Wireless Transmitter and Receiver Coils Featured in Semtech’s Wireless Charging System

WATERTOWN, MA - Created for charging high-power applications, Wurth Electronics wireless charging coils are now featured in Semtech’s LinkCharge™ 20. LinkCharge™ 20 is the only available inductive wireless charging system beyond 15 watts that is backwards compatible.
 

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DIVSYS: Upcoming Advanced Selective Solder Classes

INDIANAPOLIS, IN - An advanced selective solder workshop will be held April 25-26, 2017 and also October 17-18, 2017 at DIVSYS International in Indianapolis. This in-depth 2-day workshop focuses on providing a detailed understanding of printed circuit board construction such as copper layers, barrel plating and porosity.

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Conecsus Presents SMT Metals Waste Recycling Solutions at SMTA Juarez

TERRELL, TX - Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at the SMTA Juarez Expo & Tech Forum, Thursday, April 6, 2017 from 9:00 AM to 6:00 PM MDT at the Hotel Real Inn Cd Juarez, Blvd. Teófilo Borunda # 6941, Partida Iglesia Cd Juarez 32617 Mexico.
 

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PI: 1000’s of Standard Piezo Transducers, Components, and Assemblies in New Piezoelectric Solutions Catalog

Industry, OEMs, and research benefit from PI’s many years of design and manufacturing experience of piezoelectric components.

AUBURN, MA - Industry and research rely on piezoelectric solutions in high tech applications such as medical engineering, mechanical engineering, flow metering, automotive, aerospace, and semiconductor technology.
 

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Rehm presents new innovations at SNEC and NEPCON: Electronics and solar power manufacturers in Asia discover the latest concepts

BLAUBEUREN, GERMANY - This April, Rehm Thermal Systems will appear at two major international trade fairs in Asia – both in the world city of Shanghai. Visit us at SNEC from 19 to 21 April or NEPCON China from 25 to 27 April. We look forward to seeing you!

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European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016: Rolf Aschenbrenner, deputy director of the Fraunhofer IZM; Eric Beyne, fellow and program director of 3D System Integration at imec; and Gilles Poupon,
 

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
 

 


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