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YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter

SAN DIEGO, CA - Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH.
 

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Ersa to Attend the SMTA Houston/Dallas Expo & Tech Forums

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans exhibit at the SMTA Houston & Dallas Expo and Tech Forums.
 

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PI: E-754 Nanopositioning Controller for Piezo Stages Provides Higher Resolution

New High-End Controller/Driver based on 4 decades of piezo nanopositioning experience produces higher resolution, bandwidth.

AUBURN, MA - Once again, PI has improved upon its best in class with a new reference-class digital controller / driver offering higher bandwidth and resolution, along with 3 times the driver power of its predecessor.
 

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Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Halogen- and Halide-free Material Designed for High Throughput

IRVINE, CA - Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.
 

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Networked 3D Inspection from Viscom at DELTEC

HANOVER, GERMANY - For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH & Co. KG in Furth im Wald, Bavaria, Germany, relies on 3D systems from Viscom AG.
 

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Vi TECHNOLOGY Will Discuss Innovative Process Improvement Software for Smart Factories at ENOVA STRASBOURG

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth D22 at ENOVA STRASBOURG, scheduled to take place March 15-16, 2017 at the Parc des Exposition in France.
 

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EPLAN Virtual Engineering Fair returns March 21

SCHAUMBURG, IL - EPLAN’s digital engineering fair is back bigger and better, providing the global engineering community with a 12-hour window on Tuesday, March 21 to watch live presentations and consult with specialists about EPLAN software solutions.
 

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Seika Recognizes Top Performing McDry Reps during APEX

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its top McDry representatives for 2016.
 

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Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.

Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
 

3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

Internet of Things: a promising future for sensors| Yole Développement & Fraunhofer EMFT seminar - Munich, July 3&4
LYON, FRANCE - The MEMS & sensor offering has never been so diverse. Inertial, pressure, temperature, (bio-)chemical and gas sensors as well as microphones, fingerprint and iris recognition. All devices are part of the IoT revolution.

 


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