Thursday, March 30, 2017


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Optimal Optical 3D Solder Joint Measurement from Viscom

HANOVER, GERMANY - SMT Hybrid Packaging, hall 4A, stand no. 122
With a combination of intelligent software and the high-performance camera module XMplus, Viscom AG is perfecting automatic optical inspection (AOI), which also includes optimal 3D solder joint measurement.

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Würth Elektronik eiSos Honors Digi-Key with the Global Distribution Award

Successful sales partner

WATERTOWN, SD - This year’s “Global Distribution Award” of the Würth Elektronik eiSos Group went to Digi-Key Electronics. Representatives of the American subsidiary of the Group, Wurth Electronics Midcom Inc., presented the award during a visit to the Digi-Key headquarters in Thief River Falls, Minnesota.

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Excelsys CoolX600 Power Supplies Now Feature PMBus™ Communication

Convection-cooled modular supplies have full industrial and medical approvals and industry-leading five-year warranty

CORK, IRELAND - Excelsys Technologies, the leading manufacturer of modular user-configurable and single output power supplies, announces that its revolutionary CoolX600 Series of 600W convection-cooled modular power supplies is now available with the option of PMBus™ (Power Management Bus) communication.

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Sonobond’s Ultrasonic Technology Meets ABYC Standards for Electrical Systems in Marine Applications

Unique Wedge-Reed System Durably Welds Tin-Coated Wires and Terminals While Preserving Protective Properties

WEST CHESTER, PA - Marine motors present especially demanding conditions for electrical systems. Constantly exposed to high-humidity, their performance relies on the protective properties of tin-coated copper wiring.

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Indium Corporation Offers One-Source Solution for High-Purity Tin (Sn) Metal Applications

CLINTON, NY - Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or 99.999%-pure.

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New Nordson YESTECH Investment Takes MC Assembly’s Quality Inspection Capabilities to the Next Dimension

Electronics Manufacturing Services Provider Invests in Upgraded 3D Inspection of Printed Circuit Board Assemblies

MELBOURNE, FL - MC Assembly, a leading mid-tier electronics manufacturing services provider, recently enhanced its inspection capabilities by purchasing and installing a Nordson YESTECH’s FX940 ULTRA 3D Automated Optical Inspection (AOI) machine.

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Comprehensive Search Tool Ensures Visitors a Quick and Precise Sourcing Experience

Pelham, NY – Pico Electronics, a leading manufacturer of ultra-miniature and miniature Transformers, Inductors, DC-DC Converters, and AC-DC Power Supplies, announced today the launch of its updated website,  The new user-friendly “self-serve” website offers design engineers immediate access to Pico’s extensive product line through a powerful new search tool. 

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D3 Semiconductor Superjunction +FETs™ Push Performance Envelope

New entry into competitive power semiconductor market offers 650V-rated models in a wide variety of package configurations; claims across-the-board, industry-best FOM

ADDISON, TX - D3 Semiconductor, a company bringing together affiliated semiconductor companies and top-talent experts, announces its inaugural entry into the power semiconductor market with the launch of its +FET™ line of 650V-rated superjunction MOSFETs.

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Debut at SMT Hybrid & Packaging 2017: Complete line solution with E by SIPLACE and E by DEK

ASM further extends its portfolio for the mid-speed segment

The E by SIPLACE and E by DEK modules can be combined to form powerful line solutions that offer additional benefits.

MUNICH, GERMANY - After the successful rollout of the E by SIPLACE placement solution, ASM Assembly Systems is now following up with the E by DEK. Like the E by SIPLACE before, the new printing platform for mid-speed applications, high mix and prototype productions sets totally new standards in terms of quality, performance and modularity with core cycle times of 7.5 seconds incl. print and a repeat accuracy rating of ±12.5 µm @ 6 Sigma.
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New IDT Inductive Position Sensor Family Improves Reliability and Flexibility While Reducing System Costs

With Broad Market Applications, the Robust IDT® ZMID520x Sensors Eliminate the Issue of Magnetic Stray Fields and Deliver Application Flexibility and a Reduced Bill of Material

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) today introduced a new family of high-performance inductive position sensors offering superior reliability, flexibility and serviceability while cutting system costs. The three ZMID520x sensors are automotive qualified to the AEC-Q100 standard and support implementation in safety-related systems compliant to ISO26262 up to ASIL-B.

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European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016: Rolf Aschenbrenner, deputy director of the Fraunhofer IZM; Eric Beyne, fellow and program director of 3D System Integration at imec; and Gilles Poupon,

Steve Toyama Joins Applied Ink Solutions Sales Team
WESTBOROUGH, M.A. - Applied Ink Solutions, a worldwide supplier of functional electronic inks and materials for printed electronics, is pleased to announce that Steve Toyama has joined the company as a Senior Sales Representative.

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.


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