HOMECURRENT ISSUEARCHIVEABOUT USSUBSCRIBEMEDIA KIT中文
Login


Electronic Mfg. Products
Search :      Thursday, November 20, 2008


U.S. Tech Part Search



Powered by


Terms Of Use

 

 

 

 

 

X-Tek: Advanced X-Ray Viewing Capabilities
Revolution X-ray system.
Tyngsboro, MA — X-Tek, a Metris company, has added a Quad View facility and dual LCD monitors to the Revolution system to enhance its viewing capabilities and user-friendly appeal. The Quad View facility allows 4 images to be displayed at once which enables a more thorough inspection of substrates and is a useful tool for image comparison for operators.

The Quad View facility is supported by dual LCD monitors that provide a means to separate X-ray images from the software control to enable clutter-free viewing.

The ability to detect defects from X-ray images using these enhanced viewing capabilities is supported by the system's magnification and imaging technologies. By allowing samples to be safely placed within 250 microns of the focal spot, the revolution can provide up to 13000x system magnification at all angles over the entire 400 x 400mm manipulator scan area. In addition, the patented X-Tek Xi "Open Tube" X-ray source is smaller than any other design and allows X-ray images of fine detail in thick and dense samples to be seen with ease.

The Revolution also has the latest digital imaging technology in the form of a NanoTech target which is capable of feature recognition to approximately 500nM. This makes it possible for operators to produce sharp images of micron level features of even the most challenging substrates. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings. The system's photography equipment incorporates a dual field image intensifier with a digital camera. This combination (Impix) provides a large field of view, high sensitivity and high dynamic range (16-bit image processing) thereby further improving the accuracy, repeatability and feature recognition capability of the Revolution. The production of high resolution images is also supported by Inspect-X, an advanced image capture and analysis software with special functions for inspection of semi-conductor package voids, wire bonding and BGA solder bumps.

Contact: Metris USA, Inc., 100 Tyngsboro Business Park, Tyngsboro, MA 01879 978-649-6333 fax: 978-649-5391 Web: http://www.metris.com

 
 
search login