Wednesday, October 26, 2016


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ScoopTalk Brings Hottest Industry Topics to the Front & Centre of Conversations at electronica 2016

After its successful launch in Chicago in September, Scoop will take their ‘ScoopTalk’ programme on the road to electronica in Munich, Germany from 8th to 11th November 2016.

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All Flex Announces Flexible Circuit Video Library

All Flex announces video series to educate customers and prospects of flexible circuitry

NORTHFIELD, MN -All Flex, a manufacturer of flexible printed circuits and flexible heaters, has announced that the company has added a library of videos about flexible circuitry that serve as an educational resource for designers, product development engineers, electronic technicians and hardware engineers.

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Avnet to Distribute Frequency Control Products from Bliley Technologies, Inc. in the Americas

PHOENIX & ERIE, PA - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today announced a distribution agreement with Bliley Technologies, Inc., a supplier of high-performance RF and microwave low-phase noise frequency generation and timing products.

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Beta Layout: New 3D technologies- 3D MID layout software and 3D MID prototype production

electronica 2016: Hall B4, Stand 351

AARBERGEN, GERMANY – Beta LAYOUT, a leading manufacturer and service provider for all aspects of prototype printed circuit boards, is again exhibiting interesting innovations at this year's edition of electronica on 8–11 November in Munich.

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Cogiscan and Panasonic Partner to Enable the Connected Factory

BROMONT, CANADA - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, together with Panasonic Factory Solutions Company of America, today announced a new strategic initiative in their long-term partnership. The new program combines both companies’ leading products to enable the connected factory, the cornerstone of Industry 4.0.

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Emerson Spotlights Branson GVX-2H/HR Vibration Welder at Assembly 2016

Compact, Clean Solution for High-Quality, Fast-Cycle Production

Danbury, CT Emerson showcases the Branson GVX-2 H/HR vibration welder, for the first time in the Americas, at the Assembly Show 2016.  The GVX-2H/HR sets a new standard for vibration welding quality, and throughput reconfirming Branson’s position as a global technology leader. GVX–2H/2HR combine a compact footprint and large lift table with precise servo motor drives, closed-loop controls and other powerful features to enable fast-cycle vibration welding of plastic components for automotive, appliance, medical, electronic and other demanding applications.   

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Fujipoly®: Free Samples Faster

CARTERET, NJ - Some of the most cumbersome steps in evaluating the performance of a thermal interface material are requesting product samples and receiving quotes. To eliminate this frustration, Fujipoly® created an online suite of features that allow engineers to request free samples and/or quotes with the click of a mouse.

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Indium Corporation’s Lasky Outlines History, Applications, and Future of Indium

CLINTON, NY - Indium Corporation's Dr. Ron Lasky, Senior Technologist, delivers an informative overview of the history of, and insight into the future use of, indium metal in a video available at

As part of the Electronics Assembly with Phil Zarrow series, this video features Lasky and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing historical and unique indium and indium alloy applications.

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Stéphane Bussa Appointed Physik Instrumente Vice President of Sales & Marketing

Bussa’s focus is on solution-centered customer consultations, initially technology-agnostic, as key to PI’s global success and continued growth as an industry leader.

AUBURN, MA – Motion control and nanopositioning solutions expert PI (Physik Instrumente) has named Stéphane Bussa as Vice President, Sales & Marketing, in Karlsruhe, Germany.

In 2007, Bussa joined PI France SAS in Paris as Managing Director and was promoted, in 2012, to Président / CEO PI France SAS, Paris / Aix en Provence, the title he most recently held.

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Pulse Electronics’ FluidWRITER Printers Print Directly on 3D Surfaces

Conductive inks produce high-performance antennas, sensors, and electrical circuits

San Diego, CAPulse Electronics Corporation introduces a new generation of FluidWRITER™ printers that create printed electronics directly on 3D surfaces.

FluidWRITERS incorporate innovative FluidANT™ print technology which enables the use of conductive ink to produce high-performance antennas, sensors, and electrical circuits on 3D surfaces. FluidANT uses affordable micron particle inks to print on standard plastic substrates that have robust mechanical properties, enables new integration possibilities,

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Scienscope Expands Its Field Service/Applications Team

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced the hire of Mary Westmoreland as the newest addition to its Field Service/Applications team. Westmoreland will be based out of Scienscope’s Chino office.

Westmoreland joins Scienscope’s Field Service/Applications team with more than 10 years of industry experience in SMT and thru-hole, semiconductor, fiber optics, and electro-mechanical assembly.

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SHENMAO America, Inc. Exhibits November 14, 2016 at MEPTEC Semiconductor Packaging Roadmap Symposium, Introduces Semiconductor Packaging Materials

At the Holiday Inn Silicon Valley San Jose, CA USA - Booth # 17

SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

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SPEA 8-axes Flying Probe Tester at Electronica 2016

VOLPIANO, ITALY - At the next-coming Electronica, SPEA will reveal to European and worldwide market its new 8-Axes Dual-Side Flying Probe Tester, in the year of its 40th corporate anniversary.

4080 sets new benchmarks for flying probe board testing in terms of productivity and contacting accuracy.

Innovative granite chassis, combined with state-of-art linear motion technologies, offers low vibration and thermal stability, ensuring unprecedented probing precision at ultra-fast test speed.

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Techcon Systems to Display New Positive Displacement PC Pump at The ASSEMBLY Show in Rosemont

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Booth #345 at The ASSEMBLY Show, this week from Oct. 25-27, 2016 in Rosemont, IL. The team will demonstrate the new TS8100 Series Positive Displacement PC Pump, along with its dispensing robots. The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology.

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SEMICON Europa Opens Tomorrow in Grenoble, France
GRENOBLE, FRANCE - SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing. Co-located with the IoT Planet exhibition at the Alpexpo in Grenoble, France, SEMICON Europa features more than 400 international exhibitors representing all segments and sectors of the semiconductor supply chain. SEMICON Europa 2016 will run from 25-27 October.

World PCB Production in 2015 Estimated at $58.6 Billion
BANNOCKBURN, IL - The world market for printed circuit boards (PCBs) reached an estimated $58.6 billion in value in 2015 according to IPC’s  World PCB Production Report for the Year 2015. This represents a nominal decrease of 2.7 percent from 2014, but factoring out the effects of exchange rate fluctuations, the growth of PCB output was actually up 2.0 percent in real terms.

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings
ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.


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