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Fujipoly: 17-Watt Thermal Interface Pad

CARTERET, NJ - Sarcon® 30XR-m from Fujipoly® is a high-performance thermal interface material that exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape.        
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Emil Otto Massively Expands the Cleaning Media Product Area

On the occasion of the SMT 2018, Emil Otto will present a range of new cleaning media to the expert audience. Products added to the portfolio include the cleaning agents Etimol from the stencil cleaning area, cleaning of soldering systems and metering devices incl. conformal coating systems, component cleaners as well as cleaning agents for solder and conformal coating frames.        
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Mencom Announces Easy, Flexible and Reliable Modbus Gateways for Seamless Conversions in harsh Environments at IMTS 2018

Booth # 134752 in IAMD USA - East Building, Level 3

OAKWOOD, GA - Since its debut, Modbus has become one of the most popular protocols used worldwide. Modbus RTU (through serial connection) and Modbus TCP (through Ethernet networks) are often used in the crucial parts of industrial automation, substation automation, and building automation.         
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Heller to Unveil New Nitrogen Vacuum Reflow Oven at SMT Nuremberg.

Stand 4-251

Premier oven innovation company, Heller Industries, will showcase its latest reflow oven on stand 251 in Hall 4 at this year’s SMT Hybrid Packaging event in Nuremberg. The company’s new 1911MkIII-V Nitrogen Vacuum reflow oven comprises 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Heller’s award-winning COOL-PIPE flux management system.         
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Dover Corporation Selects OK International- Cypress an an Inaugural Winner of the Dover Safety Excellence Award

CYPRESS, CA - Dover Corporation today presented the 2017 Dover Safety Excellence Award to the OK International facility in Cypress, California. The award was based on both quantitative and qualitative measures for outstanding safety performance and exemplary employee participation in safety programs. OK International, a Dover Company, received the Gold Award for the small site category (under 150 employees).         
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CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

Booth #6163

MINNEAPOLIS, MN - CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA.          
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FKN Systek: K4000 M24 Singulates Metal Core Panels

Dual Blade Depanelizer effortlessly separates pre-scored metal core panels.

MILLIS, MA - Singulate a variety of pre-scored metal core panels with the K4000 M24 Double Circular blade depanelizer. The two long lasting sharp blades are set to shear pre-scored aluminum or copper panels on the motorized K4000.       
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Imaging Veteran Joins FRAMOSĀ® as Vice President of Sensor Engineering

Chris Barrett, an industry veteran with over 20 years’ experience in engineering, R&D, operations and product development has joined FRAMOS as its Vice President of Sensor Engineering. FRAMOS is the leading technology provider in embedded vision, industrial, scientific and medical image processing with a comprehensive portfolio of imaging components and services from sensor to system.       
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Technic Announces US Distributor Partnership with OrigaLys ElectroChem

Cranston, RI – Technic has announced an agreement with OrigaLys ElectroChem of Lyon France for distribution of their product line to the US market.  OrigaLys manufactures an extensive line of electrochemistry instruments , including Potentiostats (mono and multi-channel), Galvanostats, Impedance Meter or Rotating Disc Electrodes. The company also distributes software and accessories including a variety of electrodes, tips and ancillary equipment and tools.

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Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        

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