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Learn How CyberOptics’ 3D AOI Maximizes ROI and Line Utilization at NEPCON South China

MINNEAPOLIS, MN - CyberOptics® Corporation (NASDAQ: CYBE) today announced that it will exhibit in Booth # 1J45 with Kasion Automation Ltd. (KAL) at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center.

CyberOptics’ will demonstrate the award-winning SQ3000™ 3D Automated Optical Inspection (AOI) system that is increasingly being adopted by customers as a best-in-class solution.


Decawave’s Micro-Location Technology Increases Market Momentum, One Million Chips Now Shipped

New milestone for Decawave ultra-wideband chip validates demand for accurate location technology

DUBLIN, IRELAND - Decawave, specializing in precise location and connectivity applications, has reached a milestone for its micro-location, impulse radio ultra-wideband (IR-UWB) technology, surpassing one million Decawave chips shipped. This achievement reflects the increasing demand for accurate micro-location solutions from end users and customers within Internet of Things (IoT), consumer and industrial markets. As more and more solutions are entering production, the growth is exponential and Decawave targets to reach five million units shipped in the course of 2017.

Dymax Receives Two US Patents

TORRINGTON, CT - Dymax Corporation has recently announced it has been awarded two patents- that cover adhesive and coating compositions respectively-by the United States Patent and Trademark Office (USPTO).

Europlacer Expansion Continues with New Distributor in Poland.

DORSET, UNITED KINGDOM - Pick & place equipment manufacturer Europlacer has appointed PAKT Electronics as its exclusive distributor in Poland. Formed in 2008, PAKT is well connected across the country and represents other principals in the territory, offering capital equipment, peripherals and consumables.

Fancort Industries Appoints Andres Luna as Sales Manager in Mexico

CALDWELL, NJ - Fancort Industries, Inc., now in its 44th year, is pleased to announce the appointment of Mr. Andres Luna as its Mexico Regional Sales Manager.

Mr. Luna attended the Universidad Nacional Autonoma de Mexico and received his degree in Electromechanical Engineering.
 

New Silicone Sealant Technology from Henkel Offers Automotive Module Manufacturers Process Flexibility through Unique Cure Capability

IRVINE, CA - A brand new silicone adhesive sealant technology from Henkel Adhesive Electronics provides both high performance and process flexibility. The new material, BERGQUIST TLB 400 SLT, is a two-part silicone sealant designed for automotive module applications. With an adaptable thermal cure profile that enables full cure at temperatures from 25°C to 180°C, the technologically advanced sealant allows automotive specialists to accommodate various manufacturing protocols.

KYZEN: A New Fast Acting IPA Alternative for Stencil Cleaning will be Available at NEPCON South China

NASHVILLE, TN - KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts.
 

Saline Lectronics Purchases a Schunk Electric High-Performance Router for High-Reliability PCBAs

SALINE, MI  ― Saline Lectronics, Inc., a leading electronics contract manufacturer, has installed the SAR-800-B 1-CL High-Performance Router from Schunk Electric. The sale was facilitated by The Murray Percival Company. Lectronics now can offer customers consistent results for odd-shaped or high-reliability PCBAs, as well as more flexibility with depanelization methods.


TRI Announces Relocation of its North America Branch Office

TAIPEI, TAIWAN - Test Research, Inc. (TRI) officially announces the relocation of its North America branch office, Test Research USA, Inc., since July 1, 2016.

The contact information of Test Research USA, Inc. listed below will become effective on July 1, 2016:




 
 
Registration Open with New Exhibition Features at SEMICON Europa
GRENOBLE, FRANCE - Today SEMI announced registration opened for Europe’s largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble. Featuring over 100 hours of technical sessions and presentations, SEMICON Europa includes semiconductor equipment and materials as well as additional topics, such as Imaging, Power Electronics, and Advanced Packaging.
SMTA and IPC: Cleaning and Conformal Coating Conference Program Finalized
MINNEAPOLIS, MN - The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Viribright Lighting Announces US Patent Award for LED Packaging Design
CORONA, CA - Viribright Lighting, Inc., a global leader in LED lighting manufacturing, announced today that is has received a US Patent (US 9,379,300) for the design of an LED chip welded in a flip-chip manner on a floating copper heat radiation support. The Viribright LED packaging design generates more lumens per watt with better control of heat dissipation than previous LED manufacturing methods.

 


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