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MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2018

Hall 4A, Stand 140

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their 3D AOI systems, MV-6 OMNI and MV-3 OMNI, as well as their total quality management system software, INTELLISYS, in distributor pb tec’s booth in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place June 05-07, 2018, at the Messe in Nuremberg, Germany.       
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CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor Scanners at the European Mask and Lithography Conference

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will lead a poster presentation during the Technical Exhibition at the European Mask and Lithography Conference (EMLC), June 19-20 in Grenoble, France.       
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"Ready for the Next Step“ – Rehm Shows Innovations at SMT in Nuremberg

Hall 4A, Booth 100

Every year, SMT hybrid packaging addresses current topics related to electronics manufacturing and puts these in the focus of the event. What’s more, 2018 is all about the ever-growing field of digitalisation, the fourth industrial revolution and smart factory.       
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Nanosystec Introduces NanoPlace with Selective Laser Soldering to Address This Challenge

Selective laser soldering for small wires and pads

FREEMONT, CA - Selective Laser Soldering is the superior method for soldering wires with diameter of less than 250µm (> 30 AWG) or pads with similar dimensions (< 10 mil). The laser beam heats only the small processing area, while all surrounding components and circuits are not affected.      
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For Industrial Use: PI Offers New High Performance High Load Linear Stages Family, Ballscrew/Linear Options

Compared to the competition, these PI-engineered stages offer higher load capacity, allowing for higher dynamics, often required by industrial applications.

AUBURN, MA - The new reference-class linear stages family, L-417 and V-417, from precision nanopositioning global leader PI (Physik Instrumente), are available in ballscrew and linear motor configurations, both cost effective designs, offering high resolution with improved tracking performance, smaller tracking error, and improved settling time.        
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Sonobond Offers Effective Solution for Auto Component Manufacturers

Ultrasonic Dual Head Welder Achieves High-Strength Welding of High Voltage Terminals without Causing Fracturing

WEST CHESTER, PA - Automotive component manufacturers now have a reliable, environmentally friendly and cost-effective solution for assembling high voltage terminals used for storage in electric and hybrid vehicles.        

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Indium Corporation to Feature Indium8.9HF Solder Paste at SMT Hybrid Packaging

Booth #4-301

CLINTON, NY - Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at SMT Hybrid Packaging, June 5-7, in Nuremberg, Germany.

Indium8.9HF Solder Paste is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry.       
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Koh Young America Participating at the eSMART Factory Conference

CHANDLER, AZ - Koh Young is synonymous with innovative, pioneering technologies and its efforts to advance Industry 4.0 solutions further demonstrate its dedication. Recently, it has revealed smarter, faster technologies integrated with its AI-powered KSMART platform to help enable a smart factory.     
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Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
Avnet Showcases Connected Ecosystem at IoT World 2018
PHOENIX, AZ - Avnet, a leading global technology company, will be showcasing its connected ecosystem this week at Internet of Things (IoT) World 2018, May 14-17 at the Santa Clara Convention Center in Santa Clara, Calif. The Avnet ecosystem is an expansive network of owned companies, services, solutions and partners that provides more than two million customers with the tools and resources they need to bring their IoT projects to market.    

DfR Solutions Addresses Mission-Critical Impact on Electronics Reliability: System-Level Effects on Solder Joints in Harsh Environments
BELTSVILLE, MD - DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum, Maryland, taking place May 15-17, 2018.
 

Specialty Coating Systems Announces New Dates for Educational Parylene Seminars in Malaysia and Singapore
INDIANAPOLIS, IN - Specialty Coating Systems today announced a date change for its upcoming free, educational Parylene conformal coating seminars. The Singapore seminar will now be held on Thursday, July 19, 2018, and the seminar in Penang, Malaysia will take place Tuesday, July 24, 2018.       
 


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