-> Home/Current Issue
Tuesday, March 20, 2018


Home/Current Issue > 

Atlas Material Testing Technology Exhibits at American Coatings Show 2018

Booth #645

MT. PROSPECT, IL - Atlas Material Testing Technology, the global leader in weathering technology and services, is exhibiting at the American Coatings Show 2018, in Indianapolis, Indiana April 12-14th (booth #645).

Atlas is showcasing five of its most popular weathering testing instruments that enable users to test products realistically under accelerated conditions. 

Read More

Data I/O to Showcase Award-Winning UFS Programming Technology at NEPCON China

The combination of UFS programming technology in a PSV system delivers the maximum performance, flexibility and throughput for the lowest total cost

SHANGHAI, CHINA - Data I/O Corporation, the leading global provider of advanced data programming and security provisioning solutions for flash, flash-memory based intelligent devices and microcontrollers, will showcase its award-winning UFS device programming technology on the Lumen™X in Booth #1A32 at NEPCON China, scheduled to take place April 24th – 26th at the Shanghai World Expo Exhibition & Convention Center.  
Read More

VJ Electronix to Demo XQuik with Material Handling Automation at NEPCON China

Stand 1F32

CHELMSFORD, MA - VJ Electronix, Inc., a leading global provider of advanced X-ray inspection, component counting systems and PCB rework technologies, will exhibit in Stand 1F32 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. 
Read More

Seica Attends Technology Days of Anglo Production Process

Seica attended the Technology Days of Anglo Production Process (APP) on 13th and 14th March, an event organized by the Birmingham Company which operates as a representative and provider of products for Electronic Manufacturing in the United Kingdom. 
Read More

Rehm Offers Straightforward Tool for Minimizing Voids

“Void Expert” – Expert Database Covering all Aspects of Voids

Blaubeuren-Seissen,Germany - Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, i.e. the reduction or elimination of cavities in the connection technology used between component connectors and connector pads. With its Void Expert database, Rehm is offering a tool which provides an overview of influencing factors and interaction among the mechanisms which result in voids.

Read More

Güdel Introduces TMF-6 TrackMotion Floor for FANUC M2000iA Robot Family

ANN ARBOR, MICHIGAN. Güdel, a global manufacturer of linear motion modules, robot track motion units and gantry robots and components, is pleased to announce the market introduction of the new second-generation TMF-6 TrackMotion Floor for the expanding class of super-heavy-payload robots.

Read More

Creative Electron Premieres New TruView™ 10 X-Ray Software

San Marcos, CA - Creative Electron, the leading American supplier of x-ray machines to the electronics industry, unveiled its new software last week at the IPC – Association Connecting Electronics Industries (IPC) APEX Expo.  The software is an innovative approach to the user-experience of inspection and analysis.

This year, for the company’s 10-year anniversary, Creative Electron updated the heart of its x-ray machinery.  On display at APEX Expo, the new interface amazed passers’ by with its speed and ease of use.  The new TruView™ 10 x-ray Software boasts automated paths with repeatable tests, user created programs and test procedures, and overall increased system speed.

Read More

Techcon Introduces New Valve Controllers for the Smart Factory

Cypress, CA Techcon, a leader in precision fluid dispensing technologies, is pleased to introduce its new series of smart valve controllers: the TS550R, TS560R, TS570R and TS580R. Equipped with a universal power supply, the new smart valve controllers are fully ‘plug and play' and can be used immediately, anywhere in the world.
Read More

TopLine PID Vibration Damping Technology was a Hit at APEX; But TopLine’s Kid Needs a Name


This sharp little fellow needs a name. Please help us give him one! 

Irvine Ca – TopLine’s 21st time exhibiting at the IPC/APEX Expo, this time in San Diego, California, marked the roll-out of the company’s new patented Particle Impact Dampers (PID) technology, which was well-received by attendees who have been looking for a way to mitigate or curb the harmful effects of random vibration in electronic components and assemblies.

Read More

Würth Elektronik eiSos and Infineon present wireless power development system 200-W-WPT

Combining wireless power and data transmission

Waldenburg, Germany – Under the name 760308EMP-WPT-200W, Würth Elektronik eiSos and Infineon Technologies AG are offering a 200-watt development system for wireless power transfer. What makes the development kit special is that the link between the transmitter and receiver coils can be used to transfer not only power but also data.

Read More

TTI Dedicates Andrews Distribution Center to Honor Founder and CEO, Paul Andrews
Bill Speer, left, TTI Facilities Director; Hobey Strawn, TTI Vice President Operations Americas; Don Akery, President, TTI Americas; Paul Andrews, TTI CEO; Mike Morton, TTI COO; Chris Goodman, TTI Sr. Vice President Finance and CEO 
Fort Worth, Texas – During a company kickoff event for employees attending the annual TTI sales leadership conference, a special dedication ceremony took place to unveil the name of TTI’s newly constructed distribution center. Named in honor of the company’s founder and CEO, Paul Andrews, the facility has been crowned the Andrews Distribution Center.

Avnet Adds Programmable Logic Alternative to 96Boards Community with New Ultra96 Development Board
PHOENIX, AZ – Avnet , a leading global technology distributor, today announced the new Ultra96™ development board. Avnet’s Ultra96 board adds a wide range of potential peripherals and programmable logic acceleration engines not previously available on the 96Boards platform. Avnet will be previewing and accepting pre-orders for the new board at the Linaro Connect Conference, March 19-23, Regal Airport Hotel in Hong Kong.

Ersa Announces Versaflow 3 Application Training Course in April
PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that it will hold an ERSA Versaflow 3 Selective Soldering Level II Application Training Course from Wednesday, April 18, 2018 at 1 p.m. to Friday, April 20, 2018 at 12 p.m. at its Plymouth office. 

search login