Tuesday, February 21, 2017


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Gala Dinner Celebrates 30 Years of Seica S.p.A

Gala dinner event in Castello of Pavone, Turin, Italy marks 30 years in business for the ATE manufacturer

STRAMBINO, ITALY - To mark the 30th anniversary of the founding of Seica S.p.A, President, Mr. Antonio Grassino and General Manager, Ms. Barbara Duvall, hosted a gala dinner on January 19th at the hotel “Castello di Pavone”. The event was held in conjunction with the Kick off Sales meeting, a biannual event for Seica’s global sales network.

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Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Halogen- and Halide-free Material Designed for High Throughput

IRVINE, CA - Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

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Cogiscan Presents Horizon Sales with Business Development Achievement Award during APEX

BROMONT, CANADA - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, is pleased to announce that it has awarded Horizon Sales with its Business Development Achievement Award.

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Ironwood Electronics: Production test Socket for Leaded Ceramic Device

Socket and Test your 64 lead Flat pack device using extreme temperature socket

EAGAN, MN - Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing 64 lead flat pack - CBT-QFE-3011. The device is to operate at frequencies up to 3.2 GHz, accounting for some harmonics that could be higher frequency. To test these devices, a high performance contact is needed.

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Beta LAYOUT Is Offering the World's First FREE 3D-MID Design Software

AARBERGEN, GERMANY - The company, renowned for their PCB-POOL® prototype manufacturing service is offering this comprehensive design software for FREE.

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Rogers Corporation's Elastomeric Material Solutions Division to Exhibit at 2017 Foam Expo

ROGERS, CT - Rogers Elastomeric Material Solutions (EMS) will be exhibiting at the upcoming Foam Expo to be held at the Suburban Collection Showplace in Novi, Michigan (Feb 28 thru March 2) at booth #1120.

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Indium Corporation Names Nash as Product Manager – PCB Solder Paste
CLINTON, NY - Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.

Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry.

Indium Corporation Expert to Present at EPP InnovationsFORUM, Germany
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.

PSMA Announces APEC 2017 Industry Session on Energy Harvesting
MENDHAM, N.J.- At APEC 2017, the PSMA's (Power Sources Manufacturers Association’s) Energy Harvesting Committee will host an Industry Session featuring five industry experts who will cover such topics as real-world applications, conditional monitoring, energy harvesting systems, PMICs (Power Management ICs) and low-power IoT (Internet of Things) devices.


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