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Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

LOGAN, UTAH - Inovar, Inc., a full-service EMS provider, announces that it has secured a spot on Utah State University’s Innovation Campus. Company officials broke ground on a 100,000 sq. ft. facility at the university’s research park on Monday, June 12.

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APEM Develops New Options for K Series Rocker Switches

VISTA, CA - APEM’s KR and KL rocker switches feature an up-to-date design with a large selection of colors and markings, extreme robustness and high ratings. KR and KL series new options are:

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New Light-curing Adhesive from DELO Offers Excellent Peel Resistance

DELO PHOTOBOND GB4033 is ideal for use in wearables and consumer electronics

SUDBURY, MA - DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, now offers a light-curing acrylate with excellent peel resistance for seal bonding.


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W├╝rth Elektronik eiSos Expands its WE-HCF Product Family: High Current Flat Wire Power Inductor with Higher Saturation Current

WALDENBURG, GERMANY - Würth Elektronik eiSos presents WE-HCF in a 2815 package, a flat wire power inductor with very high current loading capacity and efficiency. The latest member of the WE-HCF series is loadable up to 36 A and attains saturation currents up to 125 A.
 

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Hernon Manufactruring, Inc.: Electric Motor Adhesive Solutions

SANFORD, FL - Hernon Manufacturing offers more than 5000 different adhesives and sealants used in hundreds of industries and niche manufacturing applications.
 

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Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

SEMI Europe Applauds New Semiconductor Manufacturing Investment
BERLIN, GERMANY - SEMI Europe today commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional innovation. SEMI Europe, the European regional office of the global industry association SEMI, engages SEMI members to advance the global electronics manufacturing supply chain.

 


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