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Big Data and Automation Major Focuses of productronica 2017

By Michael Skinner, Associate Editor

This year’s productronica focused on two key ideas: increased use of data in manufacturing and greater levels of automation. The Internet of Things (IoT) and Industry 4.0 trends are being powered by huge amounts of information.
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NEW Mission Critical Flat Cables Video from Cicoil

VALENCIA, CA - Cicoil, the leading manufacturer of high performance Flat Cables, is pleased to announce its newest video: “Mission Critical Flat Cables”. View the broadcast here and learn why Cicoil is the “Go-to” source when unparalleled performance is critical and cable failure is not an option: https://www.youtube.com/watch?v=b9Afz1q1-9A 
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W├╝rth Elektronik eiSos Eagerly Awaits the FIA Formula E Season Opener

WALDENBURG. GERMANY - On December 2, 2017 the Audi Sport ABT Schaeffler racing team starts the fourth season of the FIA Formula E Championship in Hong Kong. As a technology partner from the outset, the Würth Elektronik eiSos Group continues to shape the success of the team.
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Fujipoly® Introduces Economical Thermal Interface Material

CARTERET, NJ - Sarcon® GR14A-50GY from Fujipoly® is a low-cost general purpose thermal interface material that is offered in sheets or custom shapes to fit your exact application. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap filler pad can transfer heat with a thermal conductivity of 1.6 W/m•K while exhibiting a thermal resistance of .61° C•in2/W at 14.5 PSI.
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Viscom AG Announces the Release of an Optimized Inspection System Operation with vVision 2.4

HANOVER, GERMANY - Viscom AG announces the release of vVision 2.4, successfully delivered since mid-2017 for its modern operating software. Among the most important optimizations are a time-saving inspection program creation – especially for new components and special component types – and comprehensive 3D advancements like the 3D solder joint inspection for chips.
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Johanson Technology 2.4 GHz Chip Antenna | DigiKey

Scott, an Application Engineer from Digi-Key Electronics, describes the extraordinary design advantages of the 2.4 GHz chip antennas from Johanson Technology. http://dky.bz/2zcTPi1
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ULT AG Introduces Extraction and Filtration System for easily inflammable Dust/Air Mixtures

MEQUON, WI - ULT AG introduces a conductive version to its device series LAS 260. The new system is ideally suited for extraction and filtration tasks in processing materials that may generate easily inflammable or explosive dust/air mixtures, for instance titanium.
 

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Versa Electronics Completes ISO 9001:2015 Transition and Achieves ISO 13485:2003 Registration

MINNEAPOLIS, MN - In accordance with ISO 9001:2015, and based on the recently completed assessment by our registrar, Orion Registrar, Inc. (“Orion”), Versa Electronics is on the leading edge of a group of companies that decided to complete transition to the new ISO 9001:2015 standard in 2017. Many of Orion’s customers have decided to wait another year before attempting the transition.
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KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey. 
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (classone.com), manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.

"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.

 


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