Friday, November 24, 2017


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Big Data and Automation Major Focuses of productronica 2017

By Michael Skinner, Associate Editor

This year’s productronica focused on two key ideas: increased use of data in manufacturing and greater levels of automation. The Internet of Things (IoT) and Industry 4.0 trends are being powered by huge amounts of information.
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Heraeus Electronics and Mozaik Technology Ventures Sign Global Licensing Agreement for Photoimageable Thick Film Technologies

Technology will enable Heraeus to develop a new platform of thick film pastes for ultrafine features, furthering device performance and miniaturization.

HANAU, GERMANY and LONDON, ENGLAND - Heraeus Electronics, a leading provider of materials solutions for the semiconductor and electronic packaging industries, today announced a global licensing agreement with Mozaik Technology Ventures Limited, an industry leader in super fine thick film technology.

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Medium Load Hexapod 6-Axis Motion Platform Introduced by PI

New 30kg-class hexapod added to family of 6-axis parallel positioning systems providing precision and versatility for loads from 2kg to 1,000+ kg.

AUBURN, MA - With the usability of 6-axis hexapods increasing in research and industry applications, PI introduces a new medium load 6-axis precision motion platform, the H-825 hexapod. The H-825 provides a self-locking load capacity up to 30 kg (66lbs).
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BTU to Discuss New Process Monitor at SMTA Silicon Valley Expo

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 29, 2017 at Bestronics, Inc. in San Jose, CA.
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NEW Mission Critical Flat Cables Video from Cicoil

VALENCIA, CA - Cicoil, the leading manufacturer of high performance Flat Cables, is pleased to announce its newest video: “Mission Critical Flat Cables”. View the broadcast here and learn why Cicoil is the “Go-to” source when unparalleled performance is critical and cable failure is not an option: 
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W├╝rth Elektronik eiSos Eagerly Awaits the FIA Formula E Season Opener

WALDENBURG. GERMANY - On December 2, 2017 the Audi Sport ABT Schaeffler racing team starts the fourth season of the FIA Formula E Championship in Hong Kong. As a technology partner from the outset, the Würth Elektronik eiSos Group continues to shape the success of the team.
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Fujipoly® Introduces Economical Thermal Interface Material

CARTERET, NJ - Sarcon® GR14A-50GY from Fujipoly® is a low-cost general purpose thermal interface material that is offered in sheets or custom shapes to fit your exact application. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap filler pad can transfer heat with a thermal conductivity of 1.6 W/m•K while exhibiting a thermal resistance of .61° C•in2/W at 14.5 PSI.
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Viscom AG Announces the Release of an Optimized Inspection System Operation with vVision 2.4

HANOVER, GERMANY - Viscom AG announces the release of vVision 2.4, successfully delivered since mid-2017 for its modern operating software. Among the most important optimizations are a time-saving inspection program creation – especially for new components and special component types – and comprehensive 3D advancements like the 3D solder joint inspection for chips.
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Alpha Shares Process Expertise on SMT & Wave Soldering by Hosting Technical Seminars for Top EMS Companies in India
SOMERSET, NJ - Alpha Assembly Solutions, a leading global supplier of innovative electronic assembly materials, is hosting workshop and knowledge sharing events in both Northern and Southern India to focus on guidelines and best practices to optimize your SMT assembly process.
Conveyor Technologies Inc Merge with Alotech
SANFORD, NC - Conveyor Technologies of Sanford, NC pleased to announce that we have entered into a definitive merger agreement with Alotech Inc, a leading provider of custom automation assembly manufacturing and machine fabrication services.

The merger with Alotech Inc, Goldston, NC further strengthens our position in the electronics assembly equipment market.

KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey. 
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (, manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.

"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.


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