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Pickering Interfaces Expands Range of 2A PXI Fault Insertion Switching

Designed to Simulate Fault Conditions in Automotive and Avionics Test Applications

Clacton-on-Sea, UK – Pickering Interfaces, a leading provider of modular signal switching and simulation for electronic test and verification, has expanded their range of PXI Fault Insertion Switching.

These new PXI Fault Insertion Switches (model 40-202), available with 22 or 11 fault insertion channels, were primarily designed to simulate fault conditions in automotive and avionics test applications involving the reliability testing of safety-critical controllers.


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PAC-Global and CEME Now Represent Saki in the Southern US and Mexico

Handle complete line of 2D and 3D SPI, AOI, and AXI inspection and measurement systems

Fremont, CA  - Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that PAC Global Inc. and Competitive Edge Manufacturing Equipment (CEME) have joined the Saki America team in the Southern United States and Mexico. The companies are representing Saki's complete line of 2D and 3D automated solder paste, automated optical, and automated x-ray (SPI, AOI, and AXI) inspection and measurement systems and software and Saki's Smart manufacturing, Industry 4.0, and machine-2-machine initiatives.

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PDR Joins Forces with USM Reps in Mexico

Shingle Springs, CA PDR, an industry recognized leader in IR rework since 1986, is pleased to announce that it has partnered with USM Reps its manufacturers’ representative. Eduardo Ortiz will represent PDR’s IR rework systems throughout Mexico (excluding Baja), the Central America region and El  Paso, TX.


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Vi TECHNOLOGY to showcase the most innovative SPI product since the introduction of Moiré systems

Saint-Egrève, France Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that it will exhibit with its representative at the S.E.E. Scandinavian Electronic Event, scheduled to take place April 24-26, 2018 at the Kista Expo Center in Sweden. Wretom will showcase the PI Series 3D SPI in Booth C02:30.


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TopLine Exhibits CCGA Solder Joint Reliability Solutions at NEPCON China 2018

Irvine CA TopLine will exhibit for the 5th straight year at NEPCON China in Shanghai, in Stand #1A21. Featured products will include CCGA - Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.


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The Murray Percival Company Now Represents optical control’s Component Counting Technology

optical control GmbH & Co. KG, a world leader in automated component counting technology, today announced that it has signed on with The Murray Percival Company to represent its technology throughout the Midwest.    
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Tom Forsythe Will Present Industry 4.0 Cleaning Methods at the eSMART Factory Conference

NASHVILLE, TN - KYZEN announces that Tom Forsythe, Executive Vice President, will present during the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. Forsythe will present the paper entitled, “Applying Industry 4.0 Methods to Electronic Assembly Reflow and Cleaning Process.”    
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Rutronik Expands Sales Network in North America with New Offices in Boston & Silicon Valley

Rutronik Inc. opens new locations in Concord, MA and Santa Clara, CA to support customers in key North American markets

PLANO, TX - Rutronik Inc., a leading global broad-line stocking distributor with a comprehensive portfolio of electronic components, has opened two new offices in key regions – Boston and Silicon Valley – as part of an ongoing sales network expansion in North America.    
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SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 


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