Wednesday, June 29, 2016



U.S.Tech Gears Up for SEMICON West

With only two weeks left until SEMICON West, we’ve been hard at work preparing a packed show issue of U.S.Tech. This issue includes a special feature section on test and assembly, as well as our regular full body of information on new products and developments.

Our team will be appearing at the show in San Francisco, July 12-14, and are looking forward to meeting with readers, friends and colleagues. Stop by booth #6544 to discuss editorial opportunities and promotional plans.

We are also pleased to announce that our editor, Walter Salm, will be attending the show. He has been an avid supporter of the industry for many years and will join us once again on the show floor to cover the latest technology.

We look forward to seeing you there!

B2B Technology Companies Focusing More on Thought Leadership to Stay Competitive

By Patrick Roberts

The need for thought leadership in technology markets has never been greater. Companies win or lose lucrative contracts based on it. Universities and research foundations receive or are denied grants because of it. And entire industries are relocated to cities, states and countries where perceived opportunities are better for it.

Henkel Launches Adhesives Recycling Program

Partners With TerraCycle® as First Company to Recycle Anaerobic Adhesives Packaging

TRENTON, NJ - Henkel, a leading manufacturer of adhesives, sealants and functional coatings, including the Loctite® brand, is partnering with TerraCycle to become the first company to offer a recycling solution for anaerobic adhesives. Through the Adhesive Recycling Program, Henkel customers can purchase a postage-paid recycling box that they fill with empty Loctite adhesive containers and send to TerraCycle for processing.

KEMET Awards Digi-Key 2015 High Service Distributor of the Year Award

GREENVILLE, SC - KEMET, a leading global supplier of electronic components, announced Digi-Key as the winner of its 2015 High Service Distributor of the Year Award. Digi-Key’s exceptional growth in specialty product categories, customer count, financial performance and sales metrics were among the criteria used to select this year's winner.

KIC follow up ‘Making Ovens Smarter’ with free webinar on July 13th 2016

SAN DIEGO, CA - On July 13th at 9am Pacific, 12pm Eastern, Miles Moreau and Bjorn Dahle of KIC will present content from their latest white paper in a free live webinar.

This webinar sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter.

Scheugenpflug On A Growth Path

New branch office in Guadalajara, Mexico

KENNESAW, GA - "¡Hola México!“ was the motto a few weeks ago on May 1 when Scheugenpflug, the specialist for metering and dispensing technology, opened a new branch office in Mexico’s Guadalajara. With the addition of Scheugenpflug México, S. de R.L. de C.V. the company extends its reach in the Americas and strengthens its ability to support new and existing customers. "

Scienscope Increases Its Demo and Service Facility by 6,000 ft2

Chino, CA - Scienscope International, a complete inspection solutions provider, today announced that it has expanded its facility in Chino by adding an additional 6,000 ft2. The new space primarily will be used to expand the company’s demo room.

Seika Machinery Increases Its Technical Support

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that is has expanded its technical support offering. Now, the company has technical service centers at its Atlanta and San Francisco branches.

Tech-Etch: Photo Etching Tungsten for Medical Applications

PLYMOUTH, MA - Tech-Etch specializes in the photo chemical etching of tungsten. Because tungsten is extremely dense, 71% heavier than lead, it is used in medical applications, including grids used to collimate and attenuate stray x-rays in CT scanners, as well as ID tags used in implanted medical devices.

IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards
BANNOCKBURN, IL - In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.


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