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IPTE Participates at the German Pavilion at NEPCON Shanghai 2017

Easy Test Handler, EasyRouter with Cobot and FlexRouter II to be presented.

GENK, BELGIUM - IPTE is represented with its Easy Test Handler ETH and the depanelers EasyRouter, TopRouter and FlexRouter II at the German Pavilion (Stand: 1C05) at NEPCON Shanghai China 2017 from April 25 - 27.


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Hanwha Techwin Debuts New Features on Pick-and-Place Systems

IRVINE, CA - Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced new PLUS features on its next-generation SM Series pick-and-place systems.

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Tom Tattersal of MicroCare at APEX 2017


Nordson YESTECH Launch Advanced New FX-942 In-Line Dual-Sided Optical Inspection System at APEX 2017

CARLSBAD, CA - Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry launched their latest innovation, the FX-942 Dual-Sided Optical Inspection System, at the IPC APEX exhibition held in San Diego USA 14th – 16th February 2017.

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Comtree to Represent Ersa’s Rework and Selective Solder Equipment at EPTECH Edmonton

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit with Comtree at EPTECH Edmonton, scheduled to take place Tuesday, March 7, 2017 at the Doubletree by Hilton in Edmonton, AB.
 

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New Rapid Dual Thermal Defect Detection & Component / Solder-Joint Validation from PDR Americas

SHINGLE SPRINGS, CA - PDR, a leader in IR rework, test and inspection, is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems.
 

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Linear Technology SmartMesh IP wireless sensor networks | Digi-Key Daily




 
 
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.

Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
 

3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

 


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