Thursday, December 8, 2016


Home/Current Issue > 

Oliver Opitz from Würth Elektronik eiSos at electronica 2016

Munich, Germany - Kim Sauer (@kimsauer-media) meets Oliver Opitz (Division Manager Strategic Product Development, Würth Elektronik eiSos) at electronica 2016 to discuss future technolgies such as 'Wireless Charging', 'Wireless Connectivity', 'Wireless Sensor Networks', 'Energy Harvesting' etc.

Filmed on location at Electronica 2016 in Munich, Germany thanks to the sponsorship of ASM, KIC, Mentor Graphics and Ventec. #wearescoop.

U.S. Tech Wraps Up electronica 2016

In Munich, Germany, from November 8-11, the staff of U.S. Tech, along with representatives from almost 3,000 companies from 80 separate countries, descended on the Messe Munchen for electronica 2016. The four-day show was a huge success, and according to managing director of Messe Munchen, Falk Senger, "This year's electronica did an impressive job of demonstrating how the various aspects of our everyday lives will network with one another in the future to redefine them.”

Read More

Brewer Science Presents “Temporary Wafer Bonding Technology for Advanced Packaging” at 3D Architectures for Semiconductor Integration and Packaging (3D ASIP)

SAN FRANCISCO, CA - Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology at the 13th Annual 3D ASIP. This event, which will be held, December 13 through 15 in San Francisco, CA, is recognized as the principal conference for 2.5 / 3DIC technology and has earned the reputation for showcasing presentations on leading-edge technology from scientists, technologists and business leaders.

Read More

ClassOne Reports Record Sales, Crediting WLP and More than Moore

KALISPELL, MT - ClassOne Technology (, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. "We've been seeing a steady increase in market interest and sales," said ClassOne Technology President, Kevin Witt. "Most of these users are now focusing on capabilities they couldn't get before, like wafer-level packaging and More than Moore technologies."

Read More

Lifesaving Device Relying on Everett Charles Technologies’ Probe Expertise

Chest Compression Device Deploys ECT’s Pylon E-S series probe

FONTANA, CA - Everett Charles Technologies (ECT) developed a custom version of the well-established Pylon E-S series spring probe, which is deployed in new generation chest compression devices for Emergency Medical Services and hospitals. The slightly modified Pylon E-S Series probe suits the harsh requirements for the lifesaving mission to assure the battery pack is continuously transferring power to the system.

Read More

AMICRA cooperates with Kanematsu PWS LTD

REGENSBURG, GERMANY - AMICRA Microtechnologies, a worldwide leading supplier of ultra-precise die bonding equipment, has entered in a strategic partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo.

The partnership which officially started on 1 December designates Kanematsu as the exclusive distributor and contact point for sales and service matters for the entire AMICRA Microtechnologies’ product line in Japan.

Read More

EIT, LLC Partners with MIRTEC for Outstanding Performance and 3D Defect Detection Capability

OXFORD, CT - MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that EIT, LLC, a High-Tech Electronic Manufacturing Services (EMS) company specializing in high-quality manufacturing and box-build assemblies, has selected MIRTEC’s MV-6 OMNI 3D AOI Machine based on outstanding performance and 3D defect detection capability.

Read More

Mycronic adjusts the outlookupwards for full year sales in 2016

TAUBY, SWEDEN - Mycronic AB (publ), today adjusts the outlook upwards for full year sales in 2016 to the level of SEK 2,200 million, excluding effects from acquisitions.

The background for the upward adjustment is a combination of earlier delivery of a Prexision-80 mask writer, an order received in December 2015, the change in product mix within Mycronic’s both business areas as well as currency effects.

Read More

Schleuniger Wins the 2016 Tekom Docu Award

MANCHESTER, NH - Schleuniger has won this year’s prestigious tekom docu award (Dokupreis) for its EcoStrip 9380 reference manual. The German Association for Technical Communication has been honoring outstanding user manuals and operating instructions with awards since 2005.

Read More

Pillarhouse Continues to Grow in the Far East

Pillarhouse China Expands its Presence

Chelmsford, Essex, UK – Pillarhouse International Ltd today reported that their sales in the Far East market are at an all-time high. Across the region sales are up by 35% compared to 2015. With the Chinese market increasing by 30%; Japan by 42%; Korea by 20%; Singapore by 32% and Taiwan by 60%. 

Read More

Libra Industries Dallas Renews Its Defense and Medical Certifications
MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that its Dallas facility has passed the recertification audits for its ISO 9001:2008 and ISO 13485:2012 certifications. With the recertification, Libra Industries – Dallas is equipped to serve the aviation, space and defense as well as medical device industries with a proven quality management system.

Miguel Arroyo Joins Vi TECHNOLOGY as Sales - Applications Engineer
Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to announce the appointment of Miguel Arroyo as its newest Sales – Applications Engineer. Based in the U.S., Arroyo is a professional engineer with diversified experience in advance electronic manufacturing, with extensive background in electronics manufacturing processes.

Arroyo started out in the industry at Intel in 1994. He joins the Vi TECHNOLOGY team with a great deal of experience from respected companies including Honeywell International and Sparton Electronics.

Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (, manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.


search login