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Specialized Coating Services Hosts Successful Open House for New Billerica Facility

BILLERICA, MA - Specialized Coating Services, the industry leader in contract services of conformal coating, today announced the success of the ribbon cutting and open house of their new Billerica, MA office. In attendance was the industry press, many customers (including PVA, Chase/Humiseal from New York, and Krayden all the way from California), and even local Billerica government officials.        
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Ironwood Electronics Introduces Lever Actuated Spring Pin Socket for NXP's MCU

Socket your 501 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

EAGAN, MN - Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Unit - CBT-BGA-6075. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions.        
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New Lightweight Cartridge Applicators from Techcon

CYPRESS, CA - Techcon, a leader in precision fluid dispensing technologies, is pleased to introduce the TS2560 Series Applicator Guns. The applicator guns come in both palm and pistol grip versions to make processing Techcon and standard sealant cartridges more convenient.          
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Ryder Industries: Remaining in Pole Position by being First Past the Post in their Strategic Sales and Marketing Functions by Appointing Industry Expert Kingslea Chan as VP of Sales & Marketing

HONG KONG - Ryder Industries, leading Electronics Manufacturing Service (EMS) provider, headquartered in Hong Kong, with manufacturing facilities in Shenzhen and Xin Feng, China, announce the appointment of Kingslea Chan as the company’s Vice President of Sales and Marketing.        

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BTU to Show PYRAMAX and Profile Guardian at SMT/Hybrid/Packaging

Hall 4, Stand 551

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit in their distributor’s booth (EPP Electronic Production Partners GmbH, Hall 4, Stand 551), at the upcoming SMT/Hybrid/Packaging show, scheduled to take place June 5-7 at the Messe in Nuremberg, Germany.      
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CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor Scanners at the European Mask and Lithography Conference

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.       
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"Ready for the Next Step“ – Rehm Shows Innovations at SMT in Nuremberg

Hall 4A, Booth 100

Every year, SMT hybrid packaging addresses current topics related to electronics manufacturing and puts these in the focus of the event. What’s more, 2018 is all about the ever-growing field of digitalisation, the fourth industrial revolution and smart factory.       
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Nanosystec Introduces NanoPlace with Selective Laser Soldering to Address This Challenge

Selective laser soldering for small wires and pads

FREEMONT, CA - Selective Laser Soldering is the superior method for soldering wires with diameter of less than 250µm (> 30 AWG) or pads with similar dimensions (< 10 mil). The laser beam heats only the small processing area, while all surrounding components and circuits are not affected.      
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Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 


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