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Tom Tattersal of MicroCare at APEX 2017


Nordson YESTECH Launch Advanced New FX-942 In-Line Dual-Sided Optical Inspection System at APEX 2017

CARLSBAD, CA - Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry launched their latest innovation, the FX-942 Dual-Sided Optical Inspection System, at the IPC APEX exhibition held in San Diego USA 14th – 16th February 2017.

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Comtree to Represent Ersa’s Rework and Selective Solder Equipment at EPTECH Edmonton

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit with Comtree at EPTECH Edmonton, scheduled to take place Tuesday, March 7, 2017 at the Doubletree by Hilton in Edmonton, AB.
 

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New Rapid Dual Thermal Defect Detection & Component / Solder-Joint Validation from PDR Americas

SHINGLE SPRINGS, CA - PDR, a leader in IR rework, test and inspection, is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems.
 

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Linear Technology SmartMesh IP wireless sensor networks | Digi-Key Daily


YAMAHA Wins Coveted NPI New Product Award at APEX 2017 for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter

SAN DIEGO, CA - Yamaha Motor Corporation, USA won a coveted New Product Introduction (NPI) Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH.
 

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PI: E-754 Nanopositioning Controller for Piezo Stages Provides Higher Resolution

New High-End Controller/Driver based on 4 decades of piezo nanopositioning experience produces higher resolution, bandwidth.

AUBURN, MA - Once again, PI has improved upon its best in class with a new reference-class digital controller / driver offering higher bandwidth and resolution, along with 3 times the driver power of its predecessor.
 

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Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Halogen- and Halide-free Material Designed for High Throughput

IRVINE, CA - Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.
 

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Networked 3D Inspection from Viscom at DELTEC

HANOVER, GERMANY - For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH & Co. KG in Furth im Wald, Bavaria, Germany, relies on 3D systems from Viscom AG.
 

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Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.

Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
 

3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

 


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