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Kurtz Ersa Inc. to discuss its reflow, selective solder and rework equipment at the CTEA Expo

Plymouth, WIKurtz Ersa Inc., a leading supplier of electronics production equipment, today announced plans to exhibit at the CTEA (Austin) Expo & Tech Forum, scheduled to take place Tuesday, August 14, 2018 at the Norris Conference Center in Austin, TX. The Ersa team will discuss its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa Hotflow 3/20, Smartflow 2020 and HR 550. 


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Swissbit Highlights Memory Solutions For Harsh Environments

Swissbit announces product launches for Flash Memory Summit 2018

Bronschhofen, Switzerland – Swissbit AG, a leading manufacturer of industrial-grade flash memory solutions, will be exhibiting its latest memory innovations at the Flash Memory Summit 2018 in Santa Clara, California (August 7-9, 2018). On booth #419 of the Santa Clara Convention Center, Swissbit will launch its latest 3D-NAND-based memory solutions for industrial temperature grades including the PCIe M.2-Module N-10m2 and a new 2.5” SATA SSD. A further key theme will be memory cards with integrated security features. Tom McCormick, Chief Engineer and Technologist, will be presenting his paper on ‘Flash and Filesystem Codesign’ and will be answering questions about embedded applications at the Expert Chat Session on the Tuesday evening of the show. Swissbit’s Engineering Director for embedded products, Grady Lambert, will be holding a talk on ‘Security risks in industrial environments’.


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Techniseal and Tarniban® from TECHNIC, INC

Proven protection for silver deposits under the harshest conditions

Cranston, RI, USA – Techniseal and Tarniban® KS II are Technic’s premier silver anti-tarnish processes designed to prevent yellow discoloration under the harshest conditions. Both are production proven processes that can be used in barrel, rack, and high-speed reel-to-reel applications. 

Techniseal is Technic’s most powerful silver anti-tarnish. The electrolytic process deposits a nano-scale inorganic coating on the surface of the silver deposit within 5 seconds.


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U.S. Tech Publisher's Choice: July 2018

Internet of Things (IoT) networks are being built across a range of industries, enabled by millions of sensors that detect and respond to external stimuli. For industrial use, it is typical to attach these sensors to the outside of equipment, where they are exposed to the elements and can be damaged during use.
 
Now, it is possible to use 3D metal printing to embed sensors inside heavy industrial equipment, providing information in situ and protecting the devices. In an article entitled, "Building Fiber Optic Strain Sensors into Metal Components," Adam Hehr, research engineer at Fabrisonic, LLC, discusses ultrasonic additive manufacturing that is enabling new applications for sensors.
 
The article covers a few methods to carry out ultrasonic 3D printing, benefits to sensor safety and equipment strength, and a glimpse into the future of this new technology.
 
This article was originally published in the June 2018 issue of U.S. Tech. Click the link to read: "Building Fiber Optic Strain Sensors into Metal Components"
 
 

SMT Thermal Discoveries' Mobile exhibition in Spain and Portugal

 

 
 Maximilian Leppig (1st .f.r.), Area Sales Manager at SMT Thermal Discoveries
Wertheim, Germany - For the first time, SMT Thermal Discoveries participated in the "Technology Day“ of its Spanish representative Propelec S.L. The mobile exhibition and conference presents customers of Propelec S.L. new systems and new suppliers. The event targets people who do not have the opportunity to visit exhibitions abroad. The show started in Porto, Portugal and continued via Barcelona to San Sebastian in Spain.
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Grayhill Launches Touch Encoder Development Kit with Tap, Swipe, and Turn Functions

Flexible HMI component ideal for industrial equipment, digital audio and visual, medical device, or off-highway vehicle applications

LaGrange, ILGrayhill, Inc. introduces the Touch Encoder Development Kit, which provides product development engineers simplified designs for industrial, digital audio and visual, medical, and off-highway markets. With tap, swipe, and turn functions, the Touch Encoder Development Kit can meet a wide range of interface application needs.


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SHENMAO Launches PF606-PW215 Water-Soluble Solder Paste

SAN JOSE, CA ― SHENMAO America, Inc. is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.


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500ºF ELECTRIC TOP-LOADING OVEN FROM GRIEVE

Round Lake, IL - Grieve's No. 955 is a 500ºF (~260ºC) electrically-heated, top-loading oven from Grieve, currently used for testing electronic components at the customer’s facility.  Workspace of this unit measures 312”W x 24”D x 24”H.  70KW are installed in Nichrome wire elements to heat the oven, while 8000CFM total from a series of four 2HP recirculating blowers provide horizontal rear to front airflow to the workload.  
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Fujipoly: Reinforced Thermal Film for Die-Cutting

Carteret, NJ — Sarcon® 15GTR from Fujipoly® is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fiberglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes. The material delivers a thermal conductivity of 0.9 W/mK while exhibiting a thermal resistance of .51°Cin2/W when placed between


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Rehm successfully participates in CEIA conference in China

 
 Technical lecture by Wang Yu (image: Rehm Thermal Systems) 

Blaubeurin-Seissen, Germany - Rehm Thermal Systems has expanded strongly in eastern and northern China over the past decade. The proportion of electronic component manufacturers is particularly high there, and Rehm is operating successfully. The company's many years of SMT manufacturing expertise was recently communicated by Wang Yu, Sales Director of Rehm Eastern and Northern China, at the China Electronic Intelligent Automation (CEIA) Forum in Qingdao.
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RFMW Ltd., Celebrates 15 Year Anniversary

San Jose, CA -  RFMW, Ltd. marked July 1, 2018 as the 15-year anniversary of their company. With worldwide headquarters in San Jose, CA. and sales offices throughout North America, Europe, the Middle East and Asia, the company has seen a continual acceptance of their “niche” philosophy in that “RFMW, Ltd. is a specialty electronics distribution company focused on RF and Microwave technology”. 


Joral Introduces Sensor Fusion Inclinometer for Pitch, Yaw, and Roll Feedback

Mukwonago, WI – Joral LLC announces a G-force compensated inclinometer that provides feedback for pitch, yaw, and roll. The new technology utilizes sensor fusion, which is the combining of more than one complementary sensing method. The new Joral SGAM and DGAM incline sensors take input by a gyroscope, accelerometer, and magnetometer to provide a 3-axis output for X, Y, and Z as well as new feedback for pitch, yaw, and roll.


EXACT METROLOGY HOSTS DUAL OPEN HOUSES DEMONSTRATING NEWEST PRODUCTS AND EQUIPMENT IN METROLOGY
Brookfield, WI - Exact Metrology, a comprehensive metrology services provider, held dual open houses at their Brookfield, Wisconsin location on June 21 and their Cincinnati, Ohio location on June 26, along with partner company PolyWorks -- a leading provider of universal 3D metrology software. Both companies showcased their newest products in software and hardware for 3D and CT scanning equipment.
LEMO USA, Inc. Announces New National Sales Manager, William Moore
Rohnert Park, CA — LEMO USA, Inc. (www.lemo.com), a subsidiary of LEMO SA (headquartered in Ecublens, Switzerland), announces that William Moore has accepted the position of the National Sales Manager for LEMO USA, Inc. William comes to LEMO with 25 years of knowledge and experience in technical sales management and new business development.
GlucoScanner, the painless method for glucose monitoring, has been miniaturized and it is now ready for obtaining medical certifications
GlucoScanner, the non-invasive sensor for blood glucose levels, has finally been miniaturized. The device has been developed at Dynamic Brain Labs, in their Tokyo laboratory. GlucoScanner is the only device in the world that does not require the penetration of tissues and disposable products.         
 


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