Wednesday, August 31, 2016



U.S. Tech 2017 Media Kit Now Available

In preparation for the beginning of another great year, we have finalized the U.S.Tech 2017 Media Kit. The media kit contains all the information you need to promote your company through a variety of U.S.Tech media, including the printed newspaper, the digital edition and pdf, email and our website. This year, we refined our web presence and improved our digital editions, launched a mobile version of our website and enhanced our social media platforms. We also post direct updates to our social media accounts, including Facebook, Twitter and LinkedIn, allowing us to have real-time interaction with our readers. 

CDE: Hermetically Sealed Aluminum Electrolytic Capacitor Line Expands to Higher Voltages

The world’s only hermetic aluminum electrolytic capacitor line with a glass-to-metal seal, now available up to 250 Vdc.

LIBERTY, SC - Cornell Dubilier Electronics, Inc. (CDE) has announced significantly higher voltage values for its MLSH Slimpack series of hermetically sealed aluminum electrolytic capacitors. These unique components feature a true glass-to-metal seal that prevents dry-out of the capacitor electrolyte. As a result, they provide extraordinarily long life (5,000 hours) to more than meet the most demanding applications for military and aerospace.

Cogiscan Will Exhibit at SMTAI and Discuss Track, Trace & Control: The Enabling Technology for Industry 4.0

BROMONT, CANADA - Cogiscan Inc., the leading track, trace and control solutions provider for the electronics manufacturing industry, today announced plans to exhibit in Booth #230 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The Cogiscan team will discuss the TTC platform, the enabling technology for Industry 4.0.

Adafruit DRV8871 DC Motor Driver Breakout Boards | Digi-Key Daily

New XLPE Control Cable Joins HELUKABEL Product Portfolio

TRAY X to be officially launched at International Manufacturing Technology Show

ELGIN, IL - HELUKABEL, one of the world’s leading cable manufacturers, will formally launch its latest cable product offering at the bi-annual International Manufacturing Technology Show (IMTS), one of the largest industrial trade shows in the world, being held in Chicago, IL from September 12-17.

MIRTEC to Exhibit Its Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2016

OXFORD, CT - MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.

Innovative Machine Technology: SEHO Ensures Higher Productivity at SMTAI

ERLANGER, KY - SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight the SelectLine-C selective soldering machine in Booth #623 at SMTA International, scheduled to take place Sep. 27 - 28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. SEHO continues to release new technologies to ensure higher productivity in electronic productions with flexible and innovative machines.

Technica USA & ASM to host its annual SMT Tech Forum Event

SAN JOSE, CA - Technica USA, and its SMT supply Partners will be hosting its annual SMT Tech Forum,
September 14 & 15 in San Jose CA on the topic on "Building Reliability into your SMT Process".

This year's Tech Forum is focused around the reliability of electronics PCBAs. The morning session will be held at
the Club Auto Sport Event Center where a light breakfast and lunch will be provided.

Wurth Electronics Midcom Announces New Flyback Transformers in Partnership with Dialog Semiconductor

WATERTOWN, SD - In partnership with Dialog Semiconductor, Wurth Electronics Midcom announces the new flyback transformers for iW1818 and iW1830, reference designs for AC/DC controllers. Equipped with single or dual outputs, these MID-OLDIA offline transformers offer high efficiency, low leakage inductance, and excellent EMI performance.

Industry Veteran Lung Chu Named President of SEMI China
SAN JOSE, CA - SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016. With the recent broadening ambitions for China’s indigenous semiconductor supply chain, Lung Chu joins SEMI at a critical inflection in the China market. Chu will be instrumental in evolving and repositioning SEMI’s programs, committees, products and services in China to deliver the highest member value in the rapidly changing China semiconductor ecosystem.

IPC Releases Annual Electronics Assembly Industry Quality Benchmark Study
BANNOCKBURN, IL - IPC's Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods in use as well as the percent of products subjected to these tests.

Alpha to Feature Material Set Combinations for Greatest Reliability at SMTA Guadalajara Expo
SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Guadalajara Expo to be held October 5th-6th in Guadalajara, Jal. MÉXICO.

Indium Corporation Experts to Present at IEMT–EMAP 2016
CLINTON, NY - Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.


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