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VOLUME -23 NUMBER 5
Publication Date: 05/1/2008
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Special Feature: Test and Measurement
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May 2008 Issue
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Endicott & Unimicron in Sales & Manufacturing Agreement
Organic substrate to be made in Taiwan.
Endicott, NY — Endicott Interconnect Technologies, Inc. (EI) has entered into a Sales and Manufacturing Agreement with Unimicron Technology Corp. to produce CoreEZ
organic substrates at one of Unimicron's Taiwanese facilities. Under terms of the agreement, EI, as the original design manufacturer, maintains control of the design and technical support worldwide for the CoreEZ product line.
Unimicron will provide high-volume manufacturing of CoreEZ products per EI's specifications and requirements. Sales of CoreEZ product will be handled jointly by the two companies.
CoreEZ organic substrates offer a very dense, thin core, build-up flip chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set. It is ideally suited to high speed graphics and microprocessor applications.
Contact: Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, NY 13760
866-820-4820 fax: 607-755-7000 Web:
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